Patents Assigned to LuxVue Technology Corporation
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Patent number: 9159700Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.Type: GrantFiled: March 15, 2013Date of Patent: October 13, 2015Assignee: LuxVue Technology CorporationInventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
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Patent number: 9153171Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.Type: GrantFiled: December 17, 2012Date of Patent: October 6, 2015Assignee: LuxVue Technology CorporationInventors: Kapil V. Sakariya, Andreas Bibl, Kelly McGroddy
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Publication number: 20150263066Abstract: A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a plurality of nanowires on and protruding away from a first surface of the base layer. An encapsulation material laterally surrounds the plurality of nanowires in the nanowire device, such that the nanowires are embedded within the encapsulation material.Type: ApplicationFiled: March 13, 2014Publication date: September 17, 2015Applicant: LuxVue Technology CorporationInventors: Hsin-Hua Hu, Andreas Bibl
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Patent number: 9136161Abstract: Micro pick up arrays for transferring micro devices from a carrier substrate are disclosed. In an embodiment, a micro pick up array includes a compliant contact for delivering an operating voltage from a voltage source to an array of electrostatic transfer heads. In an embodiment, the compliant contact is moveable relative to a base substrate of the micro pick up array.Type: GrantFiled: June 4, 2013Date of Patent: September 15, 2015Assignee: LuxVue Technology CorporationInventors: Andreas Bibl, Dariusz Golda
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Publication number: 20150235121Abstract: An integrated micro chip, method of integrating a micro chip, and micro chip integration system are described. In an embodiment, a micro chip such as a micro RFID chip or integrated passive device (IPD) is electrostatically transferred and bonded to a conductive pattern including a line break. In an embodiment, the line break is formed by a suitable cutting technique such as laser laser ablation, ion beam etching, or photolithography with chemical etching to accommodate the micro chip.Type: ApplicationFiled: February 18, 2014Publication date: August 20, 2015Applicant: LuxVue Technology CorporationInventors: Vikram Pavate, Andreas Bibl
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Patent number: 9111464Abstract: A display and method of manufacture are described. The display may include a substrate including an array of pixels with each pixel including multiple subpixels, and each subpixel within a pixel is designed for a different color emission spectrum. An array of micro LED device pairs are mounted within each subpixel to provide redundancy. An array of wavelength conversion layers comprising phosphor particles are formed over the array of micro LED device pairs for tunable color emission spectrum.Type: GrantFiled: June 18, 2013Date of Patent: August 18, 2015Assignee: LuxVue Technology CorporationInventors: Andreas Bibl, Kelly McGroddy
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Patent number: 9105714Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is within an array of staging cavities on a carrier substrate. Each micro device is laterally retained between a plurality of staging bollards of a corresponding staging cavity.Type: GrantFiled: January 30, 2013Date of Patent: August 11, 2015Assignee: LUXVUE TECHNOLOGY CORPORATIONInventors: Hsin-Hua Hu, Andreas Bibl
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Patent number: 9105492Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring portion that is deflectable into a space between a base substrate and the spring portion.Type: GrantFiled: May 8, 2012Date of Patent: August 11, 2015Assignee: LuxVue Technology CorporationInventors: Andreas Bibl, John A. Higginson, Hsin-Hua Hu
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Patent number: 9095980Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a mass transfer tool manipulator assembly allows active alignment between an array of electrostatic transfer heads on a micro pick up array and an array of micro devices on a carrier substrate. Displacement of a compliant element of the mass transfer tool manipulator assembly may be sensed to control alignment between the array of electrostatic transfer heads and the array of micro devices.Type: GrantFiled: February 25, 2013Date of Patent: August 4, 2015Assignee: LuxVue Technology CorporationInventors: Dariusz Golda, John A. Higginson, Andreas Bibl, Paul Argus Parks, Stephen Paul Bathurst
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Patent number: 9087764Abstract: A method and structure for forming an array of micro devices is disclosed. An array of micro devices is formed over an array of stabilization posts included in a stabilization layer. The stabilization layer is bonded to a spacer side of a carrier substrate. The spacer side of the carrier substrate includes raised spacers extending from a spacer-side surface of the carrier substrate.Type: GrantFiled: July 26, 2013Date of Patent: July 21, 2015Assignee: Luxvue Technology CorporationInventors: Clayton Ka Tsun Chan, Andreas Bibl
