Patents Assigned to MC (US) 3 LLC
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Publication number: 20240384024Abstract: A conduit tube includes a thermoplastic polyester elastomer resin composition containing a thermoplastic polyester elastomer A and a polycarbodiimide compound B, wherein the thermoplastic polyester elastomer A is formed by bonding 20 mass % or more and 65 mass % or less of a hard segment and 35 mass % or more and 80 mass % or less of a soft segment, the hard segment is composed of a polyester constituted from an aromatic dicarboxylic acid and an aliphatic or alicyclic diol as constituting components, the soft segment contains an aliphatic polycarbonate, and the thermoplastic polyester elastomer resin composition contains 0.1 parts by mass or more and 5 parts by mass or less of the polycarbodiimide compound B based on 100 parts by mass of the thermoplastic polyester elastomer A.Type: ApplicationFiled: September 1, 2022Publication date: November 21, 2024Applicant: TOYOBO MC CorporationInventors: Shinji HARADA, Takuya AKAISHI
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Publication number: 20240375045Abstract: In the attachment region, a bolt inserted in a hole portion is screwed into a threaded recess and a flange portion side is tightened, so that hermetic sealing at a position where a gap between the flange portion and the plate-shaped member and the threaded recess are contiguous is achieved and a leakage cut-off structure that cuts off leakage of raw gas or carrier gas from a plate-shaped member side toward a flange portion side is formed.Type: ApplicationFiled: September 1, 2022Publication date: November 14, 2024Applicant: TOYOBO MC CorporationInventors: Kazuyuki Ono, Daiki Kohno
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Publication number: 20240375396Abstract: A photosensitive resin printing plate precursor is disclosed for relief printing, including a support, a photosensitive resin layer, and a cover film stacked in this order, wherein the photosensitive resin layer comprises a lower layer present on a support side and an upper layer present on a cover-film side, wherein the upper layer is a photosensitive resin layer that contains a water-soluble or water-dispersible resin (A) having a glass transition temperature measured by differential scanning calorimeter of 40 to 90° C., wherein the upper layer has a thickness of 3 to 30 micrometers, wherein the lower layer is a layer that contains a water-soluble or water-dispersible resin (B) having a glass transition temperature higher than the glass transition temperature of the water-soluble or water-dispersible resin (A) by 5° C. or more, and wherein the glass transition temperature of the resin (B) measured by differential scanning calorimeter is 95 to 135° C.Type: ApplicationFiled: September 26, 2022Publication date: November 14, 2024Applicant: TOYOBO MC CorporationInventors: Masahito Tanigawa, Yuji Iwashita
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Publication number: 20240376648Abstract: A flameproof polyphenylene ether formed body of the present invention has a minimum value (%/° C.) of ?0.40%/° C. or more and ?0.10%/° C. or less in a differential thermogravimetric curve in a range of 400° C. to 550° C.Type: ApplicationFiled: September 28, 2022Publication date: November 14, 2024Applicant: TOYOBO MC CORPORATIONInventors: Takemasa Okada, Akinori Mizutani
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Publication number: 20240375035Abstract: In an upper portion in the inside of an adsorption and desorption treatment apparatus (100), a plate-shaped member (31), an annular erected wall (32), and an annular plate (33) are provided. The adsorption and desorption member (15) includes a cylindrical adsorption and desorption element (131) and an attachment plate (2) including a flange portion (2F). An attachment region (1B) is provided at a position where the flange portion (2F) and the annular plate (33) are superimposed on each other when the adsorption and desorption member (15) is accommodated in the inside of the adsorption and desorption treatment apparatus (100) by being inserted in an open hole (3A). The attachment region (1B) includes a hexagon head bolt (8) and a nut (5). The flange portion (2F) is provided with a first hole portion (2a). The annular plate (33) is provided with a second hole portion (3a).Type: ApplicationFiled: September 1, 2022Publication date: November 14, 2024Applicant: TOYOBO MC CorporationInventors: Toshiaki Hayashi, Daiki Kohno
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Patent number: 12139602Abstract: The present invention relates to a polyester resin composition comprising 18 to 35 parts by mass of a polybutylene terephthalate resin (A), 10 to 25 parts by mass of a polyethylene terephthalate resin (B), 10 to 20 parts by mass of a thermoplastic polyester elastomer (C), 0.5 to 5 parts by mass of an epoxy group-containing ethylene copolymer (D), 12 to 20 parts by mass of a spherical and/or amorphous inorganic filler (E), 10 to 35 parts by mass of a glass fiber reinforcing material (F), 0 to 10 parts by mass of a polycarbonate resin (G), and 0 to 2 parts by mass of a transesterification inhibitor (H). The polyester resin composition is excellent in heat resistance, capable of imparting toughness to a molding while remedying sink marks.Type: GrantFiled: February 28, 2020Date of Patent: November 12, 2024Assignee: TOYOBO MC CORPORATIONInventors: Kaori Furukawa, Motonobu Kamiya, Yasuto Fujii, Takahiro Shimizu
