Patents Assigned to Lumentum Operations LLC
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Patent number: 11075695Abstract: High power, high speed VCSEL arrays are employed in unique configurations of arrays and sub-arrays. Placement of a VCSEL array behind a lens allows spatial separation and directivity. Diffusion may be employed to increase alignment tolerance. Intensity modulation may be performed by operating groups of VCSEL emitters at maximum bias. Optical communications networks with high bandwidth may employ angular, spatial, and/or wavelength multiplexing. A variety of network topologies and bandwidths suitable for the data center may be implemented. Eye safe networks may employ VCSEL emitters may be paired with optical elements to reduce optical power density to eye safe levels.Type: GrantFiled: April 3, 2020Date of Patent: July 27, 2021Assignee: Lumentum Operations LLCInventors: John R. Joseph, Kevin L. Lear, David Abell
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Patent number: 11056803Abstract: An optical device may include an optic disposed in an optical path. The optical device may include a mount to dispose the optic in the optical path. The optical device may include a plurality of spring clamps to attach the optic to the mount. The spring clamp, of the plurality of spring clamps, may include a body, a spring, and a screw. The screw may be to attach to the mount and to compress the spring. The spring may be to dispose a leading edge of the body against the optic. The spring clamp may be to maintain the optic in the optical path for a thermal cycle of at least between approximately ?50° C. and approximately 130° C.Type: GrantFiled: September 12, 2017Date of Patent: July 6, 2021Assignee: Lumentum Operations LLCInventors: Yong Yin, Bryed Billerbeck, Felix Brunner, Yves Netzer
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Patent number: 11048042Abstract: A photonic integrated circuit may include a substrate and an optical waveguide integrated with the substrate. The optical waveguide may include a bend section, wherein a bend shape of the bend section is defined by a curvature function to suppress waveguide mode conversion.Type: GrantFiled: December 30, 2019Date of Patent: June 29, 2021Assignee: Lumentum Operations LLCInventors: Shibnath Pathak, Konstantin Petrovich Petrov, Brian Daniel, Hossein Hodaei, Michael C. Larson, Amit Mizrahi
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Patent number: 11040514Abstract: A component assembly includes a first component, such as an optical component, and a second component, such as a support component, having different coefficients of thermal expansion (CTEs). The component assembly also includes a spacer having a CTE matched to that of the first component, disposed between the first component and the second component. When the CTE of the first component is greater than that of the second component, the second component includes a protrusion, and the spacer includes a complementary opening for receiving the protrusion, such that a joint between the protrusion and the complementary opening is under compressive stress. The spacer also includes a mounting area for receiving the first component, and an air gap disposed between the first component and the protrusion.Type: GrantFiled: May 22, 2017Date of Patent: June 22, 2021Assignee: Lumentum Operations LLCInventor: Abdul Jaleel K. Moidu
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Patent number: 11038320Abstract: A semiconductor layer structure may include a substrate, a buffer layer formed on the substrate, and a set of epitaxial layers formed on the buffer layer. The buffer layer may have a thickness that is greater than 2 micrometers (?m). The set of epitaxial layers may include a quantum well layer. A quantum well intermixing region may be formed in association with the quantum well layer and a material diffused from a region of a surface of the semiconductor layer structure.Type: GrantFiled: May 28, 2019Date of Patent: June 15, 2021Assignee: Lumentum Operations LLCInventor: Li Fan
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Patent number: 11029467Abstract: A method may include performing an active alignment to enable optical coupling between a first optical fiber and a second optical fiber via an imaging structure. An end of the first optical fiber may be at a first location on a first surface of the imaging structure. The first location may be a first transverse offset distance from an axis of the imaging structure. An end of the second optical fiber may be at a second location of the first surface of the imaging structure. The second location may be a second transverse offset distance from the axis of the imaging structure. The method may include fusion splicing the end of the first optical fiber at the first location on the first surface of the imaging structure, and fusion splicing the end of the second optical fiber at the second location on the first surface of the imaging structure.Type: GrantFiled: September 30, 2019Date of Patent: June 8, 2021Assignee: Lumentum Operations LLCInventors: Martin H. Muendel, Richard D. Faulhaber, James Lefort, James J. Morehead, Vincent Petit, Simonette Pierrot, Kyle R. Schneider
