Abstract: A device includes a first circuit and a second circuit. The first circuit receives a first voltage, at a first input, and provides a second voltage having one of a first level and a second level based on a level of the first voltage being above or below a threshold voltage. The second circuit is electrically coupled to the first input of the first circuit and decreases the level of the first voltage below a threshold voltage on a condition that the level of the first voltage is above the threshold voltage for a maximum time.

Abstract: Devices and techniques are disclosed herein which include a first LED device layer, a second LED device layer, and an adhesive bondline disposed between the first LED device layer and the second LED device layer. The adhesive bondline includes a bondline thickness, a plurality of spacers disposed within the adhesive bondline, and a silicone matrix. The plurality of spacers may have a diameter or a shortest axis between 0.5 and 10 micrometers and the coefficient of variation is 10% or less. The plurality of spacers may be include SiO2, alumina, soda lime glass, may be inorganic, or polymeric.

Abstract: A lighting arrangement and a method of forming an illumination beam are described. A plurality of LED lighting elements is operable to emit light. A plurality of collimator elements is arranged to collimate light emitted from the LED lighting elements. A first projection element is arranged to project light emitted from the collimator elements onto a spatially controllable reflector element. The spatially controllable element comprises a plurality of reflector elements adjustable between a first and a second position. In the first position, the light is reflected into the direction of a second projection element to form a projected illumination beam. In the second position, light is reflected into a different direction to not contribute to the projected illumination beam.

Abstract: Lighting devices and methods of manufacturing lighting devices are described. A lighting devices includes at least one thermally conductive element, at least one lighting module thermally coupled to the at least one thermally conductive element, and an overmould at least partially encasing the at least one thermally conductive element, the overmould comprising at least one receiving portion. The at least one circuit board is mounted in the at least one receiving portion and is at least partially exposed from the overmould. The at least one circuit board includes at least one connector and at least two bond pads. The at least one connector includes surface accessible conduction lines.

Abstract: A lighting device, a method of manufacturing a lighting device and a support are described. A support includes a layered structure of alternating conductors and insulating layers. The layered structure includes a mounting section and a body section adjacent the mounting section. The mounting section includes at least one mounting face that has an arrangement direction and at least three alternating contact sections along the arrangement direction. Each contact section is electrically coupled to one of the conductors and separated from a neighboring one of the contact sections by one of the insulating layers. The body section has a width that protrudes sidewards from the at least one mounting face and a length that extends substantially parallel to the arrangement direction.

Abstract: A method for applying at least one electronic component to a surface is described. The method includes placing a component stencil on a support. At least one electronic component is arranged in a corresponding opening of the component stencil with a top surface of the electronic component on the support. A contact material stencil is positioned on the component stencil such that at least one opening in the contact material stencil is over a corresponding contact region on the bottom surface of the at least one electronic component. A contact material is applied on the at least one contact region of the at least one electronic component within the corresponding opening of the contact material stencil. The contact material stencil is removed from the component stencil. The component stencil is removed from the support. The at least one electronic component is applied to the surface.

Abstract: Disclosed lens designs enable uniform light distribution without hot spot, achieving wider transfer functions of light compared with traditional lenses, with a benefit of reducing the number of light sources needed and overall cost for direct-lit backlight device. A disclosed lens includes a beam shaping element on the top thereof and a backlight device incorporating the lens and the beam shaping element to eliminate a light hot spot produced by the backlight device and obtain a uniform light distribution at the illumination field. The disclosed lens is especially useful when extremely wider transfer function or extremely thin backlight is needed.

Abstract: Optical lens and light emitting device designs achieve uniform light distribution without producing a light “hot spot”, with a benefit of reducing the number of light sources needed and overall cost for direct-lit backlight device. The optical lens includes coating portions or structures on the bottom surface thereof, and a backlight device, or other light emitting device, incorporating said lens, to produce a uniform distribution of light at a target surface. The disclosed lens and light emitting device are particularly useful when an extremely wide transfer function of backlight is needed.

Abstract: An LED backlight system having a plurality of backlight segments including an integral light waveguide, each backlight segment supporting a sidelight emitting LED. A light guide is included in each of the plurality of backlight segments and defines a cavity having a top and sidewalls, with the sidelight emitting LED positioned in the cavity. At least one of a reflective layer and a top out-coupling structure can be positioned between the top of the cavity and the sidelight emitting LED.

Abstract: The invention describes a depth map generator comprising an array comprising a plurality of individually addressable array elements, wherein an array element comprises a semiconductor emitter or a reflector arranged to reflect light emitted by a semiconductor emitter; a driver realised to switch an array element according to a predefined illumination pattern; a number of image sensors, wherein an image sensor is arranged to detect light reflected from a scene irradiated by the irradiation pattern; and a processing unit realised to compute a depth map of the scene on the basis of a light pattern detected by an image sensor. The invention further describes an irradiation arrangement for use in such a depth map generator; a method of generating a depth map of a scene; and a device comprising such a depth map generator.

Abstract: The present inventions relates to an illumination device, in particular for a vehicle headlight. The device comprises at least one light source, a wavelength converting member converting at least part of the light of the light source to light of a different wavelength, a first and a second light guiding element between the light source and the wavelength converting member, and a reflective member being attached to the wavelength converting member. The second light guiding element is designed to guide the light emitted by the light source and having passed through the first light guiding element to the wavelength converting member and to guide the converted light which has been reflected at the reflective member to the first light guiding element. The first light guiding element comprises at least one first guiding structure guiding the light emitted by the light source to the second light guiding element.

