Abstract: The present disclosure relates to a semiconductor light emitting device and a method for manufacturing the same. The semiconductor light emitting device comprises: one or more light emitting units, each including a first semiconductor layer, an active layer and a second semiconductor layer sequentially formed on a growth substrate; an electrode unit including a first semiconductor layer having a first conductivity and a metal layer formed on the first semiconductor layer; and one or more bonding layers for electrically connecting to the light emitting units and electrode unit, respectively, wherein each bonding layer has a first region on which the light emitting units and the electrode unit are arranged, and a second region having a larger planar area than that of the first region and being electrically connected to an external substrate.

Abstract: The present disclosure relate to a semiconductor light emitting device and a method for manufacturing the same. The semiconductor light emitting device comprises a semiconductor light emitting chip, and first electrodes electrically connected to the semiconductor light emitting chip, with the first electrodes each having a planar area larger than that of the semiconductor light emitting chip, wherein lower surfaces of the first electrodes are exposed externally, and an insulating material is filled in-between inner lateral surfaces of the first electrodes.

Abstract: A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips.

Abstract: A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips.

Abstract: A surface light source module includes a substrate, a plurality of light-emitting elements mounted on the substrate, a first optical layer disposed on the light-emitting elements to cover the light-emitting elements and configured to disperse light emitted from the light-emitting elements, and a second optical layer disposed on the first optical layer and configured to absorb the light emitted from the light-emitting elements and emit light of a different wavelength band from a wavelength of the absorbed light, wherein a distance from an upper surface of the first optical layer to an upper surface of the second optical layer has a value less than a distance from an upper surface of the substrate to the upper surface of the first optical layer.

Abstract: Provided is a backlight unit including: a substrate; a plurality of light-emitting devices mounted on the substrate; and an optical sheet disposed above the light-emitting devices, wherein the optical sheet is in contact with a light-emitting surface of at least one light-emitting device via one surface thereof, and emits light of the light-emitting device incident on one surface thereof to the other surface facing the one surface, while refracting or dispersing the light in a direction different from a direction in which the light is incident due to an optical pattern formed therein.

Abstract: A surface light source module includes a substrate, a plurality of light-emitting elements mounted on the substrate, a first optical layer disposed on the light-emitting elements to cover the light-emitting elements and configured to disperse light emitted from the light-emitting elements, and a second optical layer disposed on the first optical layer and configured to absorb the light emitted from the light-emitting elements and emit light of a different wavelength band from a wavelength of the absorbed light, wherein a distance from an upper surface of the first optical layer to an upper surface of the second optical layer has a value less than a distance from an upper surface of the substrate to the upper surface of the first optical layer.

Abstract: Provided is a backlight unit including: a substrate; a plurality of light-emitting devices mounted on the substrate; and an optical sheet disposed above the light-emitting devices, wherein the optical sheet is in contact with a light-emitting surface of at least one light-emitting device via one surface thereof, and emits light of the light-emitting device incident on one surface thereof to the other surface facing the one surface, while refracting or dispersing the light in a direction different from a direction in which the light is incident due to an optical pattern formed therein.

Abstract: A light-emitting device package includes a frame including one side on which a first electrode is formed and the other side on which a second electrode is formed, an LED chip including a first conductive connection pad electrically connected to the first electrode and a second conductive connection pad electrically connected to the second electrode, a reflective member disposed on the frame, forming a cavity for accommodating the LED chip therein, and reflecting light emitted from the LED chip, and a wavelength conversion member filled in the cavity to cover the LED chip, wherein the reflective member includes a first side and a second side different from the first side, and a first height of the first side and a second height of the second side are formed to be different from each other.

Abstract: A light-emitting device package includes an LED chip including a substrate having an upper surface, a semiconductor laminate structure formed under the substrate, and a first conductive connection pad and a second conductive connection pad formed under the semiconductor laminate structure, a wavelength conversion member having one surface in contact with the upper surface of the substrate, a light transmitting member covering a side surface of the LED chip and one surface of the wavelength conversion member adjacent to the side surface, and a reflector including at least one first region covering a side surface of the wavelength conversion member and the light transmitting member, and at least one second region covering the light transmitting member and exposing the side surface of the wavelength conversion member.

Abstract: A flexible surface lighting device is disclosed. The flexible surface lighting device includes: a flexible substrate including an upper insulating film, a lower insulating film, and a thin metal layer interposed between the upper and lower insulating films; a plurality of micro-LED chips two-dimensionally arrayed on the top surface of the flexible substrate; and a flexible light-transmitting resin part disposed on the top surface of the flexible substrate to cover the top and side surfaces of the micro-LED chips. The flexible substrate includes a white reflective layer in contact with the light-transmitting resin part on the upper insulating film.