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Patent number: 11022724Abstract: Systems, methods, and devices disclosed herein relate to optical assemblies for spatial multiplexing, multi-zone illumination, and optical assemblies. In embodiments, light source arrays are aligned with one or more micro-lens assemblies to generate a specific field of illumination. In embodiments, surface-emitting light sources may be light-emitting diodes and/or surface-emitting lasers. The micro-lens array may be aligned with the light source arrays, on-axis or off-axis to a principal axis of corresponding lenses such that the light sources may be expanded to a desired divergence and field of illumination. In embodiments, multiple light sources may be combined to increase power output for a specific area of the field of illumination, and light sources may be driven independently depending on intended illumination.Type: GrantFiled: March 24, 2020Date of Patent: June 1, 2021Assignee: Lumentum Operations LLCInventors: Richard F. Carson, Preethi Dacha, Mial E. Warren
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Patent number: 11016227Abstract: A diffractive optical element may include sub-wavelength period stack-and-gap structured layers providing transmissive phase delay at a wavelength. The sub-wavelength period stack-and-gap structured layers may include a set of thin anti-reflection layers that are index matched to an environment or a substrate over a range of fill factors of the sub-wavelength period.Type: GrantFiled: July 19, 2018Date of Patent: May 25, 2021Assignee: Lumentum Operations LLCInventors: John Michael Miller, Stephen Bagnald
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Patent number: 10992109Abstract: A device includes a substrate, a first vertical cavity surface emitting laser (VCSEL) array on the substrate, a second VCSEL array on the substrate and adjacent to the first VCSEL array, and an isolation structure between the first VCSEL array and the second VCSEL array. The isolation structure provides electrical isolation between the first VCSEL array and the second VCSEL array.Type: GrantFiled: July 19, 2019Date of Patent: April 27, 2021Assignee: Lumentum Operations LLCInventor: Albert Yuen
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Patent number: 10962727Abstract: An optical fiber heat exchanger includes an outer body and an inner body inserted into the outer body. The inner body includes a plurality of guide walls to guide a cooling liquid through the optical fiber heat exchanger to exchange heat from an optical fiber inserted in the optical fiber heat exchanger, a first set of parallel straight channels, extending along an inlet portion of the inner body, formed by a first subset of the plurality of guide walls, a set of U-shaped channels, extending through a transition section of the inner body, formed by a second subset of the plurality of guide walls, and a second set of parallel straight channels, extending along an outlet portion of the inner body, formed by a third subset of the plurality of guide walls.Type: GrantFiled: November 19, 2019Date of Patent: March 30, 2021Assignee: Lumentum Operations LLCInventors: Yiduo Zhang, Gilberto Madrid, Titus Whitehead, Martin H. Muendel
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Patent number: 10962726Abstract: A fiber attachment structure may comprise a monolithic platform structure having a first trench and a second trench to segment the monolithic platform structure into a chip mount area, a first island, and a second island. A laser chip may be mounted directly on the chip mount area and an optical fiber may be mounted on the first island by a first adhesive joint and on the second island by a second adhesive joint. For example, in some implementations, the first adhesive joint may include a first quantity of adhesive material attaching the optical fiber to the first island at a position at which a tip of the optical fiber is aligned with an output facet of the laser chip, and the second adhesive joint may include a second quantity of the adhesive material to mechanically secure the optical fiber to the second island.Type: GrantFiled: December 2, 2019Date of Patent: March 30, 2021Assignee: Lumentum Operations LLCInventors: Frank Wu, Prasad Yalamanchili, Raman Srinivasan, Huijie Xu
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Patent number: 10955628Abstract: An optical transceiver may include a housing including a surface cutout. The surface cutout may be for receiving a locking tang from a cage and for being disengaged by a slide from an unlocking tool wherein the surface cutout is disposed on the housing at a position such that the surface cutout is entirely within the cage with respect to an electromagnetic interference (EMI) gasket of the cage when the optical transceiver is inserted into the cage.Type: GrantFiled: June 26, 2019Date of Patent: March 23, 2021Assignee: Lumentum Operations LLCInventors: Georges Turcotte, Adonios Bitzanis
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Patent number: 10944242Abstract: A VCSEL/VECSEL array design is disclosed that results in arrays that can be directly soldered to a PCB using conventional surface-mount assembly and soldering techniques for mass production. The completed VCSEL array does not need a separate package and no precision sub-mount and flip-chip bonding processes are required. The design allows for on-wafer probing of the completed arrays prior to singulation of the die from the wafer. Embodiments relate to semiconductor devices, and more particularly to multibeam arrays of semiconductor lasers for high power and high frequency applications and methods of making and using the same.Type: GrantFiled: August 13, 2018Date of Patent: March 9, 2021Assignee: Lumentum Operations LLCInventors: Richard F. Carson, Nein-Yi Li, Mial E. Warren