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Patent number: 12134806Abstract: The present invention provides a non-heat-treatable aluminum alloy for die casting, which can exhibit good castability and is able to confer excellent tensile characteristics (0.2% proof stress and elongation) and excellent corrosion resistance on die cast aluminum alloy materials. Also, the present invention provides a die cast aluminum alloy material having excellent tensile characteristics (0.2% proof stress and elongation) and excellent corrosion resistance. An aluminum alloy for die casting of the present invention comprises Mg: 3.7 to 9.0% by mass and Mn: 0.8 to 1.7% by mass, with the balance being Al and unavoidable impurities. It is preferable that the Mn content is 0.9 to 1.7% by mass and the Mg content is 4.7 to 9.0% by mass.Type: GrantFiled: October 30, 2019Date of Patent: November 5, 2024Assignees: NIPPON LIGHT METAL COMPANY, LTD., NIKKEI MC ALUMINIUM CO., LTD.Inventors: Izumi Yamamoto, Tomohiro Isobe, Hiroshi Horikawa
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Publication number: 20240335996Abstract: According to the method of the present invention. poly-4-methyl-1-pentene with a lower molecular weight can be easily and safely produced by mixing poly-4-methyl-1-pentene and another type of polyolefin (I) and conducting melt-stirring at a temperature equal to or higher than the melting points of both the poly-4-methyl-1-pentene and the polyolefin (I).Type: ApplicationFiled: October 11, 2022Publication date: October 10, 2024Applicant: TOYOBO MC CORPORATIONInventor: Yoshiyuki KITAGAWA
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Patent number: 12109732Abstract: A pellet production method comprising: an operation in which a strand comprising a glass-fiber-reinforced polyamide resin composition containing 50 mass % to 80 mass % of glass fiber is extruded from an orifice at a die; an operation in which the strand is drawn into water within a tank and is cooled; and an operation in which the cooled strand is cut to obtain a pellet; wherein an angle of incidence at which the strand enters the water within the tank is not less than 70° but is less than 90°; and wherein a ratio of a diameter of the pellet to a diameter of the orifice (diameter of the pellet/diameter of the orifice) is 0.65 to 0.97.Type: GrantFiled: June 2, 2020Date of Patent: October 8, 2024Assignee: TOYOBO MC CORPORATIONInventors: Sakito Kon, Yoshitaka Ayuzawa
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Patent number: 12098278Abstract: The present invention is a polyamide resin composition which contains 50 to 90% by mass of a crystalline polyamide resin (A) and 9 to 49% by mass of a talc (B). The average particle size of secondary particles of the talc (B) in the polyamide resin composition is 30 ?m or less. The polyamide resin composition has an exothermic peak present on a high temperature side of a maximum exothermic peak of a crystallization temperature during cooling in a cooling process of measurement by means of a differential scanning calorimeter. Variations in physical characteristics such as a molding shrinkage, mechanical characteristics, and a heat distortion temperature of the polyamide resin composition are suppressed among different production machines or different production lots. Consequently, characteristics within desired ranges are stably obtained.Type: GrantFiled: March 12, 2020Date of Patent: September 24, 2024Assignee: TOYOBO MC CORPORATIONInventors: Hideo Aso, Shuji Kubota, Yoshitaka Ayuzawa
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Patent number: 12082583Abstract: A method for preserving wood by contacting wood with a composition comprising a polyurethane polymer, non-aqueous solvents, and a wood preservative.Type: GrantFiled: March 29, 2018Date of Patent: September 10, 2024Assignees: Nutrition & Biosciences USA 2, LLC, MC (US) 3 LLCInventors: Selvanathan Arumugam, David M Laganella, Kevin B. Vargo
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Patent number: 12071512Abstract: The present invention is a polyamide resin composition containing 50 to 90% by mass of a crystalline polyamide resin (A) and 9 to 49% by mass of a talc (B), and preferably further containing a coupling agent (C) and a fatty acid metal salt (D), in which an average particle size of secondary particles of the talc (B) in the polyamide resin composition is greater than 30 ?m. The polyamide resin composition is less likely to cause a poor appearance of a molded article or occurrence of sink marks, and can stably provide characteristics within desired ranges.Type: GrantFiled: March 12, 2020Date of Patent: August 27, 2024Assignee: TOYOBO MC CORPORATIONInventors: Hideo Aso, Shuji Kubota, Yoshitaka Ayuzawa
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Publication number: 20240278165Abstract: An organic solvent recovery system includes cooling condensing devices, a first flow passage, first concentration devices, a second flow passage, and a second concentration device. The number of the first concentration devices provided is at least two or more, the number of the second concentration devices provided is at least one or more, and the number of the concentration devices is less than the number of the first concentration devices.Type: ApplicationFiled: June 15, 2022Publication date: August 22, 2024Applicant: TOYOBO MC CorporationInventor: Daiki Kohno
