Abstract: A surface mount LED package having a tight footprint and small vertical image size is fabricated by a method comprising: forming light emitting diode chips each having a substrate and a plurality of layers configured to emit electroluminescence responsive to electrical energizing; forming electrical vias in a sub mount, the electrical vias passing from a front side of the sub-mount to a back-side of the sub-mount; flip chip bonding the light emitting diode chips on the front-side of the sub mount such that each light emitting diode chip electrically contacts selected electrical vias; thinning or removing the substrates of the flip-chip bonded light emitting diode chips; and after the thinning, disposing a phosphor over the flip chip bonded light emitting diode chips.

Abstract: A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.

Abstract: A system creates a desired current level within a traffic signal. A power supply unit receives an external power signal and transforms the power signal to a lamp current. A pulse generator monitors the value of the lamp current and automatically adjust the power usage of the current sink circuit to maintained a predefined current amplitude. A current pulser generates square current pulses at a frequency based at least in part on the frequency of the lamp current. A current sink superimposes the rectangular current pulse onto the lamp current and outputs a combined power signal to the alternating current power line.

Abstract: A signal is described herein that provides light output for automotive, rail, ship traffic and/or illumination control that includes a light emitting diode (LED) array, wherein the LED array includes three groups of disparate colored LEDs. A power supply unit provides independent power to each of the three LED groups. Each LED group power supply unit includes an input controlled switch connected to a power line to provide power to the LED array. An input under voltage/over voltage circuit monitors the voltage level of the power line and for enabling and/or disables the input controlled switch according to the voltage level of the power line. A flyback transformer converts the power received from the power line from an alternating or a continuous current signal to a direct current signal output to the LED array.

Abstract: An illuminated sign (88) includes a flexible electrical power cord (100) including first and second parallel conductors (112, 114) surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (112, 114). A plurality of light emitting diode (LED) devices (102) are affixed to the cord (100). Each LED device (102) includes an LED (104) having a positive lead (130P) electrically communicating with the first parallel conductor (112) and a negative lead (130P) electrically communicating with the second parallel conductor (114). A stencil (92) defines a selected shape, and the electrical cord (100) is arranged on the stencil (92). Power conditioning electronics (210, 220) disposed away from the stencil (92) electrically communicate with the first and second parallel conductors (112, 114) of the electrical power cord (100). The power conditioning electronics (210, 220) power the LED devices (102) via the parallel conductors (112, 114).

Abstract: A method of manufacturing a lighting module comprises: mounting one or more light emitting diode (LED) packages on a circuit board to define a lighting unit; and injection overmolding the entire lighting unit except the one or more LED packages using a single type of overmolding material. A lighting module comprises: one or more LED packages mounted on a circuit board; and an injection overmolding sealing the circuit board, the injection overmolding not having openings corresponding to piece holding pins, the injection overmolding not covering at least a light emitting portion of the one or more LED packages.

Abstract: A string light engine includes a plurality of LEDs, a plurality of IDC connectors, and an insulated flexible conductor. Each IDC connector is in electrical communication with at least one of the plurality of LEDs and is operatively mechanically connected to at least one of the plurality of LEDs. The IDC connectors attach to the conductor.

Abstract: A luminaire includes a fixture housing, a plurality of LEDs disposed on a mounting surface in the fixture housing, and at least one reflector disposed in the housing. A center of each LED is positioned along a line and each LED faces towards an associated target surface that is vertically spaced from the luminaire. The at least one reflector includes first and second reflective surfaces. Each reflective surface is configured with respect to the line on which the LEDs are positioned so that the first reflective surface and the second reflective surface each reflect light from each of the LEDs in a substantially same direction that is offset from a vertical axis.

Abstract: A light emitting device (A) includes a semiconductor die (100).

