Abstract: In a light emitting package (8), at least one light emitting chip (12, 14, 16, 18) is supported by a board (10). A light transmissive encapsulant (30) is disposed over the at least one light emitting chip and over a footprint area (32) of the board. A light transmissive generally conformal shell (40) is disposed over the encapsulant and has an inner surface (44) spaced apart by an air gap (G) from, and generally conformal with, an outer surface (34) of the encapsulant. At least one phosphor (50) is disposed on or embedded in the conformal shell to output converted light responsive to irradiation by the at least one light emitting chip. A thermally conductive filler material disposed in the generally conformal shell (40) is effective to enhance a thermal conductivity of the composite shell material to a value higher than 0.3 W/(m·K).

Abstract: A light engine comprises a plurality of LEDs and a plurality of optical elements each cooperating with a respective LED. The optical elements broaden the off-axis angle from the respective LEDs to provide a more uniform illumination at a target plane.

Abstract: A luminaire that can provide a beam pattern having a substantially uniform illuminance across a target plane includes a plurality of LEDs mounted on a support and at least one reflector fixed with respect to the support and cooperating with the plurality of LEDs.

Abstract: Systems and methods are described that facilitate providing a user with interchangeable phosphor-coated shells, or envelopes, for generate different shades and intensities of white light from a single UV light source. The interchangeability of the low-cost phosphor-coated envelopes permits the use of a single light engine, which is the more expensive component of a solid state lamp. In this manner, consumers are provided with a greater number of lighting choices at low cost than can be achieved using conventional single-envelope lamps.

Abstract: A linear LED light module and system includes a heat sink, a printed circuit board, a plurality of LEDs, a power supply housing, a flexible electrical conductor, a first electrical connector, a second electrical connector, and a power supply. The heat sink is elongated in an axial direction along a longitudinal axis that is parallel with a greatest dimension of the heat sink. The PCB is in thermal communication with the heat sink and includes circuitry. The plurality of LEDs mount to the PCB and are in electrical communication with the circuitry of the PCB. The power supply housing connects to the heat sink. The flexible electrical conductor includes at least two wires that are configured to accommodate an AC line voltage of at least 120 VAC. The first electrical connector is at a first end of the electrical conductor. The second electrical connector is at a second end of the electrical conductor.

Abstract: In a lighting package, a printed circuit board supports at least one light emitting die. A light transmissive cover is disposed over the at least one light emitting die. A phosphor is disposed on or inside of the light transmissive dome-shaped cover. The phosphor outputs converted light responsive to irradiation by the at least one light emitting die. An encapsulant substantially fills an interior volume defined by the light-transmissive cover and the printed circuit board.

Abstract: A method for the manufacturing of white LEDs is proposed, which can achieve a tunable color rendering index (CRI) or luminosity through the use of at least two phosphor composition layers of essentially the same emission color coordinates, each composition including at least one individual phosphor compound. The method allows to optimize the devices for CRI at a given minimal luminosity requirement, or vice versa.

Abstract: A lamp that can be used in a refrigerated or cold environment where an overall light output measured on a target plane is not significantly reduced due to condensation or fog includes a housing including a translucent cover, an LED disposed in the housing, and an anti-fog film. The LED is disposed in the housing with relation to the translucent cover such that light from the LED passes through the cover. The anti-fog film is disposed on at least one of the surfaces of the translucent cover.

Abstract: A packaging method comprises: forming a circuit board by forming a substantially continuous conductive layer on an insulating board and removing selected portions of the continuous conductive layer to define an electrically conductive trace; laser cutting the electrically conductive trace to define sub-traces electrically isolated from each other by a laser-cut gap formed by the laser cutting; and bonding a light emitting diode (LED) chip to the circuit board across or adjacent to the laser-cut gap, the bonding including operatively electrically connecting an electrode of the LED chip to one of the sub-traces without using an interposed submount. A semiconductor package comprises an LED chip flip-chip bonded to sub-traces of an electrically conductive trace of a circuit board, the sub-traces being electrically isolated from each other by a narrow gap of less than or about 100 microns.

Abstract: A method of applying at least two phosphors to an LED, wherein a first phosphor material having a lower absorption, shorter luminescence decay time, and/or lower thermal quenching than a second phosphor material is positioned closer to the LED than the second phosphor. Such an arrangement provides a light emitting device with improved lumen output and color stability over a range of drive currents.

