Abstract: A modular vertical pump assembly has a motor, a coupling, a pump, a frame, and a base. The frame installs on the base around the pump, and supports of the frame hold a mount for the motor. The shaft from the motor extends through the mount, and the coupling installs between the motor shaft and a pump shaft. Preferably, the coupling uses an adapter and a stuffing box. Three supports fixedly attach to the mount and base, while one support is removable. To remove the pump for repair or replacement, the removable support detaches from the frame, and the pump detaches from the base and lifts from the frame's free side. Like the pump, the motor can be removed independently from the mount. In both cases, the coupling allows the pump's shaft to freely separate from the motor's shaft.

Abstract: A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.

Abstract: An interconnect device for connecting an electronic package, whether it be a single chip or a multi-component device, to a primary substrate requiring the mating of dissimilar solder patterns includes a secondary substrate having a first face and a second face. The first face of the secondary substrate may include a first pattern of conductive lands formed on the first face corresponding to a plurality of conductive leads of an electronic package. The second face of the secondary substrate includes a second pattern of conductive lands corresponding to a plurality of conductive lands formed on the primary substrate. The first pattern of conductive lands formed on the first face is electrically connected to the second pattern of conductive lands formed on the second face via surface and internal conductive paths. Solder ball reflow soldering methods are used to connect the electronic device to the secondary substrate and to connect the secondary substrate to the primary substrate.

Abstract: A device and method for high volume solder sphere alignment and placement including the high volume solder sphere alignment and placement for BGA and CSP packages including a pre-form stencil having a pattern of apertures formed through its cross-section, that corresponds to the pattern of the exposed conductive lands of a circuit requiring sphere alignment and placement. The apertures may be formed having diameters that are approximately 5% larger in diameter than the solder spheres. The method for high volume solder sphere alignment and placement may include the steps of prepping the workpiece, applying a thin layer of flux to the conductive lands. Aligning the pre-form stencil with the part to which the solder balls are to be aligned with and placed upon. Applying the solder spheres through the pattern of apertures onto the conductive lands.

Abstract: A method of calibrating an automated placement machine having a robotic arm for picking up parts from a parts tray and a drawer for holding the parts tray therein. The method includes the acts of: positioning a calibration jig so that it is juxtapositioned at a corner of the drawer of the placement machine; positioning the robotic arm of the placement machine such that a portion of the robotic arm engages a portion of the calibration jig; determining a first set of spatial coordinates of the robotic arm when it is engaged with the calibration jig; and setting an origin point for the robotic arm such that the first set of spatial coordinates serves as the origin point from which movements of the robotic arm may be gauged.

Abstract: A platform and method for leveling the upper surface of a printed circuit board placed upon a work table. The platform comprises a substantially flat plate, the plate having a fastener for planerly securing the printed circuit board thereto, and at least one support having a length between a first end and a second end, the second end of the at least one support attached to the plate, and wherein the length of the at least one support is selected such that an angle between the plate and the work table compensates for any angular displacement of the printed circuit board relative to the plate. The method comprises fastening the printed circuit board to a platform, securing the platform to the work table, and angularly adjusting the upper surface of the printed circuit board by altering an angle between the platform and the work table.

Abstract: A wave solder pallet having a first side that is adapted to receive a printed circuit board and a plurality of through holes or apertures that will allow solder to be transmitted through to selected regions on the printed circuit board. The surface of the base plate that is positioned adjacent the solder wave has channels formed therein, the channels being tapered inwardly so that the overall volume of the channel is greatest at the periphery of the pallet. The increased volume of the channel reduces the pressure effect of the solder wave as it contacts the pallet at the periphery thereby reducing the amount of solder that is splashed over the pallet. The tapering of the channel uniformly increases the pressure so that the pressure effect of the solder wave is increased when it travels through the apertures.

Abstract: A molded selective solder pallet and a method for fabricating a molded selective solder pallet for use in a wave soldering process to selectively affix solder to an area of a circuit board having an electronic component thereon. The selective solder pallet according to the present invention includes a mold base configured having an aperture formed through its cross-section. A high temperature casting material is molded within the mold base and configured to have at least one recess and at least one solder flow opening. A high temperature silicone casting material may be employed as the high temperature casting material.

Abstract: With the present invention, a circuit card assembly having a nonvertically approaching device may be manufactured with reflow soldering. The circuit card assembly includes a circuit card and a nonvertically approaching device such as an edge connector, which is soldered to the circuit card with reflowed solder. The device is soldered to the circuit card by initially heating the circuit card, along with included reflow solder, prior to mating the device to the circuit card. Once the solder has melted and while it is in a liquidus state, the device is mated with the circuit card. In this manner, the nonvertically approaching leads of the device slide into the solder as they are positioned onto their circuit card soldering surfaces. Once cooled, the solder solidifies to conductively mount the device to the circuit card.A mating pallet is provided for soldering a device having nonvertically approaching leads to a circuit card.

