Abstract: An opto-mechanical assembly includes a first thermal control element disposed on a region of a first section of an enclosure; a second thermal control element disposed on a region of a second section of the enclosure; and an optical element that includes a first portion and a second portion. The first thermal control element is configured to heat the first portion of the optical element and to cause the first portion of the optical element to be associated with a first temperature, and the second thermal control element is configured to heat the second portion of the optical element and to cause the second portion of the optical element to be associated with a second temperature. This causes a difference between the first temperature and the second temperature to satisfy a temperature difference threshold. Accordingly, this also causes a temperature gradient along an axis of the optical element to satisfy a temperature gradient threshold.

Abstract: In some implementations, a semiconductor wafer includes a plurality of optical emitters, wherein an optical emitter, of the plurality of optical emitters, is associated with a receiver conducting medium for receiving wireless power transfer, wherein the receiver conducting medium is configured to couple to a wireless power transfer component for wireless power transfer at a common resonant frequency, and wherein the receiver conducting medium is configured to power the optical emitter to provide an optical output when the wireless power transfer is applied at the common resonant frequency.

Abstract: A testing device may include a stage associated with holding an emitter wafer during testing of an emitter. The stage may be arranged such that light emitted by the emitter passes through the stage. The testing device may include a heat sink arranged such that the light emitted by the emitter during the testing is emitted in a direction away from the heat sink, and such that a first surface of the heat sink is near a surface of the emitter wafer during the testing but does not contact the surface of the emitter wafer. The testing device may include a probe card, associated with performing the testing of the emitter, that is arranged over a second surface of the heat sink such that, during the testing of the emitter, a probe of the probe card contacts a probe pad for the emitter through an opening in the heat sink.

Abstract: An optical fiber holding device may comprise a first track and a second track. The first track may be configured to hold and guide a first optical fiber from a first track input location to a first track output location, wherein the first track is configured to allow the first optical fiber to connect to a first optical component and a first optical communication point. The second track may be configured to hold and guide a second optical fiber from a second track input location to a second track output location, wherein the second track is configured to allow the second optical fiber to connect to a second optical component and a second optical communication point.

Abstract: An in-fiber beam scanning system may comprise an input fiber to provide a beam, a feeding fiber comprising an imaging bundle with multiple cores embedded in a first cladding that is surrounded by a second cladding, and an in-fiber beam shifter that comprises a first multibend beam shifter coupled to the input fiber, a graded index fiber following the first multibend beam shifter, and a second multibend beam shifter following the graded index fiber and coupling into the feeding fiber. In some implementations, the first multibend beam shifter is actuated by a first amount and the second multibend beam shifter is actuated by a second amount to shift the beam in two dimensions and deliver the beam into one or more target cores in the imaging bundle.

Abstract: A pluggable optical module may include a substrate. The pluggable optical module may include a compressible sliding thermal interface disposed on the substrate to contact a riding heatsink. The compressible sliding thermal interface material may be compressed to fill interstices between a first surface of the substrate and a second surface of the riding heatsink. The compressible sliding thermal interface may protrude from the first surface of the substrate such that insertion of the pluggable optical module into a cage compresses the compressible sliding thermal interface to achieve a threshold thermal boundary resistance.

Abstract: A transmissive optical element may include a substrate. The transmissive optical element may include a first anti-reflectance structure for a particular wavelength range formed on the substrate. The transmissive optical element may include a second anti-reflectance structure for the particular wavelength range formed on the first anti-reflectance structure. The transmissive optical element may include a third anti-reflectance structure for the particular wavelength range formed on the second anti-reflectance structure. The transmissive optical element may include at least one layer disposed between the first anti-reflectance structure and the second anti-reflectance structure or between the second anti-reflectance structure and the third anti-reflectance structure.

Abstract: A semiconductor layer structure may include a substrate, a blocking layer disposed over the substrate, and one or more epitaxial layers disposed over the blocking layer. The blocking layer may have a thickness of between 50 nanometers (nm) and 4000 nm. The blocking layer may be configured to suppress defects from the substrate propagating to the one or more epitaxial layers. The one or more epitaxial layers may include a quantum-well layer that includes a quantum-well intermixing region formed using a high temperature treatment.

Abstract: In some implementations, an optical assembly comprises an optical cavity; one or more detectors; and an optical component having an input face and an output face configured to receive an input beam to the input face and to produce one or more primary output beams, and a plurality of secondary output beams from the output face, the secondary output beams resulting from multiple internal reflections within the optical component. At least one of the input face is not perpendicular to the input beam or the output face is not perpendicular to the one or more primary output beams. Each primary output beam is transmitted through the optical cavity perpendicular to at least one surface of the optical cavity, and directed to a respective one of the one or more detectors. Each detector is arranged to exclude at least a portion of each secondary output beam.

Abstract: An optical device may include a fiber to provide a beam. The optical device may include a graded-index element to expand or magnify the beam. An input facet of the graded-index element may be adhered to an output facet of the fiber. The optical device may include an optical transformation element to transform the beam after the beam is expanded or magnified by the graded-index element. An input facet of the optical transformation element may be adhered to an output facet of the graded-index element.

