Abstract: A data transmission system and an operation method thereof are provided. The data transmission system includes a host, a first device and a second device. The host is configured to set a voltage base of a transmission signal, and configured to pull down or up the transmission signal based on the voltage base of the transmission signal to form a plurality of glitches. The first device is connected to the host to receive the transmission signal. The first device obtains a digital content of the transmission signal according to the glitches, if the voltage base of the transmission signal is set as a first base. The second device is connected to the host to receive the transmission signal. The second device obtains the digital content of the transmission signal according to the glitches, if the voltage base of the transmission signal is set as a second base.

Abstract: A memory system for maintaining data consistency and an operation method thereof are provided. The operation method includes: receiving a first data in a first cache of a first memory from a processor; reading the first data from the first cache and writing the first data as a redo log into a log buffer of the first memory; writing the redo log from the log buffer into a memory controller of the processor; performing an in-memory copy in a second memory to copy a second data as an undo log, wherein the second data is an old version of the first data; and writing the redo log from the memory controller into the second memory for covering the second data by the redo log as a third data, wherein the redo log, the third data and the first data are the same.

Abstract: A three-dimensional AND flash memory device includes a gate stack structure, a charge storage structure, a first conductive pillar and a second conductive pillar, an insulating pillar, and a channel pillar. The gate stack structure includes gate layers and insulating layers stacked alternately with each other. The first and second conductive pillars extend through the gate stack structure. The channel pillar extends through the gate stack structure. The charge storage structure is disposed between the gate stack structure and the channel pillar. The channel pillar includes: a first part and a second part connected each other. The first part is located between the charge storage structure and the insulating pillar. The second part includes a first region electrically connected to the first conductive pillar, and a second region electrically connected to the second conductive pillar. A curvature of the first part is smaller than a curvature of the second part.

Abstract: A thyristor includes a first transistor and a second transistor. The first transistor has a first end serving as an anode end. The second transistor has a control end coupled to a second end of the first transistor, a first end coupled to a control end of the first transistor, and a second end coupled to the first end of the second transistor and serving as a cathode end.

Abstract: A three-dimensional memory device, such as 3D AND Flash memory device, includes a first page buffer, a second page buffer, a sense amplifier, a first path selector, and a second path selector. The first page buffer and the second page buffer are respectively configured to temporarily store a first write-in data and a second write-in data. The first path selector couples the sense amplifier or the first page buffer to a first global bit line according to a first control signal. The second path selector couples the sense amplifier or the second page buffer to a second global bit line according to a second control signal.

Abstract: A three-dimensional AND flash memory device includes a gate stack structure and a silt. The silt extends along a first direction and divides the gate stack structure into a plurality of sub-blocks. Each sub-block includes a plurality of rows, and each row includes a plurality of channel pillars, a plurality of charge storage structures, and a plurality of pairs of conductive pillars. The plurality of pairs of conductive pillars are arranged in the plurality of channel pillars and penetrate the gate stack structure, and are respectively connected to the plurality of channel pillars. Each pair of conductive pillars includes a first conductive pillar and a second conductive pillar separated from each other along a second direction. There is an acute angle between the second direction and the first direction.

Abstract: A three-dimensional AND flash memory device includes a stack structure, a channel pillar, a first conductive pillar and a second conductive pillar, and a charge storage structure. The stack structure is located on a dielectric substrate and includes gate layers and insulating layers alternately stacked with each other. The channel pillar extends through the stack structure. The first conductive pillar and the second conductive pillar are located in and electrically connected with the channel pillar. The first conductive pillar includes a first metal silicide pillar, and the second conductive pillar includes a second metal silicide pillar. The charge storage structure is located between the gate layers and the channel pillar.

Abstract: A memory controller managing a memory device receives a memory read command from a host device that is communicably coupled to the memory device. The memory device includes a storage memory comprising a first type of memory cells and a cache memory comprising a second type of memory cells. The memory controller determines, from the memory read command, a physical address of a target memory location in the storage memory indicated by the memory read command. The memory controller executes a read operation on the target memory location corresponding to the physical address. The memory controller determines a read attribute of the target memory location. Conditioned on determining that the read attribute satisfies one or more threshold conditions, the memory controller programs an entry in the cache memory with information corresponding to the target memory location.

Abstract: A semiconductor structure is provided. The semiconductor structure includes a staircase structure including a first stair layer and a second stair layer on the first stair layer. The first stair layer comprises a first conductive film. The semiconductor structure includes a landing pad disposed on the first conductive film. The landing pad has a first pad sidewall facing toward the second stair layer, a first lateral gap distance between an upper portion of the first pad sidewall and the second stair layer is smaller than a second lateral gap distance between a lower portion of the first pad sidewall and the second stair layer.

Abstract: Provided are a three-dimensional (3D) memory device and a manufacturing method thereof. The 3D memory device includes a gate stacked structure, a channel layer, a charge storage structure, an electrode layer and a capacitor dielectric layer. The gate stacked structure is disposed on a substrate and includes a plurality of gate layers electrically insulated from each other. The gate stacked structure has at least one channel hole and at least one capacitor trench. The channel layer is disposed on the sidewall of the at least one channel hole. The charge storage structure is disposed between the channel layer and the sidewall of the at least one channel hole. The electrode layer is disposed on the sidewall of the at least one capacitor trench. The capacitor dielectric layer is disposed between the electrode layer and the sidewall of the at least one capacitor trench.

