Abstract: A lamp having a substantially hollow columnar body. A plurality of light emitting diodes are disposed on the columnar body. A plurality of fins are also disposed on the columnar body. A base member is included at a first end of the columnar body and provides a means for electrical connection. An electronics module is included within the columnar body communication with the base member for converting AC current to DC current.

Abstract: A plurality of toy and accessory figurines are provided which may be arranged in any number of configurations to provide a response upon the formation of a closed electrical circuit. The toy figurines comprise two electrical contacts which, when closed with an external connection source, provide a response stimuli, such as one or a combination of light, sound and/or motion. The toy figurines may be configured to provide the closed electrical circuit. Alternatively, direct skin contact with the electrical contacts may provide the closed electrical circuit. The accessory figurines provide a further level of interaction. The accessory toy figurines comprise a magnetic switch which is actuated between an open configuration and a closed configuration. The magnetic switch is actuated to a closed configuration to close the electrical circuit when in proximity with a conductive metal, such as the electrical contact of the toy figurine, to deliver a response stimuli.

Abstract: A plurality of toy and accessory figurines are provided which may be arranged in any number of configurations to provide a response upon the formation of a closed electrical circuit. The toy figurines comprise two electrical contacts which, when closed with an external connection source, provide a response stimuli, such as one or a combination of light, sound and/or motion. The toy figurines may be configured to provide the closed electrical circuit. Alternatively, direct skin contact with the electrical contacts may provide the closed electrical circuit. The accessory figurines provide a further level of interaction. The accessory toy figurines comprise a magnetic switch which is actuated between an open configuration and a closed configuration. The magnetic switch is actuated to a closed configuration to close the electrical circuit when in proximity with a conductive metal, such as the electrical contact of the toy figurine, to deliver a response stimuli.

Abstract: An illumination apparatus includes a linear array of light emitting diode (LED) chips disposed on a support. A linear reflector assembly has a light coupling reflector portion and a one dimensional light collimation or focusing portion. The linear reflector assembly is secured to the support parallel with the linear array of LED chips. An encapsulant is disposed in the light coupling reflector portion of the linear reflector assembly and pots the LED chips. An elongate phosphor element is disposed over the encapsulant such that the light coupling reflector portion and the encapsulant enhance light coupling between the LED chips and the elongate phosphor element, and the one-dimensional light collimation or focusing portion one-dimensionally collimates or focuses light emitted by the combination of the LED chips and the elongate phosphor element.

Abstract: A traffic signal housing includes a bottom housing element that has a radius and a power circuit that is connected to an external source via one or more pluggable connectors through the bottom housing element. Three distinct arrays of LEDs provide a tri-color signal, wherein each array is powered by the power circuit. A distribution cover is coupled to the bottom housing element to enclose the power circuit and the LED arrays.

Abstract: A lamp assembly with a solid, opaque panel perforated by at least one aperture producing a silhouetted symbol representative of a traffic or pedestrian message and a reflective coating affixed to the light-facing inner side of the panel that reflects light. The lamp assembly further includes at least one optical element that scatters the reflected light through the mask at a plurality of angles relative to the path of the emitted light passing directly from the light source and a low reflective, dark colored layer affixed to the outer side of the mask in order to provide contrast with the light passing through the pattern of apertures.

Abstract: Light emitting apparatuses including warm white LED based lights including a semiconductor light source and a phosphor material including a yellow emitting phosphor, a red emitting phosphor, and, optionally, at least one of a green, blue or green-blue emitting phosphor.

Abstract: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).

Abstract: A light emitting chip is disposed on a support surface. A plurality of bonding bumps are disposed in a gap between the light emitting chip and the support surface. The plurality of bonding bumps provide at least one electrical power input path to the light emitting chip. An underfill comprising underfill material is disposed in the gap between the light emitting chip and the support surface such that the underfill substantially fills the gap but does not form a fillet extending outside the gap over sidewalls of the light emitting chip. The underfill is configured to provide at least one of (i) mechanical support for the light emitting chip and (ii) a thermal conduction path from the light emitting chip to the support surface.

