Abstract: Cathode and anode electrodes are located on the bottom surface of an LED submount along a center line of the bottom surface. Two thermal pads are located on either side of the electrodes along opposite sides of the bottom surface. This configuration results in less stress on solder bonding the electrodes to a circuit board. Further, since the heat conducted by the two thermal pads is not choked by the electrodes, the heat spreads more uniformly into the circuit board. Further, since the metal design is symmetrical in that the outer thermal pads are identical, the molten solder will have the same shape over both thermal pads, causing the LED die and submount to be not tilted with respect to the surface of the circuit board. Other configurations are described that also improve the thermal and electrical characteristics of the LED die.

Abstract: Optical lens and light emitting device designs achieve uniform light distribution without producing a light “hot spot”, with a benefit of reducing the number of light sources needed and overall cost for direct-lit backlight device. The optical lens includes coating portions or structures on the bottom surface thereof, and a backlight device, or other light emitting device, incorporating said lens, to produce a uniform distribution of light at a target surface. The disclosed lens and light emitting device are particularly useful when an extremely wide transfer function of backlight is needed.

Abstract: A light emitting device includes a vertical via through the P-type semi-conductor layer and the active layer. Using a vertical via reduces quantum well damage, allows shortening of P-N spacing, and allows increased reflective area. A dielectric structure is formed in the via to provide a sloped wall that extends to an upper surface of the device. Another dielectric layer covers the upper surface and the sloped wall, and provides select contacts to the semiconductor layers. A metal layer is subsequently applied. Because the dielectric layers provide a continuous slope from the surface of the device, the metal layer does not include a vertical drop. Because the active layer does not extend into the via, the contact to the N-type semiconductor layer may be situated closer to the wall of the via, increasing the area available for a reflective layer.

Abstract: Light emitting die (300) comprising a plurality of light emitting elements (310A, 310B), each having a pair of bond pads (N1,P1 and N2,P2), wherein at least two diagonally opposite bond pads of adjacent light emitting elements on a die have their facing corners truncated (330) to enable a direct diagonal coupling of a complementary pair of diagonally opposite bond pads when the die is monted on a substrate on which an interconnection pattern is formed. By enabling diagonal as well as lateral coupling of the bond pads of multiple light emitting elements of a die, the multiple light emitting elements may be arranged in a variety of series and/or parallel configurations, thereby facilitating the use of the same die at different nominal operating voltages with a single inter-connect layer on the substrate upon which the die is mounted.

Abstract: The invention describes a laser-based light source (100) which is adapted to use the angular dependence of the reflection of polarized laser light (10) at a surface of a conversion material to control especially the color point of light emitted by means of the laser-based light source (100). The reflected laser light is within a first wavelength range and the converted light is in a second wavelength range different from the first wavelength range such that the color point of the light emitted by means of the laser-based light source (100) in a defined solid angle depends on the ratio between reflected and converted light. The invention further describes a corresponding method of light emission control, a vehicle headlight (200) comprising such a laser-based light source (100) and a lighting system comprising such vehicle headlights (200).

Abstract: Embodiments of the invention include a flip chip semiconductor light emitting device and a wavelength converting structure disposed in a path of light extracted from the flip chip semiconductor light emitting device. A substrate with a textured top surface is positioned with the bottom surface facing the wavelength converting structure. The wavelength converting structure is disposed between the substrate and the flip chip semiconductor light emitting device.

Abstract: The invention provides a lighting system for generating patterned phosphor-converted output beams for projection onto a pixelated display unit (24). A phosphor screen arrangement (18) comprises a plurality of separate light-receiving surface regions (34), each region (34) illuminated by an individually addressable laser source arrangement. By controlling the relative intensity of light directed to each of the surface regions (34), a broad range of different output beam patterns can be created from the phosphor screen arrangement (18). The generated beam pattern may be controlled so as to correspond with the pixel configuration of the display unit (24), such that light is directed only toward pixels (26) which are active, rather than inactive. This enables significant improvements in optical efficiency, since light need not be wasted through propagation toward pixels (26) which are configured simply to discard it.

Abstract: The invention provides a headlight device capable of generating two distinct, though possibly overlapping, beam portions, by means of a single integrated unit. The unit comprises two primary optical components for generating the two respective beam portions, and a single exit lens through which the combined beam is transmitted. A low beam having a stepped cut-off—to avoid glare to oncoming road users—may be generated by means of the provided device, with the cut off generated by means of a specially shaped collimating element, and the remaining spread of the beam generated by means of a downwardly reflecting reflector. Dual high and low beam functionality can alternatively be achieved, wherein the collimating element generates a high beam, and the reflector structure generates a low beam. By shaping and positioning the collimating element appropriately, a stepped cut off in the low beam may be still be provided in these embodiments.

Abstract: Embodiments of the present disclosure relate to a lighting strip, comprising a flexible printed circuit strip which comprises a plurality of wiring portions and a plurality of respective carrying portions, the wiring portions are used to supply electrical power to electric elements disposed on the carrying portions, and the carrying portions protrude from the wiring portions and are adapted to be bent around the wiring portions; a plurality of solid-state lighting elements respectively mounted on the carrying portions; wherein the wiring portion is provided with at least one pitch adjusting portion for adjusting a pitch between two adjacent carrying portions. Embodiments of the present disclosure also relate to a lighting device.

Abstract: Embodiments of the invention include a wavelength-converting material defined by AE3?x1?y+zRE3?x2+y?z[Si9?wAlw(N1?yCy)[4](N16?z?wOz+w)[2]]Eux1,Cex2, where AE=Ca, Sr, Ba; RE=Y, Lu, La, Sc; 0?x1?0.18; 0?x2?0.2; x1+x2>0; 0?y?1; 0?z?3; 0?w?3.