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Publication number: 20150187740Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area in which a current spreading layer protrudes away from a cladding layer in a pillar configuration so that the cladding layer is wider than the current spreading layer pillar.Type: ApplicationFiled: December 27, 2013Publication date: July 2, 2015Applicant: LuxVue Technology CorporationInventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan
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Publication number: 20150187991Abstract: Methods and structures for forming arrays of LED devices are disclosed. The LED devices in accordance with embodiments of the invention may include an internally confined current injection area to reduce non-radiative recombination due to edge effects. Several manners for confining current may include etch removal of a current distribution layer, etch removal of a current distribution layer and active layer followed by mesa re-growth, isolation by ion implant or diffusion, quantum well intermixing, and oxide isolation.Type: ApplicationFiled: February 28, 2014Publication date: July 2, 2015Applicant: LuxVue Technology CorporationInventors: Kelly McGroddy, Hsin-Hua Hu, Andreas Bibl, Clayton Ka Tsun Chan, Daniel Arthur Haeger
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Publication number: 20150179876Abstract: A method and structure for forming an array of LED devices is disclosed. The LED devices in accordance with embodiments of the invention may include a confined current injection area, embedded mirror, or sidewall passivation layer, and any combination thereof.Type: ApplicationFiled: December 20, 2013Publication date: June 25, 2015Applicant: LuxVue Technology CorporationInventors: Hsin-Hua Hu, Kelly McGroddy
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Publication number: 20150179877Abstract: A nanowire device and a method of forming a nanowire device that is poised for pick up and transfer to a receiving substrate are described. In an embodiment, the nanowire device includes a base layer and a nanowire on and protruding away from a first surface of the base layer. The nanowire may include a core, a shell, and an active layer between the core and the shell. A top electrode layer may be on a second surface of the base layer opposite the first surface and in electrical contact with the core, and a bottom electrode layer may be on and electrical contact with the shell. In an embodiment, the base layer is characterized by a maximum width of the micro scale, and the nanowire is characterized by a maximum width or length of the nano scale.Type: ApplicationFiled: December 20, 2013Publication date: June 25, 2015Applicant: LuxVue Technology CorporationInventors: Hsin-Hua Hu, Kelly McGroddy, Andreas Bibl
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Publication number: 20150169011Abstract: A display module and system applications including a display module are described. The display module may include a display substrate including a front surface, a back surface, and a display area on the front surface. A plurality of interconnects extend through the display substrate from the front surface to the back surface. An array of light emitting diodes (LEDs) are in the display area and electrically connected with the plurality of interconnects, and one or more driver circuits are on the back surface of the display substrate. Exemplary system applications include wearable, rollable, and foldable displays.Type: ApplicationFiled: December 17, 2013Publication date: June 18, 2015Applicant: LuxVue Technology CorporationInventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate
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Patent number: 9044926Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.Type: GrantFiled: March 20, 2014Date of Patent: June 2, 2015Assignee: Luxvue Technology CorporationInventors: Dariusz Golda, Andreas Bibl
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Patent number: 9034754Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure.Type: GrantFiled: May 25, 2012Date of Patent: May 19, 2015Assignee: LuxVue Technology CorporationInventors: Dariusz Golda, Andreas Bibl
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Patent number: 9035279Abstract: A method and structure for stabilizing an array of micro devices is disclosed. A stabilization layer includes an array of stabilization cavities and array of stabilization posts. Each stabilization cavity includes sidewalls surrounding a stabilization post. The array of micro devices is on the array of stabilization posts. Each micro device in the array of micro devices includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.Type: GrantFiled: July 8, 2013Date of Patent: May 19, 2015Assignee: LuxVue Technology CorporationInventors: Hsin-Hua Hu, Kevin K. C. Chang, Andreas Bibl
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Patent number: D738748Type: GrantFiled: December 17, 2013Date of Patent: September 15, 2015Assignee: LuxVue Technology CorporationInventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate, Joseph Kennelly-Ullman
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Patent number: D738749Type: GrantFiled: December 17, 2013Date of Patent: September 15, 2015Assignee: LuxVue Technology CorporationInventors: Andreas Bibl, Kapil V. Sakariya, Vikram Pavate, Joseph Kennelly-Ullman