Abstract: In a method for fabricating a flip-chip light emitting diode device, epitaxial layers are deposited on a sapphire growth substrate to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die. The device die is flip chip bonded to a mount. The flip chip bonding includes securing the device die to the mount by bonding at least one electrode of the device die to at least one bonding pad of the mount. Subsequent to the flip chip bonding, the growth substrate of the device die is removed via the application of laser light.

Abstract: A light engine comprises a plurality of LEDs and a plurality of optical elements each cooperating with a respective LED. The optical elements broaden the off-axis angle from the respective LEDs to provide a more uniform illumination at a target plane.

Abstract: A luminaire that can provide a beam pattern having a substantially uniform illuminance across a target plane includes a plurality of LEDs mounted on a support and at least one reflector fixed with respect to the support and cooperating with the plurality of LEDs.

Abstract: A linear LED light module and system includes a heat sink, a printed circuit board, a plurality of LEDs, a power supply housing, a flexible electrical conductor, a first electrical connector, a second electrical connector, and a power supply. The heat sink is elongated in an axial direction along a longitudinal axis that is parallel with a greatest dimension of the heat sink. The PCB is in thermal communication with the heat sink and includes circuitry. The plurality of LEDs mount to the PCB and are in electrical communication with the circuitry of the PCB. The power supply housing connects to the heat sink. The flexible electrical conductor includes at least two wires that are configured to accommodate an AC line voltage of at least 120 VAC. The first electrical connector is at a first end of the electrical conductor. The second electrical connector is at a second end of the electrical conductor.

Abstract: Systems and methods are described that facilitate providing a user with interchangeable phosphor-coated shells, or envelopes, for generate different shades and intensities of white light from a single UV light source. The interchangeability of the low-cost phosphor-coated envelopes permits the use of a single light engine, which is the more expensive component of a solid state lamp. In this manner, consumers are provided with a greater number of lighting choices at low cost than can be achieved using conventional single-envelope lamps.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: A method for the manufacturing of white LEDs is proposed, which can achieve a tunable color rendering index (CRI) or luminosity through the use of at least two phosphor composition layers of essentially the same emission color coordinates, each composition including at least one individual phosphor compound. The method allows to optimize the devices for CRI at a given minimal luminosity requirement, or vice versa.

Abstract: A lamp that can be used in a refrigerated or cold environment where an overall light output measured on a target plane is not significantly reduced due to condensation or fog includes a housing including a translucent cover, an LED disposed in the housing, and an anti-fog film. The LED is disposed in the housing with relation to the translucent cover such that light from the LED passes through the cover. The anti-fog film is disposed on at least one of the surfaces of the translucent cover.

Abstract: A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.

Abstract: A method of applying at least two phosphors to an LED, wherein a first phosphor material having a lower absorption, shorter luminescence decay time, and/or lower thermal quenching than a second phosphor material is positioned closer to the LED than the second phosphor. Such an arrangement provides a light emitting device with improved lumen output and color stability over a range of drive currents.

Abstract: There is provided a phosphor down converting element based on fluoropolymer resin and a method for fabricating the same. There is further provided a method for using said phosphor down converting element to generate white light from a radiation source. The method for fabricating phosphor down converting element includes preparing an appropriate phosphor powder mixture that is capable of absorbing a first band of wavelengths and emitting a second band of wavelengths being greater in length than the first bands, incorporating the phosphor powder mixture into or on a phosphor carrier element comprising a fluoropolymer material, and molding the phosphor down converting elements into useful shapes. Fluoropolymers are the most chemically inert of all plastics, can withstand both extremely high and low temperatures, and show a resistance to weavering and UV degradation, making fluoropolymers optimal for use as a phosphor carrier.