Abstract: Methods and systems for redundant light sources by utilizing two inputs of an integrated modulator are disclosed and may include: an optoelectronic transmitter in a semiconductor die with first and second laser sources for providing optical signals to the semiconductor die, the transmitter comprising an optical modulator with a first input waveguide coupled to the first laser source and second input waveguide coupled to the second laser source, the optoelectronic receiver being operable to: configure the first laser source to provide an optical signal to the first input of the optical modulator; and if the first laser source does not provide an optical signal, configure the second laser source to provide an optical signal to the second input of the optical modulator. The first laser source may be optically coupled to the first input waveguide and the second laser source optically coupled to the second input waveguide using grating couplers.

Abstract: A method and system for optoelectronic receivers utilizing waveguide heterojunction phototransistors (HPTs) integrated in a wafer are disclosed and may include receiving optical signals via optical fibers operably coupled to a top surface of the chip. Electrical signals may be generated utilizing HPTs that detect the optical signals. The electrical signals may be amplified via voltage amplifiers, or transimpedance amplifiers, the outputs of which may be utilized to bias the HPTs by a feedback network. The optical signals may be coupled into opposite ends of the HPTs. A collector of the HPTs may comprise a silicon layer and a germanium layer, a base may comprise a silicon germanium alloy with germanium composition ranging from 70% to 100%, and an emitter including crystalline or poly Si or SiGe. The optical signals may be demodulated by communicating a mixer signal to a base terminal of the HPTs.

Abstract: Methods and systems for waveguide delay based equalization with optical splitting in optical communication may include an optoelectronic circuit comprising an input waveguide, a directional coupler, an optical delay, photodetectors, a current mirror, and a transimpedance amplifier. The optoelectronic circuit may receive an input optical signal via the input waveguide, split the input optical signal into first and second output signals using the directional coupler, delay the first output signal using the optical delay, convert the delayed first output signal to a first electrical signal using a first photodetector, convert the second output signal to a second electrical signal using a second photodetector, amplify the second electrical signal using the current mirror, and sum the first and second electrical signals at inputs of the transimpedance amplifier to generate an output voltage.

Abstract: Methods and systems for waveguide delay based equalization with current and optical summing in optical communication are disclosed and may include an optoelectronic receiver including a directional coupler, two or more photodetectors, and one or more current mirrors. The optoelectronic receiver may be operable to: receive an input optical signal; split the input optical signal into first and second optical signals using the directional coupler; generate a first electrical from the first optical signal using a first photodetector; generate a second electrical signal from the second optical signal using a second photodetector; mirror the second electrical signal using the current mirror; and sum the first electrical signal with the amplified second electrical signal. The optoelectronic receiver may be operable to delay the first optical signal before generating the first electrical signal, using a waveguide delay.

Abstract: Methods and systems for germanium-on-silicon photodetectors without germanium layer contacts are disclosed and may include, in a semiconductor die having a photodetector, where the photodetector includes an n-type silicon layer, a germanium layer, a p-type silicon layer, and a metal contact on each of the n-type silicon layer and the p-type silicon layer: receiving an optical signal, absorbing the optical signal in the germanium layer, generating an electrical signal from the absorbed optical signal, and communicating the electrical signal out of the photodetector via the n-type silicon layer and the p-type silicon layer. The photodetector may include a horizontal or vertical junction double heterostructure where the germanium layer is above the n-type and p-type silicon layers. An intrinsically-doped silicon layer may be below the germanium layer between the n-type silicon layer and the p-type silicon layer. A top portion of the germanium layer may be p-doped.

Abstract: Methods and systems for a optical fiber connector locking clip are disclosed and may include operatively coupling an optical fiber connector to an optical fiber adaptor by inserting the optical fiber connector into the optical fiber adaptor, where the optical fiber connector comprises an optical fiber connector pull-to-release housing. The optical fiber connector may be secured to the optical fiber adaptor by placing an optical fiber locking clip adjacent to the optical fiber connector pull-to-release housing, thereby preventing the optical fiber connector pull-to-release housing from being actuated. An optical cable may be coupled to the optical fiber connector. The adaptor may be coupled to an optical device, which may include an optical transceiver. The optical fiber locking clip may be plastic or metal. The optical fiber connector and the optical fiber connector pull-to-release housing may be plastic.

Abstract: Methods and systems for large silicon photonic interposers by stitching are disclosed and may include, in an optical communication system including a silicon photonic interposer, where the interposer includes a plurality of reticle sections: communicating an optical signal between two of the plurality of reticle sections utilizing a waveguide. The waveguide may include a taper region at a boundary between the two reticle sections, the taper region expanding an optical mode of the communicated optical signal prior to the boundary and narrowing the optical mode after the boundary. A continuous wave (CW) optical signal may be received in a first of the reticle sections from an optical source external to the interposer. The CW optical signal may be received in the interposer from an optical source assembly coupled to a grating coupler in the first of the reticle sections in the silicon photonic interposer.

