Abstract: A reflective layer for use in lighting devices and methods of forming the reflective layer are provided. The reflective layer may include a dielectric layer including one or more insulating materials. An intermediate layer may be formed on the dielectric layer. The intermediate layer may include one or more materials having a higher enthalpy of reaction than the one or more insulating materials. Because of the higher enthalpy of reaction, atoms of the one or more materials in the intermediate layer may form bonds with atoms of the one or more insulating materials. A metal layer may be formed on the intermediate layer to reflect light emitted from an active region of a light emitting diode (LED).

Abstract: An LED lighting strip, method of manufacturing an LED lighting strip and an automotive lighting system are described. The LED lighting strip includes at least two outer wires, at least one central wire between the two outer wires, LEDs arranged along the LED lighting strip and electrically coupled at least to the at least two outer wires, and an enclosing member enclosing the at least two outer wires, the at one central wire and the LEDs. The at least two outer wires and the least one central wire have a bend in sections between at least some adjacent LEDs.

Abstract: A method includes depositing a layer comprising a photoinitiator and a curable material onto a surface and applying a nanoimprint mold on the layer of curable material to form a mesh comprising intersecting walls defining cavities. After applying the nanoimprint mold, the mesh is illuminated with light causing decarboxylation of the photoinitiator to initiate curing of the curable material. After curing the curable material, the nanoimprint mold is removed and a wavelength converting material is deposited in the cavities to form an array of wavelength converting pixels.

Abstract: A micro-light emitting diode (uLED) device comprises: a mesa comprising: a plurality of semiconductor layers including an n-type layer, an active layer, and a p-type layer; a p-contact layer contacting the p-type layer; a cathode contacting the first sidewall of the n-type layer; a first region of dielectric material that insulates the p-contact layer, the active layer, and a first sidewall of the p-type layer from the cathode; an anode contacting the top surface of the p-contact layer; and a second region of dielectric material that insulates the active layer, a second sidewall of the p-type layer, and the second sidewall of the n-type layer from the anode. The top surface of the p-contact layer has a different planar orientation compared to the first and second sidewalls of the n-type layer. Methods of making and using the uLED devices are also provided.

Abstract: Described are light emitting diode (LED) devices comprising a mesa with semiconductor layers, the semiconductor layers including an N-type layer, an active layer, and a P-type layer. A patterned transparent conductive oxide layer is on the top surface of the mesa. The patterned transparent conductive oxide layer has a first portion with a first thickness and a second portion with a second thickness, the second thickness less than the first thickness. Optical loss of the LED is reduced in the thinned region of the transparent conductive oxide layer.

Abstract: The present invention encompasses materials and methods for catalyzing the cross-linking and curing of siloxane polymers. In particular, the present disclosure provides materials, methods, and conditions for vapor phase catalysis for curing organosiloxane polymers and resins, including resin linear organosiloxane block copolymers, as well as the incorporation of those methods into processes for making light emitting devices, including light emitting diodes.

Abstract: A lighting device includes a first LED configured to emit a first light, a second LED configured to emit a third light, a first phosphor disposed over the first LED and second LED, and arranged to absorb a portion of the first light and in response emit a second light of a longer wavelength than the first light, and a second phosphor disposed over the second LED, the second phosphor arranged to absorb a portion of the third light and in response emit a fourth light of a longer wavelength than the third light, and the fourth light exits the second phosphor into the first phosphor, and both the second light and fourth light exit the lighting device though the first phosphor.

Abstract: Phosphor-converted LED side reflectors disclosed herein comprise pigments that are photochemically stable under illumination by light from the pcLED. The pigments absorb light in at least a portion of the spectrum of light emitted by the first phosphor converted LED. The side reflector may also comprise light scattering particles or air voids. The pigments, light scattering particles, or air voids may be homogeneously distributed in the reflector. Alternatively the side reflector may be layered, with the pigments, light scattering particles, or air voids inhomogeneously distributed in the reflector. The side reflector can include phosphor particles.

Abstract: A light-emitting device includes a substrate, a semiconductor diode structure, a wavelength-converting layer less than 50. microns thick with luminescent particles in an index-matched inorganic binder, optical sidewall coating, and an optical sidewall structure. The optical sidewall structure is interposed between substrate sidewalls and optical sidewall coating, and redirects side-propagating output light toward or within the wavelength-converting layer. The optical sidewall structure can be part of the wavelength-converting layer or part of an adhering layer between the substrate and the wavelength-converting layer.

Abstract: The pcLED pixels in a phosphor-converted LED array each comprise an optical element on the light-emitting surface above the phosphor layer. In methods for making such pixelated LED arrays, a thin layer of a sacrificial phosphor carrier substrate is retained as the optical element on the output surface of the phosphor pixels upon completion of the fabrication process.

