Patents Assigned to LuxVue Technology Corporation
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Patent number: 8791530Abstract: A compliant micro device transfer head and head array are disclosed. In an embodiment a micro device transfer head includes a spring arm having integrated electrode leads that is deflectable into a space between a base substrate and the spring arm.Type: GrantFiled: September 6, 2012Date of Patent: July 29, 2014Assignee: LuxVue Technology CorporationInventors: Andreas Bibl, Dariusz Golda
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Publication number: 20140196851Abstract: A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure.Type: ApplicationFiled: February 5, 2014Publication date: July 17, 2014Applicant: LuxVue Technology CorporationInventors: Dariusz Golda, Andreas Bibl
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Publication number: 20140169924Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array mount includes a pivot platform to allow a micro pick up array to automatically align with a carrier substrate. Deflection of the pivot platform may be detected to control further movement of the micro pick up array.Type: ApplicationFiled: December 14, 2012Publication date: June 19, 2014Applicant: Luxvue Technology CorporationInventors: Dariusz Golda, John A. Higginson, Andreas Bibl
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Publication number: 20140168037Abstract: A light emitting assembly is described. In one embodiment, one or more light emitting diode (LED) devices and one or more microcontrollers are bonded to a same side of a substrate, with the one or more microcontrollers to switch and drive the one or more LED devices.Type: ApplicationFiled: December 17, 2012Publication date: June 19, 2014Applicant: LUXVUE TECHNOLOGY CORPORATIONInventors: Kapil V. Sakariya, Andreas Bibl, Kelly McGroddy
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Publication number: 20140169927Abstract: Systems and methods for transferring a micro device from a carrier substrate are disclosed. In an embodiment, a micro pick up array structure allows the micro pick up array to automatically align with the carrier substrate. Deflection of the micro pick up array may be detected to control further movement of the micro pick up array.Type: ApplicationFiled: December 14, 2012Publication date: June 19, 2014Applicant: Luxvue Technology CorporationInventors: Dariusz Golda, John A. Higginson, Andreas Bibl
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Publication number: 20140159066Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is within an array of staging cavities on a carrier substrate. Each micro device is laterally retained between a plurality of staging bollards of a corresponding staging cavity.Type: ApplicationFiled: January 30, 2013Publication date: June 12, 2014Applicant: LUXVUE TECHNOLOGY CORPORATIONInventors: Hsin-Hua Hu, Andreas Bibl
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Publication number: 20140159065Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is held within an array of staging cavities on a carrier substrate. Each micro device is laterally surrounded by sidewalls of a corresponding staging cavity.Type: ApplicationFiled: January 30, 2013Publication date: June 12, 2014Applicant: Luxvue Technology CorporationInventors: Hsin-Hua Hu, Andreas Bibl
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Publication number: 20140158415Abstract: A monopolar and bipolar micro device transfer head array and method of forming a monopolar and bipolar micro device transfer array are described. In an embodiment, a micro device transfer head array includes a base substrate, a first insulating layer formed over the base substrate, and an array of mesa structures. A second insulating layer may be formed over the mesa structure, a patterned metal layer over the second insulating layer, and a dielectric layer covering the metal layer.Type: ApplicationFiled: December 10, 2012Publication date: June 12, 2014Applicant: LUXVUE TECHNOLOGY CORPORATIONInventors: Dariusz Golda, Andreas Bibl
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Publication number: 20140159064Abstract: Reflective bank structures for light emitting devices are described. The reflective bank structure may include a substrate, an insulating layer on the substrate, and an array of bank openings in the insulating layer with each bank opening including a bottom surface and sidewalls. A reflective layer spans sidewalls of each of the bank openings in the insulating layer.Type: ApplicationFiled: December 10, 2012Publication date: June 12, 2014Applicant: LUXVUE TECHNOLOGY CORPORATIONInventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
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Publication number: 20140159043Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.Type: ApplicationFiled: March 15, 2013Publication date: June 12, 2014Applicant: LUXVUE TECHNOLOGY CORPORATIONInventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
