Patents Assigned to MC10, Inc.
  • Patent number: 10383219
    Abstract: In embodiments, the present invention may attach at least two isolated electronic components to an elastomeric substrate, and arrange an electrical interconnection between the components in a boustrophedonic pattern interconnecting the two isolated electronic components with the electrical interconnection. The elastomeric substrate may then be stretched such that the components separate relative to one another, where the electrical interconnection maintains substantially identical electrical performance characteristics during stretching, and where the stretching may extend the separation distance between the electrical components to many times that of the unstretched distance.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: August 13, 2019
    Assignee: MC10, Inc.
    Inventors: William J. Arora, Roozbeh Ghaffari
  • Patent number: 10334724
    Abstract: An example stretchable device is described that includes electrical contacts and an interconnect coupling the electrical contacts. The interconnect has a meander-shaped configuration that includes at least one nested serpentine-shaped feature. The interconnect can be conductive or non-conductive. The meander-shaped configuration can be a serpentine structure, providing a serpentine-in-serpentine configuration.
    Type: Grant
    Filed: June 5, 2017
    Date of Patent: June 25, 2019
    Assignee: MC10, Inc.
    Inventors: Yung-Yu Hsu, John Work, Kevin J. Dowling
  • Patent number: 10325951
    Abstract: System, devices and methods are presented that provide an imaging array fabrication process method, comprising fabricating an array of semiconductor imaging elements, interconnecting the elements with stretchable interconnections, and transfer printing the array with a pre-strained elastomeric stamp to a secondary non-planar surface.
    Type: Grant
    Filed: June 12, 2017
    Date of Patent: June 18, 2019
    Assignee: MC10, INC.
    Inventors: Bassel de Graff, Gilman Callsen, William J. Arora, Roozbeh Ghaffari
  • Patent number: 10300371
    Abstract: A system for providing a more personalized virtual environment for a user, the system including one or more sensing devices that detect one or more physical, physiological, or biological parameters of the user and transmit the same to a game console or virtual reality controller that produces the virtual environment. The game console or virtual reality controller can analyze the sensor data and adjust one or more aspects of the virtual environment as a function of the sensor data. For example, the difficulty level or scariness level of a game can be decreased if the heart rate of the user exceeds a predetermined threshold.
    Type: Grant
    Filed: September 30, 2016
    Date of Patent: May 28, 2019
    Assignee: MC10, Inc.
    Inventors: Roozbeh Ghaffari, Milan Raj, Bryan McGrane
  • Patent number: 10297572
    Abstract: Flexible interconnects, flexible integrated circuit systems and devices, and methods of making and using flexible integrated circuitry are presented herein. A flexible integrated circuit system is disclosed which includes first and second discrete devices that are electrically connected by a discrete flexible interconnect. The first discrete devices includes a first flexible multi-layer integrated circuit (IC) package with a first electrical connection pad on an outer surface thereof. The second discrete device includes a second flexible multi-layer integrated circuit (IC) package with a second electrical connection pad on an outer surface thereof. The discrete flexible interconnect is attached to and electrically connects the first electrical connection pad of the first discrete device to the second electrical connection pad of the second discrete device.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: May 21, 2019
    Assignee: MC10, INC.
    Inventors: Mitul Dalal, Sanjay Gupta
  • Patent number: 10296819
    Abstract: A system is provided for integrating conformal electronics devices into apparel. The system includes a flexible substrate onto which a flexible device is disposed. The flexible device can include a stretchable coil that can be used to receive and transmit near field communications. The flexible device also includes an integrated circuit component and a memory unit. In some examples, the device also includes a sensor that is configured to record measurement of the wearer of the apparel and/or the surrounding environment.
    Type: Grant
    Filed: November 14, 2017
    Date of Patent: May 21, 2019
    Assignee: MC10, Inc.
    Inventors: Steven Fastert, Kevin J. Dowling, Benjamin Schlatka, Conor Rafferty
  • Patent number: 10277386
    Abstract: An on-body sensor system includes a hub configured to be attached to a surface of a user. The hub being further configured to transmit electrical power and/or data signals into the surface and to receive response data signals from the surface. The system further including at least one sensor node configured to be attached to the surface. The sensor node being further configured to receive the electrical power and data signals from the hub through the surface and to transmit the response data signals into the surface. The electrical power from the hub can power the sensor node and cause or enable the at least one sensor node to generate sensor information that is transmitted back to the hub within the response data signals.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: April 30, 2019
    Assignee: MC10, Inc.
