Abstract: A heat sink is provided having at least one receiving section configured for thermal coupling to at least one lighting module. The heat sink includes at least two connection sections on opposite sides of the at least one receiving section. Each of the at least two connection sections includes at least one reference pin protruding at least partially from a first surface of the at least one connection section and at least one alignment recess protruding into the first surface of the at least one connection section such that the heat sink is configured for thermal coupling to another heat sink via the at least two connection sections.

Abstract: LED arrays comprise patterned reflective grids that enhance the contrast ratio between adjacent pixels or adjacent groups of pixels in the array. The pattern on the reflective grid may also improve adhesion between the reflective grid and one or more layers of material disposed on and attached to the reflective grid. The reflective grid may be formed, for example, as a reflective metal grid, a grid of dielectric reflectors, or a grid of distributed Bragg reflectors (DBRs). If formed as a metal grid, the reflective grid may provide electrical contact to one side of the LED diode junctions. This specification also discloses fabrication processes for such LED arrays.

Abstract: Optical filters are used to compensate for changes in LED and pcLED performance resulting from technological advances in device design or manufacturing, with for example the filtered optical output from later generation devices matching or substantially matching the optical performance of earlier generation legacy devices. This can allow the advanced generation devices to be substituted in applications previously supported by the legacy devices, even if the optical performance of the unfiltered advanced generation devices does not satisfy the optical performance specifications required by the application. Somewhat paradoxically, the advantages of using the filters in combination with the advanced generation devices may arise from the filters making the optical performance of the devices worse according to one or more figures of merit.

Abstract: A phosphor layer includes phosphor particles and small typically non-luminescent particles, such as nanoparticles. The small particles improve adherence, coherence, and homogeneity of the phosphor layer by accumulating at contact points of the phosphor particles. Their diameter is smaller than those of the phosphor particles. The small particles may be co-deposited with the phosphor particles during electrophoretic deposition, increasing the formulation conductivity during deposition to increase transport speed. The small particles may be catalysts that aid in removal of organic material included in the electrophoretic deposition process.

Abstract: In a projection display system, a polarizing beamsplitter can split an unpolarized light beam into a first internal beam and a second internal beam, which can have polarization states that are orthogonal. A polarization rotator, such as a half-wave plate, can rotate a plane of polarization of at least one of the first internal beam or the second internal beam. A beam aligner, such as a second polarizing beamsplitter, can change a propagation direction of at least one of the first internal beam or the second internal beam. The polarization rotator and the beam aligner each can adjust at least one of the first or second internal beams such that the first internal beam forms a first exiting beam and the second internal beam forms a second exiting beam. The first exiting beam and the second exiting beam can be adjacent and parallel and have parallel polarization states.

Abstract: A light emitting device includes an LED having a light emitting top surface and sidewalls. A phosphor structure is attached to the light emitting surface of the LED. The phosphor structure has a light emitting top surface facing away from the LED light emitting surface, and sidewalls. A light reflective material is arranged to cover the sidewalls of the LED and the phosphor structure. A light absorptive region is defined in the light reflective material around a perimeter of the light emitting surface of the phosphor structure. The light absorptive region may be spaced apart from the perimeter of the phosphor structure by a gap. The light absorptive region may be formed by ultraviolet laser illumination of the light reflecting material.

Abstract: A light-emitting device includes: a semiconductor diode structure, a reflector, a wavelength-converting layer, and an intermediate spacer between the diode structure and the wavelength-converting layer. The diode structure emits diode output light at a vacuum wavelength ?0 to propagate within the diode structure. The reflector is on the back diode structure and internally reflects diode internally incident output light. The wavelength-converting layer is positioned with its back surface facing and spaced-apart from a front surface of the diode structure, and absorbs diode output light at ?0 and emits down-converted light at a vacuum wavelength ?1>?0, which exits the wavelength-converting layer through its front surface.

Abstract: An LED lighting system, an automotive lighting system and a method of detecting failure in an LED lighting system are described herein. An LED lighting system includes an LED lighting circuit and a failure detection circuit. The LED lighting circuit includes a first string of a first plurality of LEDs electrically coupled in series with a first inductor and a second string of a second plurality of LEDs electrically coupled in series with a second inductor. The first and second strings each have an equal total forward voltage. The failure detection circuit is configured to detect a failure in the LED lighting circuit based on detection of a voltage difference between the first inductor and the second inductor.

Abstract: A lighting system includes an LED array having a plurality of LED pixels and a power controller. The power controller adjusts a supply voltage for powering the LED pixels based on one or more conditions of the LED array. The power controller may determine the supply voltage based on process data of the LED array. The power controller may adjust the supply voltage based on an operating temperature of the LED pixels and the amplitude of a current driving the LED pixels.

Abstract: Described are light emitting diode (LED) devices including a quantum well comprising an indium gallium nitride (InGaN) well and a barrier layer. The indium gallium nitride (InGaN) well has an indium concentration greater than 18% mole fraction. The LED device has a dominant wavelength greater than 605 nm at a current density of greater than or equal to 2 A/cm2.

