Abstract: A phosphor layer is attached to an LED with increased precision. In particular, a phosphor ceramic is attached to an LED with glue. During the attachment process, the glue must be hardened and/or cured. The phosphor ceramic includes a hood that contains the glue in the hood as it hardens and/or is cured in order that the phosphor ceramic is properly aligned on the LED. The hood also improves the light extraction by capturing the light emitted from the sides of the LED.

Abstract: This specification discloses spinel-type phosphors that may be advantageously employed in light sources for medical optical coherence tomography (OCT), light sources for medical OCT comprising such phosphors, and OCT systems comprising such light sources.

Abstract: A LED controller for an LED pixel array includes an image frame buffer to receive image data and a standby image buffer connected to the image frame buffer to hold a standby image. A command and control module connected is configured to substitute the standby image in the standby image buffer for the image in the image frame buffer when image data is unavailable.

Abstract: Light emitting devices comprise: one or more light emitting diode (LED) dies in a reflector cup; a first light-scattering layer contacting side surfaces of the LED dies, and a bottom wall and a sidewall of the reflector cup, the first light-scattering layer comprising light-scattering particles and a first binder material; and a second light-scattering layer contacting at least a top surface of the LED dies, and the first light-scattering layer at an interface, the second light-scattering layer comprising phosphor particles and a second binder material.

Abstract: Micro-light emitting diode (uLED) devices comprise: a source wafer comprising a uLED die bonded to a target wafer. Wafer n-contacts are directly bonded to a plurality of die n-contacts; wafer p-contacts are directly bonded to die p-contacts; and wafer dielectric material is directly bonded to die dielectric material; the wafer dielectric material isolates the wafer n-contacts and the wafer p-contacts.

Abstract: Systems are described. A system includes a silicon backplane having a top surface, a bottom surface, and side surfaces and a substrate surrounding the side surfaces of the silicon backplane. The substrate has a top surface, a bottom surface and side surfaces. At least one bond pad is provided on the bottom surface of the substrate. A metal layer is provided on the bottom surface of the substrate and the bottom surface of the silicon backplane and has a first portion electrically and thermally coupled to the bottom surface of the silicon backplane in a central region and second portions that extend between a perimeter region of the silicon backplane and the at least one bond pad. An array of metal connectors is provided on the top surface of the silicon backplane.

Abstract: A camera is described that includes a first imager and a processor communicatively coupled to the first imager. The first imager captures images of a roadway on which a vehicle is located when operating. The processor, when operating, generates a signal to cause a first hybridized device in the vehicle to project a first patterned light on to an object on the roadway, generates a signal to cause the first imager to capture an image of the first patterned light projected on the object, receives the image from the first imager, and detects the object on the roadway based on the first patterned light captured in the image.

Abstract: Micro-light emitting diode (uLED) devices comprise: a plurality of micro-light emitting diodes (uLEDs), each of the uLEDs comprising: a pixel; an N-contact in contact with the pixel and having an N-contact top surface; a P-contact in contact with the pixel and having a P-contact top surface; an N-contact test pad on the N-contact top surface and having an N-contact test pad surface; and a P-contact test pad on the P-contact top surface and having a P-contact test pad surface; and a primary release layer positioned between all of the N-contacts and P-contacts of the uLEDs. Test apparatus and methods of making and testing the same are also provided.

Abstract: An LED retrofit signaling lamp is described herein. The lamp includes a lamp body, which includes a cap, a projection part, and a burner part between the cap and the projection part. Power contacts are exposed from the cap. A projection LED light source is provided in the projection part and angled to provide a projected image near to the vehicle when activated. A signaling LED light source is provided in the burner part angled to emit non-projected light via the projection part at angles that avoid the emitted light being blocked by the projection LED light source. The projection LED light source and the signaling LED light source are electrically coupled to the power contacts in parallel to each other.

Abstract: Micro-light emitting diode (uLED) devices comprise: a plurality of micro-light emitting diodes (uLEDs), each of the uLEDs comprising: a pixel; an N-contact in contact with the pixel and having an N-contact top surface; a P-contact in contact with the pixel and having a P-contact top surface; an N-contact test pad on the N-contact top surface and having an N-contact test pad surface; and a P-contact test pad on the P-contact top surface and having a P-contact test pad surface; and a primary release layer positioned between all of the N-contacts and P-contacts of the uLEDs. Test apparatus and methods of making and testing the same are also provided.