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Publication number: 20240279390Abstract: The present invention relates to a polyester resin composition containing a polyester resin (A) which satisfies requirements (i) The polyester resin (A) has an acid value of 100 eq/ton or more; (ii) The polyester resin composition contains substantially no curing agent; and (iii) The polyester resin composition has a storage elastic modulus E? at 200°° C. of 1.0×104 Pa or more after subjected to a heating treatment at 240° C. for 1 hour. The polyester resin composition of the present invention is capable of suppressing a harmful outgas and is suitable for a paint for cans having excellent properties such as curing properties, retort resistance, and processability.Type: ApplicationFiled: July 26, 2022Publication date: August 22, 2024Applicant: TOYOBO MC CorporationInventors: Hiroyuki MIEDA, Tadahiko MIKAMI
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Publication number: 20240279378Abstract: An object of the present invention is to provide a composition including magnetic powder having excellent fluidity and sufficient curing speed, and the present invention is a thermosetting composition including a crystalline radical polymerizable compound having a melting point in the range of 30 to 150° C. and magnetic powder.Type: ApplicationFiled: May 26, 2022Publication date: August 22, 2024Applicant: TOYOBO MC CorporationInventor: Daiki FUNAOKA
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Patent number: 12061417Abstract: A photosensitive resin printing original plate is disclosed in which a side surface light-blocking layer does not peel off from a metal support during handling of the printing original plate, and which enables efficient production of the side surface light-blocking layer. A water-developable photosensitive resin printing original plate, includes at least: a support; and a photosensitive resin layer arranged on the support, in which a peripheral side surface of the water-developable photosensitive resin printing original plate is covered with a light-blocking layer; the light-blocking layer contains carbon black and a vinyl polymer at a mass ratio of 80/20 to 30/70; and the vinyl polymer is an alcohol-soluble vinyl polymer containing 25 to 65 mol % of a hydroxyl group with respect to a constituent monomer unit in a molecule (in the case of being chemically modified, a constituent monomer unit after the modification).Type: GrantFiled: January 21, 2020Date of Patent: August 13, 2024Assignee: TOYOBO MC CORPORATIONInventors: Toshiyuki Kita, Toru Wada
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Patent number: 12054864Abstract: The network structure has a three-dimensional random loop bonded structure composed of a thermoplastic elastomer continuous linear body having a fiber diameter of not less than 0.1 mm and not more than 3.0 mm, wherein the thermoplastic elastomer continuous linear body is complexed with a polyester-based thermoplastic elastomer and a polystyrene-based thermoplastic elastomer, and the network structure has a 70° C. compressive residual strain of not more than 35% and a rebound resilience of not more than 10%. Thereby, a network structure having a high vibration absorption property and being superior in thermal settling resistance is provided.Type: GrantFiled: November 27, 2019Date of Patent: August 6, 2024Assignee: TOYOBO MC CORPORATIONInventors: Akifumi Yasui, Shinichi Kobuchi
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Patent number: 12048898Abstract: A hollow fiber membrane that is a hollow fiber type semipermeable membrane, wherein a Raman value is 70% or more, and the Raman value is a ratio of a minimum value to a maximum value of peak intensities, which are intensities of maximum peaks in each of multiple Raman spectra obtained by Raman spectroscopy at multiple points in a membrane thickness direction of a transverse cross-section of the hollow fiber membrane in a state of being swollen with water.Type: GrantFiled: February 21, 2020Date of Patent: July 30, 2024Assignee: TOYOBO MC CORPORATIONInventors: Takahito Nakao, Yasuki Terashima, Masanao Kohashi, Miharu Numoto
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Patent number: 12037454Abstract: The present invention is a polyamide resin composition containing 50 to 90% by mass of a crystalline polyamide resin (A) and 9 to 49% by mass of a talc (B), and preferably further containing a coupling agent (C) and a fatty acid metal salt (D), in which an average particle size of secondary particles of the talc (B) in the polyamide resin composition is greater than 30 ?m. The polyamide resin composition is less likely to cause a poor appearance of a molded article or occurrence of sink marks, and can stably provide characteristics within desired ranges.Type: GrantFiled: March 12, 2020Date of Patent: July 16, 2024Assignee: TOYOBO MC CORPORATIONInventors: Hideo Aso, Shuji Kubota, Yoshitaka Ayuzawa
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Publication number: 20240228761Abstract: To solve the problems described herein, this invention provides a resin emulsion for primers capable of suitably controlling sagging when a base coating is applied and capable of obtaining a smooth appearance in aqueous paint systems for plastics. The invention provides an aqueous dispersion comprising an acid-modified polyolefin resin (A), a nitrogen-containing non-ionic emulsifier (B), and water, wherein the acid-modified polyolefin resin (A) is a propylene-?-olefin copolymer having a butene content of 2 to 35 mass % in a polyolefin component, and wherein a coating film after baking at 80° C. has a pure water contact angle of 40° to 90°.Type: ApplicationFiled: March 2, 2022Publication date: July 11, 2024Applicant: TOYOBO MC CorporationInventors: Atsushi YAMANE, Kenji KASHIHARA, Keitaro MIYAZAKI