Abstract: Disclosed is a micro light emitting diode (LED) display device which is capable of implementing a full color of high resolution, the micro LED display device including: a micro LED driving substrate (backplane) in which a plurality of CMOS cells is arranged in rows and columns; and a micro LED panel which is flip-chip bonded onto the micro LED driving substrate, and includes a plurality of micro LED pixels electrically connected with the plurality of CMOS cells, in which the micro LED panel includes the plurality of micro LED pixels formed by etching a first surface of an emission structure along a unit pixel region, and a plurality of separators formed on a second surface of the emission structure corresponding to positions of portions formed by etching the emission structure in a vertical direction.

Abstract: The present invention relates to an apparatus and a method for manufacturing a light-emitting diode (LED) module and, more particularly, to an apparatus and a method for manufacturing a light-emitting diode module, which are capable of manufacturing a light emitting diode module on which a plurality of light-emitting diodes are mounted with an improved bonding speed and high accuracy by manufacturing the light-emitting diode module by simultaneously transferring the plurality of light emitting diodes onto a substrate by using a multi-eject pin or a multi-collet.

Abstract: An LED pixel device is disclosed. The LED pixel device includes a first light-transmitting substrate, a second light-transmitting substrate overlying the first light-transmitting substrate, a third light-transmitting substrate overlying the second light-transmitting substrate, a first light-emitting cell underlying the first light-transmitting substrate, a second light-emitting cell interposed between the first light-transmitting substrate and the second light-transmitting substrate, and a third light-emitting cell interposed between the second light-transmitting substrate and the third light-transmitting substrate. The first light-emitting cell, the second light-emitting cell, and the third light-emitting cell emit light of different wavelengths.

Abstract: A method for arraying micro-LED chips is disclosed. The method includes preparing a chip carrier formed with a plurality of chip pockets whose internal pressure is reduced through a plurality of suction holes, capturing the micro-LED chips in the corresponding chip pockets such that the micro-LED chips are in close contact with the bottoms of the chip pockets, and placing the micro-LED chips captured in the chip pockets on a base body. Each of the chip pockets includes a slope through which an inlet having a larger width than the bottom is connected to the bottom. The distances between the centers of the adjacent micro-LED chips placed on the base body are the same as those between the centers of the corresponding chip pockets.

Abstract: An LED display module is disclosed. The LED display module includes: a micro-LED array including a plurality of pixel units arrayed in a matrix with rows and columns, each of the pixel units including a red LED, a green LED, and a blue LED; a substrate including a top layer on which the pixel units are mounted, a first layer located under the top layer, and a second layer located under the first layer; and pairs of electrode pads disposed on the substrate and to which first electrodes and second electrodes of the LEDs of the pixel units are connected. The distances between peripheral portions of the paired electrode pads are longer than the distances between central portions thereof.

Abstract: An LED package is disclosed. The LED package includes: a metal reflector having a cavity formed therein; an LED chip arranged on the bottom of the cavity of the reflector; a wavelength converting panel including a lower glass plate, an upper glass plate, and a wavelength converting sheet interposed between the lower glass plate and the upper glass plate and arranged on the cavity of the reflector; and a sealing member disposed on the side surface of the lower glass plate and the side surface of the upper glass plate and connecting the wavelength converting panel to the reflector.

Abstract: Disclosed is a method for manufacturing a chip scale package (CSP) for a light-emitting diode (LED). The method may include a light-emitting device mounting step for mounting a plurality of light-emitting devices on a substrate strip, a phosphor forming step for forming a phosphor on the plurality of light-emitting devices, a reflective member forming step for forming a reflective member on the substrate strip to surround the phosphor, and a package singulation step for singulating unit packages by cutting the substrate strip and the reflective member.

Abstract: A display apparatus is disclosed. The display apparatus includes: at least one LED display unit including a plurality of LED display panels outputting image lights; a light guide unit including a plurality of in-coupling zones where the image lights are received and a single out-coupling zone to which the received image lights are guided; a plurality of in-coupling holographic optical elements (HOEs) arranged in the in-coupling zones to define the propagation path of the image lights through the light guide unit; and a plurality of out-coupling HOEs arranged in the out-coupling zone to define a path through which the image lights guided through the light guide unit are sent outside the light guide unit.

Abstract: A multi-pixel LED package is disclosed. The multi-pixel LED package includes: n pixel groups (where n is a natural number equal to or greater than 2), each of which includes a plurality of pixels, each of which includes a first LED chip, a second LED chip, and a third LED chip; and a substrate on which the n pixel groups are arrayed.

Abstract: Disclosed is an LED display panel including inner LED display modules and outer LED display modules. Each of the inner LED display modules and the outer LED display modules includes a first flexible circuit board and a second flexible circuit board arrayed in a row in the lengthwise direction and on which LEDs are arrayed, and an upper viscoelastic film and a lower viscoelastic film bonded to each other through the first flexible circuit board and the second flexible circuit board. Each of the first flexible circuit board and the second flexible circuit board includes a folded edge portion and an unfolded edge portion opposite to the folded edge portion. A controller unit is disposed under the folded edge portion to control the LEDs. The folded edge portion of the first flexible circuit board faces the folded edge portion of the second flexible circuit board in each of the inner LED display modules.