Abstract: The invention describes a method of manufacturing an LED module, comprising the steps of providing a translucent encapsulant comprising a number of layers to enclose a number of LEDs of the LED module; modifying the surface structure of an outer surface of a layer to form at least one dense scattering region corresponding to the position of an LED of the LED module; to form at least one sparse scattering region that does not correspond to the position of an LED of the LED module; and to form a transition scattering region between a dense scattering region and a sparse scattering region. The invention further describes an LED module, and a device comprising a device housing and at least one such LED module.

Abstract: The invention relates to a light emitting device (LED), especially a LED at least partly embedded in transparent or translucent silicone fill, whereby the embedded LED is housed in a white silicone housing. Here and in the following, the wording transparent silicone fill always means a transparent or translucent silicone material. The invention further relates to a method for embedding the LED partly in a white silicone housing on the one hand and partly in transparent silicone fill on the other hand. The invention finally relates to the transparent silicone fill. The inner part of the LED device is at least partly embedded in transparent silicone fill, wherein the at least partly embedded LED device is housed in a white silicone housing comprising a white box silicone. A part of the inner part of the LED device is embedded in the white box silicone.

Abstract: The invention describes a semiconductor die comprising at least a first light-emitting diode and a second light-emitting diode, wherein the first light-emitting diode comprises a first diode formed in a first die area and a first phosphor layer deposited over the first die area; the second light-emitting diode comprises a second diode and a second phosphor layer deposited over the second die area; the first diode and the second diode are electrically connected in anti-parallel; and wherein the optical properties of the second phosphor layer differ from the optical properties of the first phosphor layer.

Abstract: The invention describes a flexible lighting strip comprising a multitude of light-emitting diodes arranged in at least two groups. Each group comprises at least two light-emitting diodes arranged in an electrical series connection. The at least two groups are arranged in parallel to an anode track and a cathode track. The at least two groups are arranged in a longitudinal arrangement such that a last light-emitting diode of a first group is arranged next to a first light-emitting diode of a second group. The anode track and the cathode track each consist of a wire line having substantially circular wires that are bent to receive compressive and/or tensile stress. The electrical circuit provides a third wire line having a substantially circular wire as a center line arranged between the outer lines. At least one light-emitting diode of every group is mounted on an interposer which contracts all three wire lines.

Abstract: A method for producing a flexible lighting strip comprising multitude of functional elements, which are light-emitting diodes, comprise light-emitting diodes, or are interposers with light-emitting diodes. The functional elements are in at least two groups, each comprising at least two functional elements in electrical series connection. The groups are in an electrical circuit having at least an anode and a cathode track as outer lines. The functional elements are in an electrical parallel connection to the anode and cathode tracks. The groups are in a longitudinal arrangement so a first group's last functional element is next to a second group's first functional element. Each of the outer lines has a wire line having substantially circular wires that are bent building zones capable of receiving compressive and tensile stress. The electrical circuit provides a third wire line having a substantially circular wire as a center line arranged between the outer lines.

Abstract: A lighting device, wherein the effectivity is increased and allows maintaining a simple manufacturing process, comprises: a housing having a longitudinal direction, the housing comprising: reflective side walls extending in the longitudinal direction, a first cavity disposed between the reflective side walls, and an opening of the first cavity for the passage of light from the first cavity; LEDs, each having a light-emitting face and side faces, wherein the LEDs are arranged on interposers for providing electrical connection of the LEDs, wherein the LEDs are arranged in the first cavity such that the LEDs are at least partially arranged along the longitudinal direction of the housing; and a reflection element that covers a side of the interposers facing the opening, wherein the reflection element surrounds the LEDs on the side faces, and is configured as strip comprising through holes in which the LEDs are arranged.

Abstract: A laser lighting module for a vehicle headlight includes at least one laser, a scanning arrangement, a light conversion device, a safety mirror, a safety detector and a safety controller. The laser emits light in a first wavelength range and the scanning arrangement moves a beam of the light within a scanning solid angle so a spot of the light moves across the light conversion device. The light conversion device converts a fraction of the light to converted light in a different wavelength range than the first and emits a mixture of transmitted and converted light. The safety mirror is arranged within the scanning solid angle such that at least 90% of the transmitted light hits the safety mirror. The safety controller receives the control signal, generated by the safety detector from the safety detection light, and switches off the laser if the control signal exceeds a first threshold value.

Abstract: A lighting system includes a plurality of lighting units. Each lighting unit includes a unit control circuit and a lighting element. The unit control circuit is disposed to store at least one lighting scenario. The lighting scenario comprises a succession of settings of intensity and/or color of the lighting element. A system control circuit is disposed to transmit an execute signal to one or more of the lighting units. The unit control circuit is disposed to control, upon reception of the execute signal, the lighting element according to the lighting scenario. The lighting units are connected to a common electrical power supply via two conductors. The execute signal is transmitted from the system control circuit to the lighting units wirelessly or via the two conductors.

Abstract: Embodiments of the invention include a semiconductor light emitting device with a light emitting layer disposed between an n-type region and a p-type region. The light emitting layer emits first light. The device further includes AE1-xLi2Be4O6:Eux, wherein AE=one or more of Sr, Ba, Ca, disposed in the path of the first light. The AE1-xLi2Be4O6:Eux absorbs first light and emits second light. In some embodiments, the first light and second light may be blue.