Abstract: A linear LED light module and system includes a heat sink, a printed circuit board, a plurality of LEDs, a power supply housing, a flexible electrical conductor, a first electrical connector, a second electrical connector, and a power supply. The heat sink is elongated in an axial direction along a longitudinal axis that is parallel with a greatest dimension of the heat sink. The PCB is in thermal communication with the heat sink and includes circuitry. The plurality of LEDs mount to the PCB and are in electrical communication with the circuitry of the PCB. The power supply housing connects to the heat sink. The flexible electrical conductor includes at least two wires that are configured to accommodate an AC line voltage of at least 120 VAC. The first electrical connector is at a first end of the electrical conductor. The second electrical connector is at a second end of the electrical conductor.

Abstract: A luminaire includes a fixture housing, a plurality of LEDs disposed on a mounting surface in the fixture housing, and at least one reflector disposed in the housing. A center of each LED is positioned along a line and each LED faces towards an associated target surface that is vertically spaced from the luminaire. The at least one reflector includes first and second reflective surfaces. Each reflective surface is configured with respect to the line on which the LEDs are positioned so that the first reflective surface and the second reflective surface each reflect light from each of the LEDs in a substantially same direction that is offset from a vertical axis.

Abstract: An LED device including an LED chip and a lens positioned apart from the chip and coated with a uniform thickness layer of fluorescent phosphor for converting at least some of the radiation emitted by the chip into visible light. Positioning the phosphor layer away from the LED improves the efficiency of the device and produces more consistent color rendition. The surface area of the lens is preferably at least ten times the surface area of the LED chip. For increased efficiency, the reflector and submount can also be coated with phosphor to further reduce internal absorption.

Abstract: In a method for fabricating a flip-chip light emitting diode device, epitaxial layers (14, 114) are deposited on a growth substrate (16, 116) to produce an epitaxial wafer. A plurality of light emitting diode devices are fabricated on the epitaxial wafer. The epitaxial wafer is diced to generate a device die (10, 110). The device die (10, 110) is flip chip bonded to a mount (12, 112). The flip chip bonding includes securing the device die (10, 110) to the mount (12, 112) by bonding at least one electrode (20, 22, 120) of the device die (10, 110) to at least one bonding pad (26, 28, 126) of the mount (12, 112). Subsequent to the flip chip bonding, a thickness of the growth substrate (16, 116) of the device die (10, 110) is reduced.

Abstract: A lighting apparatus for emitting white light including a semiconductor light source emitting radiation with a peak at from about 250 nm to about 500 nm; a first phosphor having a peak emission between about 450 and 550 nm; and a second phosphor having a peak emission between about 615 and 670 nm; wherein the overall emission spectrum of the lighting apparatus has a depression between about 550 and 615 nm, said depression extending to between about 5% and 25% of the highest intensity of the emission spectrum of the lighting apparatus in the region from 400 to 700 nm. In this apparatus, the red-green color contrast is increased versus the referent illuminant.

Abstract: Phosphor compositions having the formula LlMmAaGgPpQqNnZz:Ce3+, where L is at least one of Li, Na, K, Rb, and/or Cs; M is at least one of Be, Mg, Ca, Sr, Ba, Mn, Sn, Pb, and/or Zn; A is at least one of Bi, Sb, In, Sc, Y, and/or any of the rare earth elements; G is Si and/or Ge; Q is at least one of O, S, and/or Se; Z is at least one of F, Cl, Br, and/or I; and wherein 0?l?1, 2.5?m?5, 1.5?a?2.5, 2?g?2.5, 0?p?1, 0?n?1, 0?z?1, and l+2m+3a+4g+5p=2q+3n+z; and light emitting devices including a light source and the above phosphor. Also disclosed are blends of LlMmAaGgPpQqNnZz:Ce3+ and one or more additional phosphors and light emitting devices incorporating the same.

Abstract: Disclosed are oxynitride phosphor compositions having the formula (RE1-xCex)3Ala-y-z-wSiyGazScwO12-yNy, where RE is at least one of Lu, Gd, Y, and Tb, 0.001?x?0.10, 0?w?2, 0.001?y?0.50, 0?z?4.999, and 4.5?a?5.0. When combined with radiation from a blue or UV LED, these phosphors can provide light sources with good color quality having high CRI over a large color temperature range. Also disclosed are blends of the above oxynitride phosphors and additional phosphors.

Abstract: A light emitting apparatus (8) includes one or more light emitting chips (10) that are disposed on a printed circuit board (12) and emit light predominantly in a wavelength range between about 400 nanometers and about 470 nanometers. The printed circuit board includes: (i) an electrically insulating board (14); (ii) electrically conductive printed circuitry (20); and (iii) an electrically insulating solder mask (22) having vias (24) through which the one or more light emitting chips electrically contact the printed circuitry. The solder mask (22) has a reflectance of greater than 60% at least between about 400 nanometers and about 470 nanometers.

Abstract: An LED light engine includes a flexible electrical cable, a wire-socket assembly attached to the cable, and an LED module selectively attached to the wire-socket assembly. The wire-socket assembly includes at least two IDC terminals. The IDC terminal displaces the insulating covering of the cable and contacts one of the electrical conductors. The LED module includes an LED electrically connected to the IDC terminals when the LED module attaches to the wire-socket assembly.

Abstract: The inventive signal incorporates an intelligent diagnosis module inside a light emitting diode (LED) signal, such as an LED traffic signal. The inventive signal can self-extinguish or send a signal through its communication port at the end of its useful life when the LEDs are no longer providing the required light output. Additionally, the inventive signal sends a signal to increase the current as the LEDs degrade to ensure the light output is above a threshold minimum.