    Inventors: Milan Raj, Bryan McGrane, Jeffrey Model, Hoi-Cheong Steve Sun, Alexander J. Aranyosi, Valerie Susan Hanson
  • Patent number: 10258282
    Abstract: Systems, methods and apparatuses for monitoring cardiac activity of an individual using a conformal cardiac sensor device are presented herein. A conformal cardiac sensor device for analyzing cardiac activity includes a flexible substrate for coupling to the user, and a heart sensor component embedded on/in the substrate. The heart sensor component contacts a portion of the user's skin and measures electrical variable(s) indicative of cardiac activity. A biometric sensor component is embedded on/in the flexible substrate and measures physiological variable(s) indicative of cardiac activity of the user. A microprocessor, which is embedded on/in the flexible substrate, is communicatively coupled to the heart sensor component and biometric sensor component and operable to execute microprocessor executable instructions for controlling the measurements of electrical data and physiological data.
    Type: Grant
    Filed: March 14, 2018
    Date of Patent: April 16, 2019
    Assignee: MC10, Inc.
    Inventors: Gilbert Lee Huppert, Roozbeh Ghaffari, Melissa Ceruolo, Bryan Keen, Milan Raj, Bryan McGrane
  • Patent number: 10186546
    Abstract: System, devices and methods are presented that integrate stretchable or flexible circuitry, including arrays of active devices for enhanced sensing, diagnostic, and therapeutic capabilities. The invention enables conformal sensing contact with tissues of interest, such as the inner wall of a lumen, a the brain, or the surface of the heart. Such direct, conformal contact increases accuracy of measurement and delivery of therapy. Further, the invention enables the incorporation of both sensing and therapeutic devices on the same substrate allowing for faster treatment of diseased tissue and fewer devices to perform the same procedure.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: January 22, 2019
    Assignee: MC10, Inc.
    Inventors: Bassel De Graff, Roozbeh Ghaffari, William J. Arora
  • Patent number: 10032709
    Abstract: Systems and methods are provided for the embedding of thin chips. A well region is generated in a substrate that includes a conductive material disposed on a flexible polymer. The standoff well region can be generated by pattern the conductive material, where the thin chip is embedded in the standoff well region. A cavity can be generated in the polymer layer to form a polymer well region, where the thin chip is embedded in the polymer well region.
    Type: Grant
    Filed: January 23, 2017
    Date of Patent: July 24, 2018
    Assignee: MC10, INC.
    Inventors: Conor Rafferty, Mitul Dalal
  • Patent number: 10024743
    Abstract: Apparatus, systems, and methods for monitoring head acceleration and/or forces acting thereon are disclosed. A device for monitoring an acceleration or a force acting on the head of a user includes a flexible article adapted to be worn on the head of the user; and a monitoring assembly coupled to the flexible article. The monitoring assembly includes a sensor for measuring a force on the head and transmitting data relating to the force, the sensor disposed proximate to the head, a processor adapted to receive the force data from the sensor, and a flexible strip operatively connecting the sensor and the processor.
    Type: Grant
    Filed: October 26, 2012
    Date of Patent: July 17, 2018
    Assignees: Reebok International Limited, MC10 Inc.
    Inventors: Paul M. Davis, William Marvin, Steven Fastert, Kevin Dowling, Paul E. Litchfield, Benjamin Schlatka, Gilman Callsen, Robert Rich, Dustin G. Simone, Keith A. Stern, Dennis Gaboriault
  • Patent number: 9949691
    Abstract: Systems, methods and apparatuses for monitoring cardiac activity of an individual using a conformal cardiac sensor device are presented herein. A conformal cardiac sensor device for analyzing cardiac activity includes a flexible substrate for coupling to the user, and a heart sensor component embedded on/in the substrate. The heart sensor component contacts a portion of the users skin and measures electrical variable(s) indicative of cardiac activity. A biometric sensor component is embedded on/in the flexible substrate and measures physiological variable(s) indicative of cardiac activity of the user. A microprocessor, which is embedded on/in the flexible substrate, is communicatively coupled to the heart sensor component and biometric sensor component and operable to execute microprocessor executable instructions for controlling the measurements of electrical data and physiological data.
    Type: Grant
    Filed: November 21, 2014
    Date of Patent: April 24, 2018
    Assignee: MC10, Inc.
    Inventors: Gilbert Lee Huppert, Roozbeh Ghaffari, Melissa Ceruolo, Bryan Keen, Milan Raj, Bryan McGrane
  • Publication number: 20180076336
    Abstract: System, devices and methods are presented that integrate stretchable or flexible circuitry, including arrays of active devices for enhanced sensing, diagnostic, and therapeutic capabilities. The invention enables conformal sensing contact with tissues of interest, such as the inner wall of a lumen, a the brain, or the surface of the heart. Such direct, conformal contact increases accuracy of measurement and delivery of therapy. Further, the invention enables the incorporation of both sensing and therapeutic devices on the same substrate allowing for faster treatment of diseased tissue and fewer devices to perform the same procedure.
