Abstract: A new method for the manufacture of glass films on substrates involves the flame reaction of an aerosol comprised of droplets of a solution containing all the precursors for the glass. A solution containing the precursors for all oxide components is atomized, and the resulting droplets are reacted in a flame to form spherical glass particles which are deposited on a heated substrate. By moving the substrate through the flame, a homogeneous deposit is achieved. Subsequent heat treatment in a furnace sinters the porous particle layer into a clear glass. The method has been successfully employed for the formation of sodium borosilicate glass films on silicon substrates and rare earth-doped multicomponent glass films for active devices.

Abstract: An optical switching device and method for selectively optically connecting at least one input fiber in a fiber bundle to at least one output fiber in a fiber bundle. To perform the optical switching, a light directing mechanism is provided proximate a face of a fiber bundle that contains the input fiber. The light from the input fiber is directed toward the output fibers by varying the orientation of the light directing mechanism relative the face of the fiber bundle. The light directing mechanism thereby enables the light from the input fiber to be selectively directed to each of the output fibers. By selectively controlling the orientation of the light directing mechanism, the light from the input fiber can be scanned to any number of output fibers, thereby producing a 1.times.N optical switch.

Abstract: The specification describes a fiber lightguide connector for interconnecting large arrays of lightwave fibers. Linear arrays of lightwave fibers, for example those in so-called ribbon cables, are effectively interconnected using known v-groove connector assemblies. According to the invention two or more such v-groove connector assemblies are stacked to increase the fiber capacity of a connector assembly. Attempts to stack known v-groove connector plates have encountered problems with aligning the v-groove arrays on opposite sides of the internal or intermediate plate of the stack. An alignment technique is described for assuring precise alignment between linear arrays of v-grooves on opposite sides of the interior plates of stacked linear array connectors.

Abstract: An expandable local area hub network is provided by the present invention. The network comprises a plurality of hubs coupled along a memory bus. The network further includes a segment switch coupling the plurality of hubs to a first segment arbiter and a second segment arbiter to associate the plurality of hubs with the first segment arbiter and the second segment arbiter to form separate and distinct system units. In use, the first segment arbiter grants a hub controlling access to a first segment memory bus for transmission of a packet on the first segment memory bus based upon an internal protocol and the second segment arbiter grants a hub controlling access to a second segment memory bus for transmission of a packet on the second segment memory bus based upon an internal protocol.

Abstract: A heterojunction bipolar transistor in an integrated circuit has intrinsic and extrinsic base portions. The intrinsic base portion substantially comprises epitaxial silicon-germanium alloy. The extrinsic base portion substantially comprises polycrystalline material, and contains a distribution of ion-implanted impurities. An emitter overlies the intrinsic base portion, and a spacer at least partially overlies the emitter. The spacer overhangs the extrinsic base portion by at least a distance characteristic of lateral straggle of the ion-implanted impurities.

Abstract: The linewidth in patterns produced by etching copper layers is more easily maintained using a specific etching medium. In particular, this medium includes aqueous hydrofluoric acid, copper chloride, and an additional chloride salt. The etching medium is also particularly useful for bilayer metal constructions such as the copper/titanium structure found in many multichip modules.

Abstract: In external modulation, chirp is reduced by modulating a laser light beam during a modulation period to maintain-light returning to the laser substantially constant. Variations in at least one of the magnitude and phase of light returning to the laser from an external modulator are reduced during the modulation period. An external modulator divides and modulates the light in parallel along separate optical paths. Driving voltages are applied to modulators in each of the optical paths based on first and second parameters. The first driving parameter represents an intensity modulation. The second driving parameter varies depending upon the value of the first driving parameter during modulation to maintain the light returning to the laser substantially constant throughout the modulation period.

Abstract: Patient disease is diagnosed and/or treated using electronic data communications between not only the physician and his/her patient, but via the use of electronic data communications between the physician and one or more entities which can contribute to the patient's diagnosis and/or treatment, such electronic data communications including information that was priorly received electronically from the patient and/or was developed as a consequence of an electronic messaging interaction that occurred between the patient and the physician. Such other entities illustratively include a medical diagnostic center and an epidemiological database computer facility which collects epidemiological transaction records from physicians, hospitals and other institutions which have medical facilities, such as schools and large businesses.

Abstract: X-ray masks are typically made by depositing and patterning a layer of heavy metal on a thin supporting membrane. The metal layer must have a relatively low and uniform stress to prevent stress-induced deformation of the pattern. Tungsten films having excellent stress characteristics are produced by employing a continuously operating capacitance-based measurement technique to allow adjustment of the deposition conditions in rapid response to changes in stress of the film being deposited. The stress gradients in the film are further reduced by transferring heat from the membrane as the metal is deposited thereon.

Abstract: A technique is described for the preparation of conjugated arylene and heteroarylene vinylene polymers by thermal conversion of a polymer precursor prepared by reacting an aromatic ring structure with an aqueous solution of an alkyl xanthic acid potassium salt. In this processing sequence the xanthate group acts as a leaving group and permits the formation of a prepolymer which is soluble in common organic solvents. Conversion of the prepolymer is effected at a temperature ranging from 150.degree.-250.degree. C. in the presence of forming gas. Studies have shown that electroluminescent devices prepared in accordance with the described technique evidence internal quantum efficiencies superior to those of the prior art due to the presence of pinhole free films and therefore permit the fabrication of larger area LED's than those prepared by conventional techniques.

