Abstract: The present invention relates to a catalyst comprising manganese oxides wherein the manganese oxides comprise: MnO in an amount of 40-60 mole %, based on mole of Mn; Mn2O3 in an amount of 40-60 mole %, based on mole of Mn; and Mn3O4 in an amount of 1-10 mole %, based on mole of Mn. The present invention also relates to a method for preparing the catalysts and the use of the catalyst in an air purifier. The catalyst according to the present invention can effectively catalyze formaldehyde oxidation at ambient temperature so as to effectively remove indoor formaldehyde being present in relative low amounts.

Abstract: An apparatus is disclosed including: a light source; a Fresnel lens, and a lens array. The Fresnel lens is disposed upstream from the light source to collimate light output by the light source. The lens array is disposed upstream from the Fresnel lens to mix collimated light that is output from the Fresnel lens. The lens array includes a plurality of optical elements arranged on a substrate. Each optical element includes a respective first planar surface arranged to face towards a different respective portion of the Fresnel lens and a second convex surface arranged to face away from the Fresnel lens.

Abstract: The invention describes an LED lighting arrangement comprising a single-layer carrier comprising a mounting surface, a metal core, and a dielectric layer between the mounting surface and the metal core; at least one LED string comprising a plurality of series-connected LED die packages mounted on the mounting surface, wherein the LED die packages of a string are arranged in a two-dimensional array comprising at least two rows; and at least one micro-via extending through the dielectric layer of the single-layer carrier and arranged to electrically connect the final cathode of an LED string to the metal core of the single-layer carrier. The invention further describes a lighting unit; and a method of manufacturing an LED lighting arrangement.

Abstract: The invention relates to an optical arrangement including LED lighting elements arranged on a support surface. An optical axis X extends from the support surface. A first collimator unit includes at least one support element and first collimator elements. The support element is supported on the support surface between at least two of the LED lighting elements. The first collimator elements are arranged in front of the LED lighting elements in the direction of the optical axis X to collimate light emitted from the LED lighting elements. A second collimator unit is arranged in front of the first collimator unit in the direction of the optical axis X. The second collimator unit includes second collimator elements arranged in front of the first collimator elements to collimate light emitted therefrom.

Abstract: A lighting device includes an LED light source and a concave reflector. The light source is arranged such that light emitted is reflected by the reflector. The shield is arranged in front of the reflector. A projection lens is arranged to project light passing the shield. In order to efficiently use light emitted from the LED light source and to enable a projected illumination beam of high luminous flux, the LED light source is arranged below an optical axis L of the projection lens.

Abstract: A light emitting device includes a vertical via through the P-type semiconductor layer and the active layer. Using a vertical via reduces quantum well damage, allows shortening of P-N spacing, and allows increased reflective area. A dielectric structure is formed in the via to provide a sloped wall that extends to an upper surface of the device. Another dielectric layer covers the upper surface and the sloped wall, and provides select contacts to the semiconductor layers. A metal layer is subsequently applied. Because the dielectric layers provide a continuous slope from the surface of the device, the metal layer does not include a vertical drop. Because the active layer does not extend into the via, the contact to the N-type semiconductor layer may be situated closer to the wall of the via, increasing the area available for a reflective layer.

Abstract: An illumination module comprises a semiconductor light source and a light guide, which comprises a solid body with essentially parallel entry and exit faces and side faces extending between the entry and exit faces; and wherein the entry face receives light emitted by the semiconductor light source; the exit face is offset from the entry face and the area of the exit face exceeds the area of the entry face; a first side face comprises a uniform plane subtending an angle of inclination to the entry face; a second side face, opposite to the first side face, comprises a plurality of offset sub-faces, each sub-face subtends an angle of inclination relative to the entry face; and the inclined faces are formed so that the direction of light leaving the exit face is essentially the same as the direction of light entering the entry face.

Abstract: Lighting devices and methods of manufacture are described. A lighting device includes first wires and second wires. Each of the first wires has a first longitudinal axis and a bent section. Each of the second wires has a second longitudinal axis and a bent section. The first wires and the second wires intersect one another within intersection regions. The first longitudinal axis and the second longitudinal axis are in the same plane. The bent section of each of the first wires is arranged in one of the intersection regions. The bent section of each of the second wires is arranged between two intersection regions. A predefined minimum distance is provided between the first wires and the second wires in the intersection regions. The lighting device further includes light-emitting elements electrically coupled to the first wires and the second wires at the intersection regions.

Abstract: Methods and apparatus for driving an emitter array are described. A method includes determining a thermal environment profile for a plurality of emitters of the emitter array, computing a current pulse profile for at least one of the plurality of emitters based on the thermal environment profile, and applying a current pulse with the computed current pulse profile to the at least one of plurality of emitters.

Abstract: The invention describes a circuit assembly comprising a circuit board with a metal core, a pattern of conductive tracks, and a dielectric layer between the metal core and the conductive tracks; at least one circuit component mounted to the circuit board by means of solder interconnects, wherein a solder interconnect is formed between a contact pad of the circuit component and a conductive track; characterized in that the metal core comprises at least one cavity, wherein a cavity is arranged in the vicinity of a solder interconnect. The invention further describes a circuit board for such a circuit assembly, and a method of manufacturing such a circuit assembly.