Abstract: A method includes capturing a first image of a scene, detecting a face in a section of the scene from the first image, and activating an infrared (IR) light source to selectively illuminate the section of the scene with IR light. The IR light source includes an array of IR light emitting diodes (LEDs). The method includes capturing a second image of the scene under selective IR lighting from the IR light source, detecting the face in the second image, and identifying a person based on the face in the second image.

Abstract: An automotive lighting system for a vehicle includes a light source, a refraction lens and a projection lens. The light source includes a first sub light source. The refraction lens includes a light entrance surface and a light exit surface. The light entrance surface has a first protrusion that has a first light entrance face adjacent the first sub light source and a first light exit face on the light entrance surface of the first refraction lens. The first protrusion is located at a periphery of the light entrance surface of the refraction lens with respect to an optical axis of the automotive lighting system.

Abstract: In a projection display system, a light-emitting diode (LED) can generate unpolarized light. A light guide can receive the unpolarized light from a perimeter of the light guide and guide the unpolarized light between a light emission surface and an opposing surface as guided light. The light guide can include a plurality of light-extraction features that can direct a portion of the guided light out of the light guide through the light emission surface as unpolarized emitted light. A polarizing film can reflect at least some of a first polarization state of the unpolarized emitted light into the light guide through the light emission surface and can transmit at least some of a second polarization state of the unpolarized emitted light through the polarizing film to form a polarized light beam. An angular reduction film can reduce a range of propagation angles of the polarized light beam.

Abstract: An automobile rear lighting includes a first emitter that emits a first light through a cover and a second emitter that emits a second light, different from the first light, through the cover such that an output light including the first light and the second light is emitted through the cover. The automobile rear lighting also includes a driving apparatus. The driving apparatus provides a first driving current to the first emitter and a second driving current to the second emitter. The driving apparatus adapts a magnitude of the first driving current and the second driving current based on at least one of at least one property of the cover or at least one optical component of the automobile rear lighting and a pre-defined color coordinates specification for the output light.

Abstract: A gas sensing system can allow a gas sample to permeate hollow spaces within a porous scattering material. The porous scattering material can be substantially transparent at an illumination wavelength. An emitter can illuminate the porous scattering material and the gas sample with light having a spectrum that includes the illumination wavelength. A sensor can detect a level of light that has traversed the porous scattering material. Using, for example, the Beer-Lambert Law, the system can determine a concentration of the gas material in the gas sample. The scattering can greatly increase an optical path length through the porous scattering material, compared with a linear dimension of the porous scattering material. The increased optical path length can allow a gas chamber to shrink in size, thereby decreasing a size of the gas sensing system without a corresponding decrease in a sensitivity and/or an accuracy of the system.

Abstract: Light-emitting diode (LED) devices are described herein. An LED device includes a substrate. The substrate has a top surface and a bottom surface opposite the top surface. The bottom surface has at least one indentation that runs lengthwise across at least a portion of the substrate. The LED device also includes a semiconductor surface mounted device (SMD) over the top surface of the substrate.

Abstract: An optical system is provided. The optical system includes a light emitting diode that generates light emissions. The optical system includes a collimator that receives the light emissions and that generates a collimated beam. The optical system includes an etendue re-shaper that splits the collimated beam into beam parts and that arranges the beam parts adjacent to each other to generate an adjacent beam part arrangement. The optical system includes micro-lens arrays that receive the adjacent beam part arrangement and that generate beams. Each of the beams includes an optimum optical efficiency or a far field intensity distribution.

Abstract: A method for enabling self-aligning light-emitting diodes is provided. The method includes printing a die architecture including solders having a bond line thickness according to a printed circuit board design and placing light-emitting diodes in corresponding placement positions onto the solders. The method includes implementing a reflow process that includes a self-alignment effect for the light-emitting diodes. The self-alignment effect comprises creating surface tension forces while the solders are molten that pull or hold the light-emitting diodes to or at final positions.

Abstract: An optical system is provided. The optical system includes a light emitting diode that generates light emissions. The optical system includes a collimator that receives the light emissions and that generates a collimated beam. The optical system includes an etendue re-shaper that splits the collimated beam into beam parts and that arranges the beam parts adjacent to each other to generate an adjacent beam part arrangement. The optical system includes micro-lens arrays that receive the adjacent beam part arrangement and that generate beams. Each of the beams includes an optimum optical efficiency or a far field intensity distribution.

Abstract: A micro light-emitting diode (?LED) array system can include an image post processor configured to translate received image data to pulse width modulation (PWM) and/or analog current control data, an input frame buffer configured to receive the control data, a plurality of individually controllable ?LEDS of a ?LED array, a return frame buffer that receives data indicating a ?LED electrical output characteristic including an output current, and compare circuitry configured to compare image data from the input and return frame buffers, and transfer comparison data to the image post processor, the image post processor configured to alter individual ?LED control data based on the comparison data.