Abstract: There is provided a phosphor down converting element based on fluoropolymer resin and a method for fabricating the same. There is further provided a method for using said phosphor down converting element to generate white light from a radiation source. The method for fabricating phosphor down converting element includes preparing an appropriate phosphor powder mixture that is capable of absorbing a first band of wavelengths and emitting a second band of wavelengths being greater in length than the first bands, incorporating the phosphor powder mixture into or on a phosphor carrier element comprising a fluoropolymer material, and molding the phosphor down converting elements into useful shapes. Fluoropolymers are the most chemically inert of all plastics, can withstand both extremely high and low temperatures, and show a resistance to weavering and UV degradation, making fluoropolymers optimal for use as a phosphor carrier.

Abstract: A light emitting apparatus includes a support having circuitry disposed thereon, at least one light emitting diode (LED) chip mounted on the support and in electrical communication with the circuitry and a reflective layer on the support adjacent the at least one chip.

Abstract: A surface mount LED package having a tight footprint and small vertical image size is fabricated by a method comprising: forming light emitting diode chips each having a substrate and a plurality of layers configured to emit electroluminescence responsive to electrical energizing; forming electrical vias in a sub mount, the electrical vias passing from a front side of the sub-mount to a back-side of the sub-mount; flip chip bonding the light emitting diode chips on the front-side of the sub mount such that each light emitting diode chip electrically contacts selected electrical vias; thinning or removing the substrates of the flip-chip bonded light emitting diode chips; and after the thinning, disposing a phosphor over the flip chip bonded light emitting diode chips.

Abstract: A system creates a desired current level within a traffic signal. A power supply unit receives an external power signal and transforms the power signal to a lamp current. A pulse generator monitors the value of the lamp current and automatically adjust the power usage of the current sink circuit to maintained a predefined current amplitude. A current pulser generates square current pulses at a frequency based at least in part on the frequency of the lamp current. A current sink superimposes the rectangular current pulse onto the lamp current and outputs a combined power signal to the alternating current power line.

Abstract: A signal is described herein that provides light output for automotive, rail, ship traffic and/or illumination control that includes a light emitting diode (LED) array, wherein the LED array includes three groups of disparate colored LEDs. A power supply unit provides independent power to each of the three LED groups. Each LED group power supply unit includes an input controlled switch connected to a power line to provide power to the LED array. An input under voltage/over voltage circuit monitors the voltage level of the power line and for enabling and/or disables the input controlled switch according to the voltage level of the power line. A flyback transformer converts the power received from the power line from an alternating or a continuous current signal to a direct current signal output to the LED array.

Abstract: An illuminated sign (88) includes a flexible electrical power cord (100) including first and second parallel conductors (112, 114) surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (112, 114). A plurality of light emitting diode (LED) devices (102) are affixed to the cord (100). Each LED device (102) includes an LED (104) having a positive lead (130P) electrically communicating with the first parallel conductor (112) and a negative lead (130P) electrically communicating with the second parallel conductor (114). A stencil (92) defines a selected shape, and the electrical cord (100) is arranged on the stencil (92). Power conditioning electronics (210, 220) disposed away from the stencil (92) electrically communicate with the first and second parallel conductors (112, 114) of the electrical power cord (100). The power conditioning electronics (210, 220) power the LED devices (102) via the parallel conductors (112, 114).

Abstract: A method of manufacturing a lighting module comprises: mounting one or more light emitting diode (LED) packages on a circuit board to define a lighting unit; and injection overmolding the entire lighting unit except the one or more LED packages using a single type of overmolding material. A lighting module comprises: one or more LED packages mounted on a circuit board; and an injection overmolding sealing the circuit board, the injection overmolding not having openings corresponding to piece holding pins, the injection overmolding not covering at least a light emitting portion of the one or more LED packages.

Abstract: A string light engine includes a plurality of LEDs, a plurality of IDC connectors, and an insulated flexible conductor. Each IDC connector is in electrical communication with at least one of the plurality of LEDs and is operatively mechanically connected to at least one of the plurality of LEDs. The IDC connectors attach to the conductor.

Abstract: A light emitting device (A) includes a semiconductor die (100).

Abstract: A luminaire includes a fixture housing, a plurality of LEDs disposed on a mounting surface in the fixture housing, and at least one reflector disposed in the housing. A center of each LED is positioned along a line and each LED faces towards an associated target surface that is vertically spaced from the luminaire. The at least one reflector includes first and second reflective surfaces. Each reflective surface is configured with respect to the line on which the LEDs are positioned so that the first reflective surface and the second reflective surface each reflect light from each of the LEDs in a substantially same direction that is offset from a vertical axis.