Abstract: Methods and systems for split voltage domain receiver circuits are disclosed and may include amplifying complementary received signals in a plurality of partial voltage domains. The signals may be combined into a single differential signal in a single voltage domain. Each of the partial voltage domains may be offset by a DC voltage from the other partial voltage domains. The sum of the partial domains may be equal to a supply voltage of the integrated circuit. The complementary signals may be received from a photodiode. The amplified received signals may be amplified via stacked common source amplifiers, common emitter amplifiers, or stacked inverters. The amplified received signals may be DC coupled prior to combining. The complementary received signals may be amplified and combined via cascode amplifiers. The voltage domains may be stacked, and may be controlled via feedback loops. The photodetector may be integrated in the integrated circuit.

Abstract: Methods and systems for grating couplers incorporating perturbed waveguides are disclosed and may include in a semiconductor photonics die, communicating optical signals into and/or out of the die utilizing a grating coupler on the die, where the grating coupler comprises perturbed waveguides. The perturbed waveguides may include rows of continuous waveguides with scatterers extending throughout a length of the perturbed waveguides a variable width along their length. The grating coupler may comprise a single polarization grating coupler comprising perturbed waveguides and a non-perturbed grating. The grating coupler may comprise a polarization splitting grating coupler (PSGC) that includes two sets of perturbed waveguides at a non-zero angle, or a plurality of non-linear rows of discrete shapes. The PSGC may comprise discrete scatterers at an intersection of the sets of perturbed waveguides. The grating coupler may comprise individual scatterers between the perturbed waveguides.

Abstract: Methods and systems for eliminating polarization dependence for 45 degree incidence MUX/DEMUX designs may include an optical transceiver, where the optical transceiver comprises an input optical fiber, a beam splitter, and a plurality of thin film filters coupled to a photonics die. The thin film filters are arranged above corresponding grating couplers in the photonics die. The transceiver may receive an input optical signal comprising different wavelength signals via the input optical fiber, split the input optical signal into signals of first and polarizations using the beam splitter by separating the signals of the second polarization laterally from the signals of the first polarization, communicate the signals of the first polarization and the second polarization to the plurality of thin film filters, and reflect signals of each of the plurality of different wavelength signals to corresponding grating couplers in the photonics die using the thin film filters.

Abstract: A method and system for coupling optical signals into silicon optoelectronic chips are disclosed and may include coupling one or more optical signals into a back surface of a CMOS photonic chip comprising photonic, electronic, and optoelectronic devices. The devices may be integrated in a front surface of the chip and one or more optical couplers may receive the optical signals in the front surface of the chip. The optical signals may be coupled into the back surface of the chip via one or more optical fibers and/or optical source assemblies. The optical signals may be coupled to the grating couplers via a light path etched in the chip, which may be refilled with silicon dioxide. The chip may be flip-chip bonded to a packaging substrate. Optical signals may be reflected back to the grating couplers via metal reflectors, which may be integrated in dielectric layers on the chip.

Abstract: A transceiver comprising a chip, a semiconductor laser bonded to the chip, and one or more photodetectors, the chip comprising optical and optoelectronic devices and electronic circuitry, where the transceiver is operable to: communicate, utilizing the semiconductor laser, an optical source signal into the chip, generate first optical signals in the chip based on the optical source signal, transmit the first optical signals from the chip via a, and receive second optical signals from the light pipe and converting the second optical signals to electrical signals via the photodetectors. The optical signals may be communicated out of and in to a top surface of the chip. The one or more photodetectors may be integrated in the chip. The optoelectronic devices may include the one or more photodetectors integrated in the chip.

Abstract: Methods and systems for a vertical junction high-speed phase modulator are disclosed and may include a semiconductor device having a semiconductor waveguide including a slab section, a rib section extending above the slab section, and raised ridges extending above the slab section on both sides of the rib section. The semiconductor device has a vertical pn junction with p-doped material and n-doped material arranged vertically with respect to each other in the rib and slab sections. The rib section may be either fully n-doped or p-doped in each cross-section along the semiconductor waveguide. Electrical connection to the p-doped and n-doped material may be enabled by forming contacts on the raised ridges, and electrical connection may be provided to the rib section from one of the contacts via periodically arranged sections of the semiconductor waveguide, where a cross-section of both the rib section and the slab section in the periodically arranged sections may be fully n-doped or fully p-doped.