Abstract: Systems, devices and methods are described herein. A device includes a power stage circuit, a switch and a first circuit. The switch is electrically coupled to the power stage circuit. The first circuit is electrically coupled to the power stage circuit and the switch and has a single output. The first circuit is configured to provide a first circuit output voltage at the single output. The first circuit output voltage has a first level on a condition that the power stage circuit is conducting at a peak current level. The first circuit output voltage has a second level on a condition that the power stage circuit is not conducting.

Abstract: A light source useful for architectural lighting, general lighting, street lighting, or other lighting applications includes a plurality of light emitting diodes, with at least some light emitting diodes sized between 50 microns and 500 microns. A plurality of micro-optics sized less than 1 millimeter are positioned over at least some of the plurality of light emitting diodes. Each combination of light emitting diode and associated micro-optic is positioned within a Rayleigh distance to each other, sufficient to both present a substantially uniform visual appearance and provide a substantially uniform light beam. In some embodiments the height of the light emitting diodes, their supporting substrate and electrical traces, and associated optics is less than 5 millimeters.

Abstract: A light source includes a plurality of light emitting diodes, with at least some light emitting diodes sized between 30 microns and 500 microns. A plurality of micro-optics are associated with a light guide plate and sized less than 1 millimeter, with each micro-optic positioned over at least one of the plurality of light emitting diodes. At least some of the combinations of light emitting diode and micro-optics associated with the light guide plate are positioned within a distance to each other sufficient to provide a substantially uniform light beam.

Abstract: A uLED and method for regrowth with thinner deposition on sidewall are disclosed. The uLED and method include a growth substrate including flat first and second regions, where the growth substrate is thicker in the first region as compared to the second region, and a third region of sloped sidewalls connecting the first and second regions, the topography forming a regular geometric pattern, a plurality of semiconductor epitaxial layers covering the first, second, and third regions including at least a p-n junction layer including a light emitting active region of direct bandgap semiconductor, sandwiched between n-type and p-type layers, each of the plurality of semiconductor epitaxial layers being thicker on the first and second regions as compared to the corresponding semiconductor epitaxial layers on the third region, and a plurality of electrical contacts forming an anode and cathode on part of the first and second regions, respectively.

Abstract: A light source useful for architectural lighting, general lighting, street lighting, or other lighting applications includes a plurality of light emitting diodes. A least some light emitting diodes can be sized between 30 microns and 500 microns. A plurality of micro-optics sized less than 1 millimeter are positioned over at least some of the plurality of light emitting diodes and a controller is connected to selectively power groups of the plurality of light emitting diodes to provide different light beam patterns.

Abstract: Techniques, devices, and systems are disclosed and include LEDs with a first flat region, at a first height, including a plurality of epitaxial layers such as a first n-layer, a first p-layer, and a first active layer. A second flat region at a second height and parallel to the first flat region includes at least a second n-layer. Sloped sidewalls connect the first flat region and the second flat region and include at least a third n-layer. The p-layer of the first flat region is thicker that at least a portion of the third region. A p-contact is formed on the first p-layer and an n-contact is formed on the second n-layer.

Abstract: Techniques, devices, and systems are disclosed and include LEDs with a first flat region, at a first height from an LED base and including a plurality of epitaxial layers including a first n-layer, a first active layer, and a first p-layer. A second flat region is provided, at a second height from the LED base and parallel to the first flat region, and includes at least a second n-layer. A sloped sidewall connecting the first flat region and the second flat region is provided and includes at least a third n-layer, the first n-layer being thicker than at least a portion of third n-layer. A p-contact is formed on the first p-layer and an n-contact formed on the second n-layer.

Abstract: Light emitting devices (LEDs) and methods of manufacturing LEDs are described. A method includes providing a layer of a wavelength converting material on a temporary tape. The wavelength converting material includes at least a binder or matrix material, particles of a non-luminescent material, and phosphor particles and has a concentration of 60%-90% by volume particles of the non-luminescent material and phosphor particles. The layer of the wavelength converting material is separated on the temporary tape to form multiple wavelength converting structures, which are provided on an array type frame. Heat and pressure are applied to the wavelength converting structures on the array type frame.

Abstract: A method according to embodiments of the invention includes creating a three-dimensional profile of a scene, calculating a relative amount of light for each portion of the scene based on the three-dimensional profile, and activating a light source to provide a first amount of light to a first portion of the scene, and a second amount of light to a second portion of the scene. The first amount and the second amount are different. The first amount and the second amount are determined by calculating a relative amount of light for each portion of the scene.

Abstract: Devices and techniques are disclosed herein which include a first LED device layer, a second LED device layer, and an adhesive bondline disposed between the first LED device layer and the second LED device layer. The adhesive bondline includes a bondline thickness, a plurality of spacers disposed within the adhesive bondline, and a silicone matrix. The plurality of spacers may have a diameter or a shortest axis between 0.5 and 10 micrometers and the coefficient of variation is 10% or less. The plurality of spacers may be include SiO2, alumina, soda lime glass, may be inorganic, or polymeric.