Abstract: Light emitting devices including backlights having a light source and a phosphor material including a complex fluoride phosphor activated with Mn4+ which may include at least one of (A) A2[MF5]:Mn4+; where A is selected from Li, Na, K, Rb, Cs, NH4, and combinations thereof; and where M is selected from Al, Ga, In, or combinations thereof; (B) A3[MF6]:Mn4+, where A is selected from Li, Na, K, Rb, Cs, NH4, and combinations thereof; and where M is selected from Al, Ga, In, or combinations thereof; (C) Zn2[MF7]:Mn4+, where M is selected from Al, Ga, In, or combinations thereof; and (D) A[In2F7]:Mn4+ where A is selected from Li, Na, K, Rb, Cs, NH4, or combinations thereof.

Abstract: A light emitting apparatus including a phosphor blend including two or more phosphors to provide an emission spectrum simulating the spectral power distribution of a CIE reference illuminant across at least a certain spectral range. Such an apparatus is particularly suited for color-critical applications.

Abstract: A lighting apparatus (10) comprises a light engine (12) producing ultra violet radiation. An enclosure (14) surrounds a radiation generating area of the light engine (12) to encompass the radiation. At least one wall (28) of the enclosure (14) is substantially reflective of the ultraviolet radiation. The enclosure (14) includes a replaceable top portion (30) which includes a phosphor portion (32). The phosphor portion (32) is spaced from the radiation generating area of the light engine (12) by a height of the enclosure (14).

Abstract: In a light emitting device, a light emitting chip (12, 112) includes a stack of semiconductor layers (14) and an electrode (24, 141, 142) disposed on the stack of semiconductor layers. A support (10, 10?, 110, 210) has a generally planar surface (30) supporting the light emitting chip in a flip-chip fashion. An electrically conductive chip attachment material (40, 41, 141, 142) is recessed into the generally planar surface of the support such that the attachment material does not protrude substantially above the generally planar surface of the support. The attachment material provides electrical communication between the electrode of the light emitting chip and an electrically conductive path (36, 36?) of the support. Optionally, at least the stack of semiconductor layers and the electrode of the light emitting chip are also recessed into the generally planar surface of the support.

Abstract: An optoelectronic device assembly includes a circuit board and an optoelectronic device disposed on the circuit board and electrically connected with the circuit board. An annular gasket is disposed on the circuit board and surrounds the optoelectronic device. A sealant is disposed over and seals at least a portion of the circuit board and also covers at least an outer annular portion of the annular gasket. The sealant is not disposed over the optoelectronic device. In a method, an optoelectronic device is disposed on a circuit board, the disposing including electrically connecting the optoelectronic device with the circuit board. An annular gasket is disposed on the circuit board to surround the optoelectronic device. The circuit board is sealed with a sealant that also covers at least an outer annular portion of the annular gasket, but does not cover the optoelectronic device.

Abstract: Phosphor compositions having the formula (Ba,Sr,Ca)SiO4:Eu and light emitting devices including a semiconductor light source and the above phosphor. Also disclosed are blends of (Ba,Sr,Ca)SiO4:Eu and one or more additional phosphors and light emitting devices incorporating the same. Preferred blends include (Sr,Ba,Ca)2SiO4:Eu and at least one of (Sr,Mg,Ca,Ba,Zn)2P2O7:Eu,Mn; (Ca,Sr,Ba,Mg)5(PO4)3(Cl,F,OH):Eu,Mn; (Sr,Ba,Ca)MgAl10O17:Eu,Mn; and Mg4FGeO6:Mn4+; and one or more garnet phosphors having the general formula (Y,Gd,La,Lu,T,Pr,Sm)3(Al,Ga,In)5O12:Ce.

Abstract: An LED lamp that includes a piezoelectric fan or synthetic jet to cool component of the lamp is disclosed.

Abstract: A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.

Abstract: A lamp that can be used in a refrigerated or cold environment where an overall light output measured on a target plane is not significantly reduced due to condensation or fog includes a housing including a translucent cover, an LED disposed in the housing, and an anti-fog film. The LED is disposed in the housing with relation to the translucent cover such that light from the LED passes through the cover. The anti-fog film is disposed on at least one of the surfaces of the translucent cover.

Abstract: An LED light system that includes an LED and a synthetic jet actuator to cool the LED as disclosed.