Abstract: Provided are optical transformer devices having a high power efficiency. The device architecture provides uniform current spreading to minimize efficiency droop. The quantum well designs are optimized for both light-emitting diode (LED) and photo diode (PD) operation. A low-loss optical cavity allows efficient transfer of light from the LED junction to the PD junction. The architecture provides a low-loss voltage up- and down-conversion and provides compatibility with production-grade epitaxial growth and wafer fabrication processes.

Abstract: A gas sensing system measures a concentration of first and second gasses in a gas sample disposed in a cavity containing a porous scattering material. The first and second gas each have an absorption peak at a different wavelength. First and second emitters emit light having a spectrum that includes one of the different wavelengths. A single sensor, or multiple sensors, detect at least some of the light emitted by the first and second emitters. A processor determines concentration of the first and second gases from signals from the sensor that indicate intensities of the light from the first and second emitters. When a single sensor is used, the first and second emitters are driven, and the sensor signal detected, at different times. When multiple sensors are used, the sensors detect signals at one of the absorption peaks.

Abstract: A light-emitting diode (LED) array illuminates different objects in, for example, a commercial environment. A camera captures an image of each object under different lighting conditions. Feedback is used by processing circuitry for each image to determine the lighting parameters of the LED array to obtain optimum lighting conditions and the lighting parameters stored. When a new object is illuminated, the lighting parameters for the object are retrieved and used. The lighting parameters may change dependent on ambient conditions, including lighting and time of day.

Abstract: A semiconductor light-emitting device has an emitter matrix with an arrangement of emitter cells interspersed with non-emitter cells. The emitter cell has a semiconductor emitter, and a non-emitter cell does not have a semiconductor emitter. A number of bond pads for connection to a power supply and a plurality of wirebonds are present. Each wirebond extends from a bond pad to the semiconductor emitter of an emitter cell. An imaging arrangement includes a light source for illuminating a scene. The light source has a pair of such semiconductor light-emitting devices. A method of manufacturing such a semiconductor light-emitting device is also described.

Abstract: An electronic device includes a heat dissipation structure that includes one or more openings. An electronic component is disposed on a surface of the heat dissipation structure and over the one or more openings. The electronic component is coupled to the heat dissipation structure by an adhesion material in the one or more openings.

Abstract: A flexible foil printed circuit board substrate is provided. The flexible foil printed circuit board substrate includes at least first and second lands and a flex foil area between pairs of the at least first and second lands. Each of the first and second lands can receive a placement of one or more surface mounting technology components. The flex foil area can include at least two layers including conductive portions connecting the at least first and second lands. The flex foil area can include one or more curved shapes. Outermost ends of the flex foil area can be integrated into the at least first and second lands.

Abstract: Light emitting diode (LED) devices comprise: a stack of semiconductor layers including an active region and a phosphor layer on the semiconductor layers, the phosphor layer comprising: phosphor particles, a binder material, and polydisperse inorganic filler particles. a combined solid volume percentage of the phosphor particles and the polydisperse inorganic filler particles of greater than or equal to 70% and in some embodiments, less than or equal to 90%.

Abstract: A lighting device for frequency-modulated emission of a light-emitting diode (LED). The lighting device allows for higher operating frequencies and has an improved quality of the emitted light signal. Embodiments of the lighting device include an LED; a resonant driver circuit with a tuned circuit that is configured to drive the LED at an operating frequency that is based on parameters of the LED.

Abstract: Circuit boards, LED lighting systems and methods of manufacture are described. A circuit board includes a ceramic carrier and a body on the ceramic carrier. The body includes dielectric layers and slots formed completely through a thickness of the dielectric layers. The slots are filled with a dielectric material. A conductive pad is provided on a surface of each of the slots opposite the ceramic carrier.

Abstract: A two-part device, automotive lighting unit and method of manufacture are described herein. A two-part device includes an assembly. The assembly includes a first part having a first fixation face and a second part separate from the first part. The second part has a second fixation face. The first and second parts are arranged adjacent one another with the first fixation face in contact with the second fixation face. The assembly further includes a circlip fixation position that has a rounded shape transverse to the fixation face. The two-part device also includes a circlip, which engages the rounded shape at the circlip fixation position, fixing the first and second parts together.