Abstract: Recognizing the rate-determining nature of the coating removal and recoating steps, applicants have demonstrated that with proper combination of low absorbing polymer, glass and low intensity radiation, UV-induced gratings can be side-written into polymer coated fibers without removing the polymer, thus permitting up the possibility of high speed fabrication of fiber gratings.

Abstract: The thermal resistivities W.sub.s (=1/.kappa..sub.s) of electrically insulating, crystalline or polycrystalline samples under test (SUTs), all comprising host material such as CVD diamond, can be determined rather quickly once the thermal resistivities W=1/.kappa. of at least two other host crystalline or polycrystalline bodies B.sub.1 and B.sub.2 comprising the same host material as that of the SUTs, and containing the same type of impurity or combination of impurities as the SUTs, are measured by some other technique. These determinations of these thermal resistivities W.sub.s of the SUTs thus require only the measurements of the optical absorptivities .alpha..sub.1 and .alpha..sub.2 and of the thermal resistivities W.sub.1 and W.sub.2, respectively, of at least each of the two other bodies B.sub.1 and B.sub.2 and only of the optical absorptivities .alpha..sub.s of each of the SUTs by such other technique. These determinations of W.sub.

Abstract: A closed alignment sleeve has three lands equally spaced on the inside surface of the sleeve. When a ferrule is inserted into the sleeve, the interference at the three lands causes the walls of the sleeve to bend to accommodate the ferrule. In this manner, the closed alignment sleeve with three lands has a stiffness attained by the mechanism normally associated with the open sleeve. The closed alignment sleeve is symmetrical and the three lands act to center the ferrule within the sleeve. The sleeve is formed from a thermoplastic which is much less expensive and much more compliant than conventional ceramic and which allows the sleeve to deform to the size of the ferrule. Further, the envelope required to contain the sleeve is small enough to fit within a variety of optical connectors, including the SC connector.

Abstract: In digital radio communication systems such as FDMA/TDMA digital cellular mobile radio systems, in which a number of radio base stations communicate with a number of mobile radio stations, frequency hopping is used to combat fading. That requires that data bursts be routed between the transceivers (RFU1, RFU2, . . . , RFUn) and the transceiver controllers (RCC1, RCC2, . . . , RCCn) in a radio base station according to a frequency hopping algorithm. Such routing has heretofore been done by transporting the data bursts over a bus which serves as a common distribution medium between the transceivers and the transceiver controllers. In order to achieve a more fault tolerant system, instead of a bus the invention uses as a common distribution medium point-to-multipoint links (RXL1, RXL2, . . . , RXLn; TXL1, TXL2, . . .

Abstract: The thickness uniformity of a plated metal layer inside a via hole can be enhanced by intersecting a conductive via with an insulating aperture before plating. The new via configuration improves the mass transfer of the plating. It is believed that the apertures lower the local solution ohmic resistance near the via holes. The method can be applied to the manufacture of a wide variety of circuit boards.

Abstract: A thin conformal passivating dielectric film is deposited by ECR-CVD on an IC chip comprising semiconductor devices each of which includes a sub-micron-width irregularly shaped gate electrode. A protective layer of patterned resist is formed overlying each passivated device. Additional dielectric material is then deposited by ECP-CVD, at a temperature below the glass transition temperature of the resist, on the surface of the chip. Subsequently, in a lift-off step, the patterned resist together with the additional dielectric material overlying the resist is removed from the chip.

Abstract: In the manufacture of semiconductor integrated circuit devices, semiconductor regions such as, e.g., doped regions or tubs are separated by an etched trench which is self-aligned with respect to such regions on account of the presence of an etch-resistant layer overlying the regions during etching. In accordance with preferred processing of the invention a first layer is formed alongside the trench to be etched, a spacer second layer is formed alongside the edge of the first layer, and a third layer is formed abutting the spacer. The spacer is etched away while first and third layers remain in place, and the trench is etched in the space between the first and third layers. A preferred etchant comprises CF.sub.3 Br and oxygen.

Abstract: An integrated circuit includes a gain control terminal that provides for a choice of discrete gain values for circuitry on the IC. Typically, the gain control terminal is connected to a high voltage source (V.sub.DD), or a low voltage source (V.sub.SS), or optionally left unconnected. In addition, the integrated circuit provides a gain set terminal for connection to an external impedance, typically a resistor, and also includes gain set circuitry for determining the value of the resistor as falling within one range out of several possible ranges. Based upon the range thus determined, the gain set circuitry selects the discrete gain values that are available for choice by the gain control terminal. In this manner, a large range of gain values are available for use even though only a few need to be selected in actual operation of the IC. This technique minimizes external package terminals for the IC, and allows for gain setting by low tolerance resistors.

Abstract: During formation of solder bumps on the bonding pads of a component, a two-layer dam structure is utilized to block solder from flowing from the pads to adjacent portions of a metallization pattern. After the solder bumps are formed, the top dam layer is dissolved, whereby any solder debris present on the top dam layer is also removed from the structure. The bottom dam layer, which remains intact during the removal step, serves to confine solder movement during a subsequent bonding operation in which the solder bumps are reflowed to cause them to adhere to aligned pads on another component.

Abstract: A computer trackball comprises a transparent outer sphere inside of which is disposed a second inner sphere. The outer diameter of the inner sphere is a little bit smaller than the inner diameter of the outer sphere. Disposed on the outer surface of the inner sphere, at one "end" thereof is a logo or other graphical image. The inner sphere tends to maintain itself in a predetermined orientation--e.g., with the graphical image pointing directly "up" relative to the keyboard or other housing fin which the trackball is held--notwithstanding rotation of the outer sphere by a user in the course of operating the trackball.