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Publication number: 20140159067Abstract: A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. An array of micro LED devices are bonded to the corresponding array of bottom electrodes within the array of bank openings. An array of top electrode layers are formed electrically connecting the array of micro LED devices to a ground line in the non-pixel area.Type: ApplicationFiled: March 15, 2013Publication date: June 12, 2014Applicant: LUXVUE TECHNOLOGY CORPORATIONInventors: Kapil V. Sakariya, Andreas Bibl, Hsin-Hua Hu
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Publication number: 20140159324Abstract: Compliant monopolar and bipolar micro device transfer head arrays and methods of formation from SOI substrates are described. In an embodiment, an array of compliant transfer heads are formed over a base substrate and deflectable toward the base substrate, and a patterned metal layer includes a metal interconnect layer electrically connected with an array of the metal electrodes in the array of compliant transfer heads.Type: ApplicationFiled: December 10, 2012Publication date: June 12, 2014Applicant: LUXVUE TECHNOLOGY CORPORATIONInventors: Dariusz Golda, Andreas Bibl
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Patent number: 8716767Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.Type: GrantFiled: October 25, 2013Date of Patent: May 6, 2014Assignee: LuxVue Technology CorporationInventors: Dariusz Golda, Andreas Bibl
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Patent number: 8686542Abstract: A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure.Type: GrantFiled: March 14, 2013Date of Patent: April 1, 2014Assignee: LuxVue Technology CorporationInventors: Dariusz Golda, Andreas Bibl
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Publication number: 20140084482Abstract: A method and structure for stabilizing an array of micro devices is disclosed. The array of micro devices is formed on an array of stabilization posts formed from a thermoset material. Each micro device includes a bottom surface that is wider than a corresponding stabilization post directly underneath the bottom surface.Type: ApplicationFiled: December 11, 2012Publication date: March 27, 2014Applicant: LUXVUE TECHNOLOGY CORPORATIONInventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson
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Publication number: 20140061687Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.Type: ApplicationFiled: November 4, 2013Publication date: March 6, 2014Applicant: LuxVue Technology CorporationInventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law
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Publication number: 20140048909Abstract: A compliant bipolar micro device transfer head array and method of forming a compliant bipolar micro device transfer array from an SOI substrate are described. In an embodiment, a compliant bipolar micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include first and second silicon interconnects, and first and second arrays of silicon electrodes electrically connected with the first and second silicon interconnects and deflectable into one or more cavities between the base substrate and the silicon electrodes.Type: ApplicationFiled: October 25, 2013Publication date: February 20, 2014Applicant: LuxVue Technology CorporationInventors: Dariusz Golda, Andreas Bibl
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Patent number: 8646505Abstract: A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.Type: GrantFiled: February 13, 2012Date of Patent: February 11, 2014Assignee: LuxVue Technology CorporationInventors: Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Publication number: 20140008813Abstract: A compliant monopolar micro device transfer head array and method of forming a compliant monopolar micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array including a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect, and each silicon electrode is deflectable into a cavity between the base substrate and the silicon electrode. A dielectric layer covers a top surface of each mesa structure.Type: ApplicationFiled: March 14, 2013Publication date: January 9, 2014Applicant: LUXVUE TECHNOLOGY CORPORATIONInventors: Dariusz Golda, Andreas Bibl
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Patent number: 8573469Abstract: A method of fabricating and transferring a micro device and an array of micro devices to a receiving substrate are described. In an embodiment, an electrically insulating layer is utilized as an etch stop layer during etching of a p-n diode layer to form a plurality of micro p-n diodes. In an embodiment, an electrically conductive intermediate bonding layer is utilized during the formation and transfer of the micro devices to the receiving substrate.Type: GrantFiled: March 30, 2012Date of Patent: November 5, 2013Assignee: LuxVue Technology CorporationInventors: Hsin-Hua Hu, Andreas Bibl, John A. Higginson, Hung-Fai Stephen Law