Abstract: Provided is a method of manufacturing a micro LED panel, the method including preparing a backplane; forming a plurality of micro LED cells in a matrix shape on a bottom portion of a growth substrate; bonding the micro LED cells to the backplane; separating the growth substrate from the micro LED cells; and disposing a partitioning wall structure on top portions of the micro LED cells, wherein the partitioning wall structure includes a light-transmitting member having a first surface facing light-emitting surfaces of the micro LED cells and a second surface facing the first surface, the light-transmitting member includes a plurality of first grooves formed to correspond in between the plurality of micro LED cells on any one of the first surface and the second surface, and the plurality of first grooves are filled with a partitioning wall composition to form partitioning walls.

Abstract: A method of manufacturing a chip scale light-emitting diode package is provided. The method of manufacturing chip scale light-emitting diode package includes: manufacturing a lens molding sheet including intaglios on one surface thereof; forming a lens layer having lens portions on one surface thereof and a flat surface on a surface opposite thereto by applying a light-transmitting resin to the intaglios; forming an adhesive layer on the flat surface of the lens layer; arranging light-emitting diode chips, each having a first surface and a second surface opposite to the first surface, on the adhesive layer in such a way that the light-emitting diode chips correspond to the lens portions and the second surface is attached to the adhesive layer, wherein a first electrode pad and a second electrode pad are formed on the first surface; and manufacturing a chip array sheet by forming a molding part on the adhesive layer to cover outer surfaces of the light-emitting diode chips.

Abstract: An LED pixel device is disclosed. The LED pixel device includes a first light-transmitting substrate, a second light-transmitting substrate overlying the first light-transmitting substrate, a third light-transmitting substrate overlying the second light-transmitting substrate, a first light-emitting cell underlying the first light-transmitting substrate, a second light-emitting cell interposed between the first light-transmitting substrate and the second light-transmitting substrate, and a third light-emitting cell interposed between the second light-transmitting substrate and the third light-transmitting substrate. The first light-emitting cell, the second light-emitting cell, and the third light-emitting cell emit light of different wavelengths.

Abstract: Disclosed is an LED display panel including inner LED display modules and outer LED display modules. Each of the inner LED display modules and the outer LED display modules includes a first flexible circuit board and a second flexible circuit board arrayed in a row in the lengthwise direction and on which LEDs are arrayed, and an upper viscoelastic film and a lower viscoelastic film bonded to each other through the first flexible circuit board and the second flexible circuit board. Each of the first flexible circuit board and the second flexible circuit board includes a folded edge portion and an unfolded edge portion opposite to the folded edge portion. A controller unit is disposed under the folded edge portion to control the LEDs. The folded edge portion of the first flexible circuit board faces the folded edge portion of the second flexible circuit board in each of the inner LED display modules.

Abstract: The present invention relates to an apparatus and a method for manufacturing a light-emitting diode (LED) module and, more particularly, to an apparatus and a method for manufacturing a light-emitting diode module, which are capable of manufacturing a light emitting diode module on which a plurality of light-emitting diodes are mounted with an improved bonding speed and high accuracy by manufacturing the light-emitting diode module by simultaneously transferring the plurality of light emitting diodes onto a substrate by using a multi-eject pin or a multi-collet.

Abstract: The present invention relates to a micro Light Emitting Diode (LED) matrix array package, including: a plurality of light emitting devices including a base substrate and a semiconductor laminated layer formed on the base substrate; a plurality of solder balls formed on the semiconductor laminated layer of the plurality of light emitting devices, respectively; a molding member configured to surround the light emitting devices and the solder balls; and a circuit board formed on the molding member, in which upper surfaces of the solder balls are exposed from the molding member, the circuit board includes a contact layer consisted of a metal pattern layer electrically connected with the plurality of solder balls exposed from the molding member and an insulating layer adjacently disposed to the metal pattern layer, and a thickness from the base substrate of each of the plurality of light emitting devices to an upper surface of each of the exposed solder balls is the same each other.

Abstract: A multi-pixel LED package is disclosed. The multi-pixel LED package includes: n pixel groups (where n is a natural number equal to or greater than 2), each of which includes a plurality of pixels, each of which includes a first LED chip, a second LED chip, and a third LED chip; and a substrate on which the n pixel groups are arrayed.

Abstract: A surface light source slim module mounted to a vehicle includes: a substrate; a plurality of packages; a first reflective layer formed on top of the substrate and having a plurality of holes; a molding member, which is formed on top of the first reflective layer, covers the plurality of packages and the first reflective layer, and includes a front portion through which light is output and a rear portion facing the front portion; and a second reflective layer formed on top of the molding member.

Abstract: An LED display module is disclosed. The LED display module includes: a micro-LED array including a plurality of pixel units arrayed in a matrix with rows and columns, each of the pixel units including a red LED, a green LED, and a blue LED; a substrate including a top layer on which the pixel units are mounted, a first layer located under the top layer, and a second layer located under the first layer; and pairs of electrode pads disposed on the substrate and to which first electrodes and second electrodes of the LEDs of the pixel units are connected. The distances between peripheral portions of the paired electrode pads are longer than the distances between central portions thereof.