Abstract: An optical fiber holding device may comprise a first track and a second track. The first track may be configured to hold and guide a first optical fiber from a first track input location to a first track output location, wherein the first track is configured to allow the first optical fiber to connect to a first optical component and a first optical communication point. The second track may be configured to hold and guide a second optical fiber from a second track input location to a second track output location, wherein the second track is configured to allow the second optical fiber to connect to a second optical component and a second optical communication point.

Abstract: An optical device may include a polarization splitter to split a unidirectional rotary optical beam into a first rotary optical beam having a first polarization state and a second rotary optical beam having a second polarization state. The unidirectional rotary optical beam and the second rotary optical beam may have optical power with a first direction of spatial rotation. The optical device may include a reflective element to reverse a parity of the first rotary optical beam in association with causing optical power of the first rotary optical beam to have a second direction of spatial rotation. The optical device may include a polarization combiner to, after reversal of the parity of the first rotary optical beam, combine the first rotary optical beam and the second rotary optical beam to create a bi-directional rotary optical beam having the first polarization state and the second polarization state.

Abstract: A zoned waveplate has a series of transversely stacked birefringent zones alternating with non-birefringent zones. The birefringent and non-birefringent zones are integrally formed upon an AR-coated face of a single substrate by patterning the AR coated face of the substrate with zero-order sub-wavelength form-birefringent gratings configured to have a target retardance. The layer structure of the AR coating is designed to provide the target birefringence in the patterned zones and the reflection suppression.

Abstract: In some implementations, a fiber optic combiner may comprise an enclosing tube having a geometric shape and multiple optical fibers bundled within the enclosing tube. In some implementations, the multiple fibers comprise at least one optical fiber having a core and a non-circular cladding surrounding the core. The non-circular cladding may cause the multiple optical fibers to have a larger tube fill factor and a lower expected beam parameter product increase factor relative to the multiple optical fibers all having circular claddings.

Abstract: A VCSEL may include an n-type substrate layer and an n-type bottom mirror on a surface of the n-type substrate layer. The VCSEL may include an active region on the n-type bottom mirror and a p-type layer on the active region. The VCSEL may include an oxidation layer over the active region to provide optical and electrical confinement of the VCSEL. The VCSEL may include a tunnel junction over the p-type layer to reverse a carrier type of an n-type top mirror. Either the oxidation layer is on or in the p-type layer and the tunnel junction is on the oxidation layer, or the tunnel junction is on the p-type layer and the oxidation layer is on the tunnel junction. The VCSEL may include the n-type top mirror over the tunnel junction, a top contact layer over the n-type top mirror, and a top metal on the top contact layer.

Abstract: An optical transceiver may include a housing including a surface cutout. The surface cutout may be for receiving a locking tang from a cage and for being disengaged by a slide from an unlocking tool wherein the surface cutout is disposed on the housing at a position such that the surface cutout is entirely within the cage with respect to an electromagnetic interference (EMI) gasket of the cage when the optical transceiver is inserted into the cage.

Abstract: An optical device may include an optical subassembly and a digital signal processor (DSP). The optical device may include a radio frequency (RF) interconnect that electrically connects the optical subassembly and the DSP. The optical device may include a passive RF filter on one or more transmission lines of the RF interconnect.

Abstract: In some implementations, a waveguide may comprise an inner core to receive a first beam and an outer core surrounding the inner core to receive a second beam that is displaced from the first beam by an offset. The outer core may comprise a beam guiding region that rotationally expands over a length of the waveguide into an annulus that concentrically surrounds the inner core or a partial annulus that partially surrounds the inner core. For example, the beam guiding region may be defined by one or more low refractive index features that have a varied orientation and/or a varied shape over the length of the waveguide such that the second beam enters the waveguide as an offset beam and exits from the waveguide as a ring-shaped beam or a partial ring-shaped beam.

Abstract: An emitter may include a substrate, a conductive layer on at least a bottom surface of a trench, and a first metal layer to provide a first electrical contact of the emitter on an epitaxial side of the substrate. The first metal layer may be within the trench such that the first metal layer contacts the conductive layer within the trench. The emitter may further include a second metal layer to provide a second electrical contact of the emitter on the epitaxial side of the substrate, and an isolation implant to block lateral current flow between the first electrical contact and the second electrical contact.

Abstract: A controller may apply an electrical signal to each of two arms of a Mach-Zehnder Interferometer (MZI) and may dither the electrical signals applied to one, or both, of the arms between a nominal state, a high state and a low state such that there is a constant phase difference between the arms in the high and low states compared to the nominal state, wherein each electrical signal comprises a static component (IL, IR, IL?, IR?) and a dither component. The controller may change the static component of the respective electrical signal applied to one, or both, of the arms in accordance with changes to an operating point during variation of the dither component and may vary a dither magnitude in accordance with changes in the electrical signal applied to one, or both, of the arms so as to maintain the constant phase difference.