Patents Assigned to Materials, Inc.
  • Reticle adapter for a reactive ion etch system
    Publication number: 20010022216
    Abstract: A reticle adapter that is capable of supporting a reticle in a conventional reactive ion etch chamber that is designed for etching circular silicon wafers. The adapter has a lower portion that is milled to cover the upper portion of a pedestal within a reactive ion etch chamber. A top portion of the adapter has an opening that is sized and shaped to hold a reticle.
    Type: Application
    Filed: May 29, 2001
    Publication date: September 20, 2001
    Applicant: Materials, Inc.
    Inventors: Yan Ye, Richard W. Plavidal