Abstract: Methods and systems for an optical connection service interface may include, in an optical data link comprising an optical fiber, a local control system, first and second transceivers at ends of the optical fiber, generating a signal for the local control system at a low frequency and communicating, utilizing the optical fiber, an optical data signal at a high frequency and an Optical Connection Service interface (OCSi) signal at an intermediate frequency. An optical signal may be modulated at the intermediate frequencies for the OCSi, and may be modulated and communicated to the second transceiver. The communicated modulated signal and the optical data signal may be detected utilizing a photodetector in the second transceiver. The detected optical signal may be demodulated, and an optical power of the optical data signal may be configured based on the demodulated signal.

Abstract: Methods and systems for two-dimensional mode-matching grating couplers may include in a photonic chip comprising a grating coupler at a surface of the photonic chip, the grating coupler having increased scattering strength in a direction of a light wave traveling through the grating coupler: receiving an optical signal from a first direction within the photonic chip; and scattering the optical signal out of the surface of the photonic chip. A second optical signal may be received in the grating coupler from a second direction within the photonic chip. The second optical signal may be scattered out of the surface of the photonic chip. The increasing scattering strength may be configured by increased width scatterers along a direction perpendicular to the direction of light travel. The increased scattering strength may be configured by a transition of shapes of scatterers in the grating coupler.

Abstract: Methods and systems for selectable parallel optical fiber and WDM operation may include an optoelectronic transceiver integrated in a silicon photonics die. The optoelectronic transceiver may, in a first communication mode, communicate continuous wave (CW) optical signals from an optical source module to a first subset of optical couplers on the die for processing signals in optical modulators in accordance with a first communications protocol, and in a second communication mode, communicate the CW optical signals to a second subset of optical couplers for processing signals in the optical modulators in accordance with a second communications protocol. Processed signals may be transmitted out of the die utilizing a third subset of the optical couplers. First or second protocol optical signals may be received from the fiber interface coupled to a fourth subset or a fifth subset, respectively, of the optical couplers.

Abstract: Methods and systems for waveguide delay based equalization summing at single-ended to differential converters in optical communication are disclosed and may include: in an optoelectronic receiver including a directional coupler, photodetectors, transimpedance amplifiers (TIAs), and a gain stage, receiving an input optical signal; splitting the input optical signal into first and second optical signals using the directional coupler; generating a first current from the first optical signal using a first photodetector; generating a first voltage from the first current using a first TIA; communicating the first voltage to a first input of the gain stage; generating a second current from the second optical signal using a second photodetector; generating a second voltage from the first signal using a second TIA; communicating the second voltage to a second input of the gain stage; and generating a differential output voltage from the first and second voltages using the gain stage.

Abstract: Methods and systems for a low-loss optical Y-Junction power splitter are disclosed and may include a semiconductor die having an optical Y-junction. The optical Y-junction may comprise an input waveguide, two or more output waveguides, a taper region and a step feature. The input waveguide and the taper region may include a smooth transition between the input waveguide and the taper region, and the step feature may be between the taper region and the output waveguides. The semiconductor die may receive an optical signal in the input waveguide, and communicate substantially equal power optical signals to the output waveguides. The semiconductor die may comprise a photonically-enabled silicon CMOS integrated circuit. An optical signal may be received in each of the output waveguides and a summed output signal may be communicated to the input waveguide. The step feature may extend in a direction perpendicular to an axis of the output waveguides.

Abstract: Methods and systems for a distributed optical transmitter with local domain splitting is disclosed and may include, in an optical modulator integrated in a silicon photonics chip: receiving electrical signals, communicating the electrical signals to domain splitters along a length of waveguides of the optical modulator utilizing one or more delay lines, generating electrical signals in voltage domains utilizing the domain splitters, modulating received optical signals in the waveguides of the optical modulator by driving diodes with the electrical signals generated in the voltage domains, and generating a modulated output signal through interference of the modulated optical signal in the waveguides of the optical modulator. The delay lines may comprise one delay element per domain splitter, or may comprise a delay element per domain splitter for a first subset of the domain splitters and more than one delay element per domain splitter for a second subset of the domain splitters.

Abstract: Methods and systems for a photonic interposer are disclosed and may include receiving one or more continuous wave (CW) optical signals in a silicon photonic interposer from an external optical source, from an optical source assembly via optical fibers coupled to the silicon photonic interposer. A modulated optical signal may be generated by processing the received CW optical signals based on a first electrical signal received from the electronics die. A second electrical signal may be generated in the silicon photonic interposer based on the generated modulated optical signals, and may then be communicated to the electronics die via copper pillars. Optical signals may be communicated into and/or out of the silicon photonic interposer utilizing grating couplers. The electronics die may comprise one or more of: a processor core, a switch core, memory, or a router.