Abstract: A three-dimensional memory device and a method of manufacturing a three-dimensional memory device are provided. The method includes providing a precursor structure including a substrate, a multi-layered stack, a plurality of vertical channel pillars and a barrier structure. A first slit and a second slit are then formed in the multi-layered stack and the substrate along a first direction, in which the first slit and the second slit have a pitch between thereof, and the second slit cuts the barrier structure. A portion of the second insulating layers is then replaced with a plurality of conductive layers. A first slit structure and a second slit structure are then formed in the first slit and the second slit, in which the first slit structure and the second slit structure separate the vertical channel pillars in a second direction that is different from the first direction.

Abstract: Provided is a memory device including a substrate, a stack structure, a plurality of pads and an additional dielectric layer. The substrate has an array region and a staircase region. The stack structure is disposed on the substrate. The stack structure includes a plurality of dielectric layers and a plurality of conductive layers stacked alternately. The pads are disposed on the substrate in the staircase region. The pads are respectively connected to the conductive layers, so as to form a staircase structure. The additional dielectric layer is disposed on the stack structure to contact a topmost conductive layer of the conductive layers. A topmost pad of the pads includes a landing portion to contact a plug and an extension portion. The landing portion is laterally adjacent to the additional dielectric layer, and the extension portion extends over a top surface of the additional dielectric layer.

Abstract: A reference voltage circuit includes a first circuit including a first PN junction device and a first resistor connected in series between a power supply node and a first node, and a second resistor connected between the first node and an intermediate node, and a third resistor connected between the intermediate node and a reference voltage output node, and a second circuit including a second PN junction device connected between the power supply node and a second node and a fourth resistor connected between the second node and the intermediate node. A feedback current causes voltage across the first resistor to offset changes in voltage across the first PN junction device. A correction current is applied to boost and or sink current in the voltage reference generator to extend the operating temperature range.

Abstract: A circuit board includes a substrate, a plurality of contacts disposed on a surface of the substrate, and a solder mask. The contacts have a plurality of plating regions and a metal layer on the plating regions, and the plating regions have at least two different sizes. The solder mask covers the surface of the substrate and covers edges of the plating regions, in which topmost surfaces of the contacts are below a top surface of the solder mask, and a gap between the topmost surfaces of the contacts and the top surface of the solder mask is larger than 0 ?m and is smaller than 5 ?m.

Abstract: An integrated circuit includes a memory and peripheral circuits with a temperature sensor used to automatically adjust operating voltages. The temperature sensor includes a first circuit to generate a temperature-dependent voltage (TDV) that is dependent on an operating temperature of the integrated circuit, and a second circuit to generate a plurality of temperature reference voltages, based on or more codes. One or more comparator circuits compare individual ones of the plurality of reference voltages with the TDV, to generate one or more comparison signals that are indicative of the operating temperature of the integrated circuit.

Abstract: A memory device and an operation method thereof are provided. The operation method includes: in a first phase, selecting a global signal line, selecting a first string select line, unselecting a second string select line, selecting a first word line, and unselecting a second word line; sensing during a second phase; in a third phase, keeping voltages of the global signal line, the selected first word line and the unselected second word line, unselecting the first string select line and selecting the second string select line to switch voltages of the first and the second string select lines; and sensing during a fourth phase.

Abstract: An in-memory computation device and computation method are provided. The in-memory computation device, including a memory cell array, an input buffer, and a sense amplifier, is provided. The memory cell array includes a memory cell block. The memory cell block corresponds to at least one word line, and stores multiple weight values. Memory cells on the memory cell block respectively store multiple bits of each weight value. The input buffer is coupled to multiple bit lines, and respectively transmits multiple input signals to the bit lines. The memory cell array performs a multiply-add operation on the input signals and the weight values to generate multiple first operation results corresponding to multiple bit orders. The sense amplifier adds the first operation results to generate a second operation result according to the bit orders corresponding to the first operation results.

Abstract: Systems, methods, and apparatus including computer-readable mediums for determining read voltages for memory systems are provided. In one aspect, a memory system includes a memory storing data and a memory controller coupled to the memory. The memory controller is configured to: obtain a first reading output of target memory data in the memory using a first read voltage, and in response to determining that the first reading output fails to pass an Error-Correcting Code (ECC) test, provide the first read voltage to the memory. The memory is configured to: determine a second read voltage based on the first read voltage and generate a second reading output of the target memory data using the second read voltage.

Abstract: An analog CAM and an operation method thereof are provided. The analog CAM includes a matching line, an analog CAM cell and a sense amplifier. Each of the at least one analog CAM includes a first floating gate device having a N type channel and a second floating gate device having a P type channel. A match range is set through programming the first floating gate device and the second floating gate device. The sense amplifier is connected to the matching line. If an inputting signal is within the match range, a voltage of the matching line is pulled down to be equal to or lower than a predetermined level. The sense amplifier outputs a match result if the voltage of the matching line is pulled down to a predetermined level.

Abstract: A secure boot system, a secure boot method, and a secure boot apparatus, adapted for a boot apparatus to boot a host device, are provided. The boot apparatus includes a storage device and a processor. In the method, the processor reads a boot code and a boot key for booting the host device from the storage device, and executes a cryptographic algorithm on the boot code by using the boot key to obtain a runtime signature. Besides, the processor reads an original signature from a secure area in the storage device and uses the same to verify the runtime signature. If the runtime signature and the original signature are consistent with each other, the processor provides the boot code for the host device to execute a boot operation.