Abstract: A connector electrically connects corresponding conductors of at least first and second cables. The connector comprises a connecting portion into which the conductors of the first and second cables are inserted opposing one another to electrically connect corresponding conductors of each cable. A positive terminal and a negative terminal terminate and electrically connect corresponding conductors of each cable.

Abstract: An apparatus for distributing light from a light source includes a support and an optic supported by the support. The optic includes a truncated axially symmetric body.

Abstract: A retaining device holds a printed circuit board to a structure that has channels for receiving the retaining device. The retaining device includes a body having portions configured for receipt into the channels of the structure, flexible portions and protuberances protruding away from a first surface adjacent each flexible portion. A method for holding the PCB to the heat sink is disclosed. A lighting assembly that includes the retaining device is also disclosed.

Abstract: An illuminated sign (88) includes a flexible electrical power cord (100) including first and second parallel conductors (112, 114) surroundingly contained within an insulating sheath defining a constant separation distance between the parallel conductors (112, 114). A plurality of light emitting diode (LED) devices (102) are affixed to the cord (100). Each LED device (102) includes an LED (104) having a positive lead (130P) electrically communicating with the first parallel conductor (112) and a negative lead (130P) electrically communicating with the second parallel conductor (114). A stencil (92) defines a selected shape, and the electrical cord (100) is arranged on the stencil (92). Power conditioning electronics (210, 220) disposed away from the stencil (92) electrically communicate with the first and second parallel conductors (112, 114) of the electrical power cord (100). The power conditioning electronics (210, 220) power the LED devices (102) via the parallel conductors (112, 114).

Abstract: A p-type contact (30) is disclosed for flip chip bonding and electrically contacting a p-type group III-nitride layer (28) of a group III-nitride flip chip light emitting diode die (10) with a bonding pad (60). A first palladium layer (42) is disposed on the p-type group III-nitride layer (28). The first palladium layer (42) is diffused through a native oxide of the p-type group III-nitride layer (28) to make electrical contact with the p-type group III-nitride layer (28). A reflective silver layer (44) is disposed on the first palladium layer (42). A second palladium layer (46) is disposed on the silver layer (44). A bonding stack (48) including at least two layers (50, 52, 54) is disposed on the second palladium layer (46). The bonding stack (48) is adapted for flip chip bonding the p-type layer (28) to the bonding pad (60).

Abstract: A signaling control device apparatus (10) comprises at least one LED (20) having a light emitting surface (18). A sensor (24) is set to detect an external light load (16) directed to the light emitting surface (18) and generate a control signal indicative of a presence of the light load (16). An electrical control system (14) detects the control signal indicative of the light load (16) and sources an elevated current to the LED (20) while the light load (16) is present. The elevated current increases the contrast ratio making the signal perceivable by the users as being in a particular state.

Abstract: A flip chip light emitting diode die (12) includes a light-transmissive substrate (20) and a plurality of semiconductor layers (22) are disposed on the light-transmissive substrate (20). The semiconductor layers (22) define a light-generating p/n junction. An electrode (30) is formed on the semiconductor layers (22) for flip-chip bonding the diode die (12) to an associated mount (14). The electrode (30) includes an optically transparent layer (42) formed of a substantially optically transparent material adjacent to the semiconductor layers (22) that makes ohmic contact therewith, and a reflective layer (44) adjacent to the optically transparent layer (42) and in electrically conductive communication therewith.

Abstract: Phosphor compositions including those having the formulas A2-xEuxW1-yMoyO6, where A is selected from Y, Gd, Lu, La, and combinations thereof; and where 0.5?x?1.0, 0.01?y?1.0; MmOnX, wherein M is selected from the group of Sc, Y, a lanthanide, an alkali earth metal and mixtures thereof; X is a halogen; 1?m?3; and 1?n?4, and wherein the lanthanide doping level can range from 0.1 to 40% spectral weight; and Eu3+ activated phosphate or borate phosphors. Also disclosed are light emitting devices including a light source and at least one of the above phosphor compositions.

Abstract: An electrical apparatus that is cooled via natural convection includes an electrical component, a vertical heat dissipation surface in thermal communication with the electrical component, and a diverter extending from the heat dissipation surface. The diverter disrupts vertical airflow over the heat dissipation surface.

Abstract: A power supply for a Light Emitting Diode (LED) traffic signal that controls the light intensity. The light intensity conforms to a predetermined pattern based on the input voltage root mean square value (Vrms). The input voltage is changed by acting on the amplitude of the sine wave or by using a triac and controlling the angle of fire. The power supply comprises a fuse module, an electromagnetic compatibility filter module, a power supply module, a LED load module, a current monitor module, a RMS-DC conversion module and a fuse blow out module.

Abstract: A conjugated diene sulfonation product represented by the formula (I): ##STR1## wherein R.sup.1 to R.sup.6, which may be the same or different, represent hydrogen atoms, alkyl groups having 1 to 8 carbon atoms, aryl groups having 6 to 20 carbon atoms or --SO.sub.3 X groups (X represents a hydrogen atom, a metal atom, an ammonium group or a quaternary ammonium group), at least one of said R.sup.1 to R.sup.6 being the --SO.sub.3 X group, a polymer of the conjugated diene sulfonation product or a copolymer of the conjugated diene sulfonation product with a monomer copolymerizable therewith. The sulfonation product, the polymer and the copolymer are useful as a dispersing agent for preparing a solid fuel dispersion, a cement dispersion, a dye and/or pigment dispersion or a metal oxide dispersion or as a water-treating agent, a fiber-treating agent, a plating bath additive and an excavation-muddy water-viscosity-adjusting agent.