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Patent number: 10938476Abstract: High power, high speed VCSEL arrays are employed in unique configurations of arrays and sub-arrays. Placement of a VCSEL array behind a lens allows spatial separation and directivity. Diffusion may be employed to increase alignment tolerance. Intensity modulation may be performed by operating groups of VCSEL emitters at maximum bias. Optical communications networks with high bandwidth may employ angular, spatial, and/or wavelength multiplexing. A variety of network topologies and bandwidths suitable for the data center may be implemented. Eye safe networks may employ VCSEL emitters may be paired with optical elements to reduce optical power density to eye safe levels.Type: GrantFiled: April 3, 2020Date of Patent: March 2, 2021Assignee: Lumentum Operations LLCInventors: John R. Joseph, Kevin L. Lear, David Abell
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Patent number: 10923875Abstract: An optical device may include a package having a first port for receiving signal light, a source for providing pump light, a combiner for combining the signal light and the pump light into combined light, a second port for sending the combined light, a third port for receiving amplified light, and a free-space optical system for filtering amplified signal light from the amplified light, and a fourth port for sending the amplified signal light. The free-space optical system may include beam shaping optics that enlarge a beam size of the amplified light prior to the filtering.Type: GrantFiled: February 6, 2018Date of Patent: February 16, 2021Assignee: Lumentum Operations LLCInventors: Jiamin Zheng, Barrie P. Keyworth, Paul Colbourne, Dhanorm Plumwongrot, Gareth Jones, Sheldon McLaughlin
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Patent number: 10904163Abstract: A system may comprise a host device that stores a first application programming interface (API) and a transceiver. The transceiver may comprise a microcontroller unit (MCU) that stores a second API. The second API may be a subset of the first API. The first API and the second API may control different functions of a data-path chip of the transceiver. The MCU may be configured to provide controls and data from the first API through the MCU without operating on the controls and the data and without using the second API.Type: GrantFiled: March 22, 2019Date of Patent: January 26, 2021Assignee: Lumentum Operations LLCInventor: Hock Gin Lim
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Patent number: 10840675Abstract: A vertical cavity surface emitting laser (VCSEL) array may comprise a first subset of VCSELs of a plurality of VCSELs, and a second subset of VCSELs of the plurality of VCSELs. One or more first beams to be emitted by the first subset of VCSELs, when the VCSEL array is powered, and one or more second beams to be emitted by the second subset of VCSELs, when the VCSEL array is powered, may have different patterns of areas of energy intensity. The different patterns of areas of energy intensity may include respective areas of high energy intensity and respective areas of low energy intensity.Type: GrantFiled: November 28, 2018Date of Patent: November 17, 2020Assignee: Lumentum Operations LLCInventors: Xiaohua Lou, Delai Zhou, Hery Djie
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Patent number: 10833483Abstract: A vertical cavity surface emitting laser (VCSEL) array may comprise a plurality of VCSELs, a plurality of structures extending from a surface of the VCSEL array, and one or more metallization layers electrically connecting to one or more VCSELs of the plurality of VCSELs. The one or more metallization layers may include portions over the plurality of structures. The portions over the plurality of structures may extend to a height that is greater than other features on the surface of the VCSEL array. When the VCSEL array is on a submount, the plurality of structures may mechanically support the VCSEL array and to prevent the other features on the surface of the VCSEL array from contacting the submount.Type: GrantFiled: November 28, 2018Date of Patent: November 10, 2020Assignee: Lumentum Operations LLCInventor: Albert Yuen
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Patent number: 10830971Abstract: An optical module may include an optical subassembly having a receptacle. The receptacle may have a first diameter. The optical module may include a housing having a circular opening for receiving the receptacle. The circular opening may have a second diameter. The first diameter and the second diameter may be sized to reduce electromagnetic interference at a cut-off frequency from the optical module. The cut-off frequency may be defined by a data rate of at least one component of the optical module.Type: GrantFiled: June 18, 2018Date of Patent: November 10, 2020Assignee: Lumentum Operations LLCInventor: Jian Meng
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Patent number: 10823987Abstract: An electro-optic device may include a Mach-Zehnder modulator (MZM) and one or more components. The one or more components may apply a DC bias with dither to a first branch and a second branch of the MZM and to arms of the first branch, and may determine a second harmonic of a first return signal. The one or more components may apply a DC bias with phase-shifted dither to the first branch and the second branch or to the arms of the first branch, and determine a second harmonic of a second return signal. The phase-shifted dither may be out of phase from the dither and have a frequency that matches a frequency of the dither. The one or more components may determine whether arms of the second branch of the MZM are operating at null, and may selectively adjust DC biases applied to the arms of the second branch.Type: GrantFiled: June 24, 2019Date of Patent: November 3, 2020Assignee: Lumentum Operations LLCInventors: Dan Burke, Fredrik Sy, Josh Kemp