Abstract: Described are light emitting diode (LED) devices including a quantum well on a superlattice structure. The LED device has a dominant wavelength greater than 520 nm. The dominant wavelength changes less than 7 nm when the current density increases from 10 A/cm2 to 100 A/cm2 and a junction temperature of the device changes less than 20° C.

Abstract: An LED retrofit lamp for a projection headlight system comprises a heat dissipating body portion and a substantially rectangular substrate. A first LED group is mounted on a first surface of the substrate and a second LED group is mounted on a second surface. A support bracket is configured to engage longitudinal sides of the substrate to mechanically support the substrate in alignment with a central optical axis of the headlight system so that light emitted by the first and second LED groups parallel to the first and second surfaces illuminates corresponding top and bottom segments of a cooperating reflector with sufficient intensity for projection headlight system to form a beam having substantially homogenous light intensity.

Abstract: A lighting device for mounting to an optical element includes a center ring, a heat sink, at least one housing part and at least one fan. The center ring has a first side and a second side and includes a mechanical interface for mechanically coupling the center ring to the optical element. The heat sink includes a lighting module mounting part for connection with at least one relative to the center ring with the entire at least one hollow structure over the first side of the lighting module and at least one hollow structure within the heat sink. The heat sink is positioned center ring. The at least one fan includes at least one blade and a driver. At least a portion of the at least one fan is contained within the at least one housing part with the at least one blade within the at least one hollow structure.

Abstract: A method for manufacturing light emitting elements is described and includes providing an un-coated light converting platelet. The un-coated light converting platelet has a top surface, a bottom surface, and side surfaces. A plurality of LED dies is provided. Side surfaces of the un-coated light converting platelet are coated with an at least partly reflective material to form a coated light converting platelet. The coated light converting platelet is separated into light converting tiles. An outline of the light converting tiles substantially corresponds to an outline of one of the plurality of LED dies. The light converting tiles and the plurality of LED dies are assembled to form light emitting elements.

Abstract: A lighting unit includes a power supply that provides a maximum voltage and multiple LED lighting circuits. Each of the LED lighting circuits includes an LED string, multiple switches, a switching sequencer and a switch controller. The LED string includes multiple series-connected emitters having a total forward voltage that exceeds the maximum voltage of the power supply. Each of the switches is coupled in parallel with a respective LED of the LED string. The switching sequencer provides a sequence of switching patterns such that a total forward voltage of simultaneously active LEDs in each switching pattern does not exceed the maximum voltage of the power supply. The switch controller actuates switches according to each of the switching patterns in the sequence. The LED string of each of the plurality of LED lighting circuits is arranged in a two-dimensional array.

Abstract: Methods of manufacturing a light emitting diode (LED) comprising bonding a transparent support wafer to a growth wafer are described. The transparent support wafer has a laser lift-off (LLO) release layer and inorganic bonding layer. The growth wafer has a matching inorganic bonding layer which is bonded to the inorganic bonding layer of the transparent support wafer. After processing, the LLO release layer is removed, separating the transparent support wafer and device wafer, and making the transparent support wafer available for reuse.

Abstract: An array of light emitting devices is mounted on a support surface with the transparent growth substrate (e.g., sapphire) facing up. A photoresist layer is then deposited over the top surface of the growth substrate, followed by depositing a reflective material over the top and side surfaces of the light emitting devices to encapsulate the light emitting devices. The top surfaces of the light emitting devices are then ground down to remove the reflective material over the top surface of the photoresist. The photoresist is then dissolved to leave a cavity over the growth substrate having reflective walls. The cavity is then filled with a phosphor. The phosphor-converted light emitting devices are then singulated to form packaged light emitting devices. All side light is reflected back into the light emitting device by the reflective material and eventually exits the light emitting device toward the phosphor. The packaged light emitting devices, when energized, appear as a white dot with no side emission (e.g.

Abstract: This specification discloses LEDs, pcLEDs, and arrays of LEDs or pcLEDs in which the LEDs or pcLEDs comprise a structured high refractive index coating on a light output surface that improves light extraction from the device through the light output surface. The coating is formed additively instead of by a subtractive process that removes material from the surface, and consequently can avoid the disadvantages associated with subtractive processes.

Abstract: Light-emitting devices are described herein. A light-emitting device includes a hybridized device having a top surface and a bottom surface and a packaging substrate comprising a metal inlay in an opening in the packaging substrate and conductive vias. The metal inlay is thermally coupled to the bottom surface of the hybridized device. Conductive contacts are disposed on a bottom surface of the packaging substrate, each electrically coupled to one of the plurality of conductive vias. Conductive connectors electrically coupled between the top surface of the hybridized device and the top surface of the packaging substrate. Each of the conductive connectors is electrically coupled to a respective one of the conductive contacts on the bottom surface of the packaging substrate by a respective on of the conductive vias.

Abstract: A device is described that includes a carrier that has a plurality of light-emitting diode (LED) mounting areas. Each of the LED mounting areas includes a pair of contact pads, which are electrically coupled to the LED mounting area in a first subset of the plurality of LED mounting areas or electrically connected in series with a shunting element in the respective LED mounting area in a second subset of the plurality of LED mounting areas. In some embodiments, LEDs may be placed in the first subset of the plurality of LED mounting areas.