    Type: Application
    Filed: April 27, 2017
    Publication date: March 15, 2018
    Applicant: MC10, Inc.
    Inventors: Bassel De Graff, Roozbeh Ghaffari, William J. Arora
  • Patent number: 9899330
    Abstract: Flexible integrated circuit (IC) modules, flexible IC devices, and methods of making and using flexible IC modules are presented herein. A flexible integrated circuit module is disclosed which includes a flexible substrate and a semiconductor die attached to the flexible substrate. An encapsulating layer, which is attached to the flexible substrate, includes a thermoplastic resin and/or a polyimide adhesive encasing therein the semiconductor die. The encapsulating layer may be an acrylic-based thermally conductive and electrically isolating polyimide adhesive. Optionally, the encapsulating layer may be a B-stage FR-4 glass-reinforced epoxy thermoplastic polymer or copolymer or blend. The die may be embedded between two flexible substrates, each of which includes a layer of flexible polymer, such as a polyimide sheet, with two layers of conductive material, such as copper cladding, disposed on opposing sides of the layer of flexible polymer.
    Type: Grant
    Filed: September 30, 2015
    Date of Patent: February 20, 2018
    Assignee: MC10, INC.
    Inventors: Mitul Dalal, Sanjay Gupta
  • Patent number: 9894757
    Abstract: In embodiments, the present invention may attach at least two isolated electronic components to an elastomeric substrate, and arrange an electrical interconnection between the components in a boustrophedonic pattern interconnecting the two isolated electronic components with the electrical interconnection. The elastomeric substrate may then be stretched such that the components separate relative to one another, where the electrical interconnection maintains substantially identical electrical performance characteristics during stretching, and where the stretching may extend the separation distance between the electrical components to many times that of the unstretched distance.
    Type: Grant
    Filed: October 28, 2016
    Date of Patent: February 13, 2018
    Assignee: MC10, Inc.
    Inventors: William J. Arora, Roozbeh Ghaffari
  • Patent number: 9846829
    Abstract: A system is provided for integrating conformal electronics devices into apparel. The system includes a flexible substrate onto which a flexible device is disposed. The flexible device can include a stretchable coil that can be used to receive and transmit near field communications. The flexible device also includes an integrated circuit component and a memory unit. In some examples, the device also includes a sensor that is configured to record measurement of the wearer of the apparel and/or the surrounding environment.
    Type: Grant
    Filed: June 22, 2015
    Date of Patent: December 19, 2017
    Assignee: MC10, Inc.
    Inventors: Steven Fastert, Kevin J. Dowling, Benjamin Schlatka, Conor Rafferty
  • Patent number: 9844145
    Abstract: Buffer structures are provided that can be used to reduce a strain in a conformable electronic system that includes compliant components in electrical communication with more rigid device components. The buffer structures are disposed on, or at least partially embedded in, the conformable electronic system such that the buffer structures overlap with at least a portion of a junction region between a compliant component and a more rigid device component. The buffer structure can have a higher value of Young's modulus than an encapsulant of the conformable electronic system.
    Type: Grant
    Filed: June 28, 2016
    Date of Patent: December 12, 2017
    Assignee: MC10, Inc.
    Inventor: Yung-Yu Hsu
  • Patent number: 9833190
    Abstract: A system, device and method are presented for utilizing stretchable active integrated circuits with inflatable bodies. The invention allows for such operative features to come into direct contact with body structures, such as the inner wall of a lumen. Such direct contact increases accuracy of measurement and delivery of therapy.
    Type: Grant
    Filed: January 21, 2016
    Date of Patent: December 5, 2017
    Assignee: MC10, Inc.
    Inventors: Roozbeh Ghaffari, Gilman Callsen, William J. Arora, Benjamin Schlatka
  • Patent number: 9810623
    Abstract: The present invention relates to portable devices for point-of-care diagnostics that can perform measurements on a sample (e.g., blood, serum, saliva, or urine) and relay data to an external device for, e.g., data analysis. The device can comprise a paper-based diagnostic substrate and a base substrate that include electronic circuitry and electronic elements necessary for performing the measurements. The device can also comprise an antenna for near field communication with an external device. Another aspect of the invention relates to methods of using these devices.
    Type: Grant
    Filed: March 12, 2015
    Date of Patent: November 7, 2017
    Assignee: MC10, Inc.
    Inventors: Roozbeh Ghaffari, Alexander Aranyosi, Stephen Lee
  • Patent number: D825537
    Type: Grant
    Filed: January 31, 2017
    Date of Patent: August 14, 2018
    Assignee: MC10, Inc.
    Inventors: Xia Li, Mitul Dalal, Gilbert Lee Huppert, Sanjay Gupta