Abstract: A display panel and a mobile terminal are provided. The display panel includes a flat area and a curved area. The display panel includes a panel body and a hard support layer that are stacked. The panel body includes a flat portion located in the flat area and a curved portion located in the curved area. The hard support layer includes a first bonding portion provided on one side of the flat portion and a second bonding portion provided on one side of the curved portion. A bending modulus of the second bonding portion is less than a bending modulus of the first bonding portion.

Abstract: A display device that can easily have high resolution is provided. A display device having both high display quality and high resolution is provided. A display device with high contrast is provided. A first EL film is deposited in contact with a top surface and a side surface of each of a first pixel electrode and a second pixel electrode each having a tapered shape. A first sacrificial film is formed to cover the first EL film. The first sacrificial film and the first EL film are etched to expose the second pixel electrode and form a first EL layer over the first pixel electrode and a first sacrificial layer over the first EL layer, and then, the first sacrificial layer is removed. The first EL film and the second EL film are etched by dry etching. The first sacrificial layer is removed by wet etching.

Abstract: A display panel and a display device are provided. The display panel includes a central portion having first sides and second sides alternately arranged, where each of the first sides extends in a direction away from the central portion to form a peripheral portion. The peripheral portion includes a third side and a fourth side respectively connected to both ends of a corresponding first side and extending to middle of the first side. The second side is located within a region defined by an extension line of a corresponding third side, an extension line of a corresponding fourth side, and two respective extension lines of two corresponding first sides.

Abstract: Disclosed is a liquid composition for an encapsulant of an organic light-emitting device. The liquid composition is free of a physical and chemical hygroscopic agent (getter) but includes a binder material having high hygroscopicity including an aliphatic 4-functionalized epoxy-based compound. Thus, the liquid composition for the encapsulant may be rapidly cured at low temperature and may secure excellent storage stability under a high temperature environment.

Abstract: The present disclosure relates to an organic electroluminescent compound represented by formula 1 and an organic electroluminescent device comprising the same. By comprising the organic electroluminescent compound of the present disclosure, an organic electroluminescent device having improved driving voltage, luminous efficiency, and/or lifespan characteristics can be provided.

Abstract: The present disclosure discloses an organic electroluminescent device and a preparation method thereof. The device includes a light-emitting layer, the light-emitting layer includes a host material, an auxiliary host material and a fluorescent dye; the host material is an exciplex prepared by mixing an electron donor material and an electron acceptor material, the auxiliary host material is a thermally activated delayed fluorescence material, a singlet energy level and a triplet energy level of the exciplex are higher than the single energy level and triplet energy level of the auxiliary host material. The above organic electroluminescent device can promote the reverse intersystem crossing of the host material and the auxiliary host material from the triplet excitons to the singlet excitons, enhance the Foster energy transfer, reduce the triplet exciton quenching, therefore the efficiency roll-off of the device is small and the external quantum efficiency is high.

Abstract: A method for fabricating magnetoresistive random-access memory cells (MRAM) on a substrate is provided. The substrate is formed with a magnetic tunneling junction (MTJ) layer thereon. When the MTJ layer is etched to form the MRAM cells, there may be metal components deposited on a surface of the MRAM cells and between the MRAM cells. The metal components are then removed by chemical reaction. However, the removal of the metal components may form extra substances on the substrate. A further etching process is then performed to remove the extra substances by physical etching.

Abstract: Some embodiments relate to an integrated circuit including a semiconductor substrate and an interconnect structure disposed over the semiconductor substrate. The interconnect structure includes a plurality of dielectric layers and a plurality of metal layers that are stacked over one another in alternating fashion. The plurality of metal layers include a lower metal layer and an upper metal layer disposed over the lower metal layer. A bottom electrode is disposed over and in electrical contact with the lower metal layer. A dielectric layer is disposed over an upper surface of the bottom electrode. A top electrode is disposed over an upper surface of the dielectric layer and is in direct electrical contact with a lower surface of the upper metal layer.