Abstract: An LED module is disclosed. The LED module includes: a mount substrate including electrodes; an LED chip including a semiconductor stacked structure, a passivation layer covering the outer surface of the semiconductor stacked structure, and electrode pads connected to the outer surface of the semiconductor stacked structure through openings formed in the passivation layer; and solder bumps connecting the electrode pads to the corresponding electrodes and formed using a solder material represented by Sn-M (where M is a metal).

Abstract: An LED package is disclosed. The LED package includes: a base including a chip mounting surface; an LED chip including a central axis line perpendicular to the chip mounting surface; a total internal reflection (TIR) lens having a refractive index higher than that of a medium covering the upper and side surfaces of the LED chip and including entrance planes bordering the medium and exit planes from which light entering through the entrance planes is emitted; and a reflector coupled to the TIR lens. The entrance planes include main entrance planes having one or more radii of curvature and protruding toward the LED chip and a pair of lateral entrance planes connected to the main entrance planes at the edges of the main entrance planes and extending downward from the main entrance planes.

Abstract: Disclosed is a micro light emitting diode (LED) display device which is capable of implementing a full color of high resolution, the micro LED display device including: a micro LED driving substrate (backplane) in which a plurality of CMOS cells is arranged in rows and columns; and a micro LED panel which is flip-chip bonded onto the micro LED driving substrate, and includes a plurality of micro LED pixels electrically connected with the plurality of CMOS cells, in which the micro LED panel includes the plurality of micro LED pixels formed by etching a first surface of an emission structure along a unit pixel region, and a plurality of separators formed on a second surface of the emission structure corresponding to positions of portions formed by etching the emission structure in a vertical direction.

Abstract: An LED panel is disclosed. The LED panel includes LED chips and a mount substrate on which the LED chips are mounted by flip bonding. Each of the LED chips includes a sapphire substrate, a plurality of light emitting cells disposed below the sapphire substrate, and an etched portion formed between the plurality of light emitting cells. Each of the LED chips includes a plurality of color cells formed corresponding to the plurality of light emitting cells on the sapphire substrate to change or maintain the color of light from the corresponding light emitting cells and a plurality of light collecting portions formed corresponding to the plurality of light emitting cells and the plurality of color cells on the bottom surface of the substrate and adapted to collect light from the corresponding light emitting cells on the corresponding color cells.

Abstract: Disclosed is a light emitting device having a configuration that, when a magnitude of an input voltage is greater than a minimum light emitting voltage, all light emitting devices are turned on regardless of the magnitude of the voltage. As the magnitude of the voltage is smaller, the light emitting devices are connected in parallel. As the magnitude of the voltage is greater, the light emitting devices are serially connected.

Abstract: Disclosed is a method for fabricating an LED module. The method includes: constructing a chip-on-carrier including a chip retainer having a horizontal bonding plane and a plurality of LED chips in which electrode pads are bonded to the bonding plane of the chip retainer; and transferring the plurality of LED chips in a predetermined arrangement from the chip retainer to a substrate by transfer printing. The transfer printing includes: primarily section-wise exposing a transfer tape to reduce the adhesive strength of the transfer tape such that bonding areas are formed at predetermined intervals on the transfer tape; and pressurizing the transfer tape against the LED chips on the chip retainer to attach the LED chips to the corresponding bonding areas of the transfer tape and detaching the electrode pads of the LED chips from the chip retainer to pick up the chips.

Abstract: A light emitting element is disclosed. The light emitting element includes: an LED chip including a light emitting semiconductor stack and first and second electrode pads disposed under the light emitting semiconductor stack and spaced apart from each other; a substrate mounted with the LED chip and including a first electrode corresponding to the first electrode pad and a second electrode corresponding to the second electrode pad; a first solder portion connecting the first electrode pad and the first electrode; and a second solder portion connecting the second electrode pad and the second electrode. The first solder portion and the second solder portion are formed without escaping from the mounting area of the LED chip on the substrate by heating a solder material to its melting point or above with an IR laser.

Abstract: A display device is disclosed. The display device includes: a liquid crystal panel including color filters; and a backlight unit including a light guide plate arranged in rear of the liquid crystal panel and a bar-type LED module arranged at one side of the light guide plate to supply backlight to the one side of the light guide plate.

Abstract: Disclosed is a light emitting diode comprising; a substrate having a front side and a back side; a first conductive type semiconductor layer having a front side and a back side, and formed on the back side of the substrate; a second conductive type semiconductor layer having a front side and a back side, and formed on the back side of the first conductive type semiconductor layer; an active layer having a short wavelength band of 315 to 420 nm, and formed between the back side the first conductive type semiconductor layer and the front side of the second conductive type semiconductor layer; a plurality DBR unit layers having a front side and a back side, and comprising a low refractive index layer and a high refractive index layer adjacent to the low refractive index layer; and a metal reflective layer having a front side and a back side, and formed on the back side of the plurality DBR unit layers, wherein an intermediate layer for improving ohmic contact, and formed between the back side of the plurality DB

Abstract: An LED display module is disclosed. The LED display module includes: a micro-LED array including a plurality of pixel units arrayed in a matrix with rows and columns, each of the pixel units including a red LED, a green LED, and a blue LED; a substrate including a top layer on which the pixel units are mounted, a first layer located under the top layer, and a second layer located under the first layer; and pairs of electrode pads disposed on the substrate and to which first electrodes and second electrodes of the LEDs of the pixel units are connected. The distances between peripheral portions of the paired electrode pads are longer than the distances between central portions thereof.