Abstract: An alignment fixture for aligning components of a solder-wave machine during manufacturing processes of PCB assemblies and other electronic devices. In one embodiment, an alignment fixture has a calibration member that is adapted to be positioned at least in part over a solder-wave of the solder-wave machine. The calibration member may be positioned at a PCB elevation defined by the elevation at which PCB assemblies move over the solder-wave during processing. The calibration member may be an alignment bar or other device that has a solder indicator to indicate the height of the solder-wave relative to the PCB elevation. Additionally, the solder indicator may indicate the extent of deviations between the height of the solder-wave and the PCB elevation across at least a portion of the solder-wave.

Abstract: A solder paste brick, for attaching a ball grid array device to a circuit board. The solder paste brick is configured as an irregularly shaped structure so as to reduce distances in which volatized flux gasses must travel in order to escape from within the solder paste brick, thereby reducing voiding in a solder joint formed by the solder paste brick and a solder ball terminal of the ball grid array device as a result of a reflow soldering process. The solder paste brick is further configured so as to allow the solder ball terminal to make contact with a portion of an edge of the solder paste brick, while remaining substantially aligned with a center of a pad of the circuit board, such that a majority of a top surface of the solder paste brick is not in contact with the solder ball terminal. In this way, volatized flux gases formed during a reflow soldering process are caused to escape via the top surface without migrating upwardly into the solder ball terminal during the reflow soldering process.

Abstract: The present invention is a universal fixture for holding printed circuit boards with different sizes and shapes during, stencil printing and other manufacturing processes related to printed circuit boards. In one embodiment, a universal fixture for holding a printed circuit board has a platform with a work surface, a first support member attached to the platform to hold a portion of a printed circuit board, and a second moveable support member attached to the first support member to support another portion of the printed circuit board. The platform is preferably adapted to be attached to a workstation of a processing machine, such as a stenciling machine for printing solder or adhesive onto the printed circuit board. The first support member preferably has an elongated sidewall, a first endwall extending transversely from the sidewall, and a second endwall spaced apart from the first endwall along the sidewall and extending transversely from the sidewall.

Abstract: A method for cleaning and coating a conductor in a plasma reaction chamber utilizing a plasma gas mixture containing Argon and CF.sub.4 to clean and coat a conductor. The method for cleaning and coating a conductor includes the combination of cleaning processes including, physical reduction and chemical reaction and the formation of a polymerization passivation film formed on oxyfluoro metal compositions (SnO.sub.x F.sub.y) which occur during exposure of a conductor to the process of the invention. The polymerization passivation film is formed as a result of the combination of the degraded carbon Tetrafloride (CF.sub.4) gas and degraded environmental and casual hydrocarbons which are present in the form of a variety of unspecified organic contaminants to form crude polymeric molecules in the high energy environment of the plasma.

Abstract: A method apparatus for assisting in the calibration of a pick and place machine including a parts pick up jig having a first feeder shoe for placement over the end of one of the feeder stations and second feeder shoe for placement over the end of an adjacent feeder station allowing for the safe and accurate pick-up of glass chips by the part placement nozzle. The feeder shoes are placed over the ends of the feeder stations with the end of feeder stations extending inside the feeder shoes against feeder shoe nose panels to assure accurate placement of the parts pick up jig on the "Y" axis. The parts pick up jig may also index against an inner or outer edge of the feeder station to assure accurate placement of parts pick up jig on the "X" axis. A bridge section extends between the feeder shoes and connects the two feeder shoes together. Formed on the upper surface of the bridge section are a series of recesses for receiving and aligning chips to be picked and placed during a calibration procedure.

Abstract: A calibration jig for establishing a home position of a robotic mechanism which retrieves components from a parts tray. The calibration jig includes: an angled member having a first wall member and a second wall member which is substantially perpendicular to the first wall member, wherein the angled member is configured to be juxtapositioned at a corner of a drawer which holds the parts tray; and a tapered portion, coupled to at least one of the first and second wall members, and extending upwardly with respect to the first and second wall members, wherein the tapered portion engages a portion of the robotic mechanism so as to serve as a calibration point for establishing the home position of the robotic mechanism with respect to the parts tray.

Abstract: The present invention is a universal fixture for holding printed circuit boards with different sizes and shapes during stencil printing and other manufacturing processes related to printed circuit boards. In one embodiment, a universal fixture for holding a printed circuit board has a platform with a work surface, a first support member attached to the platform to hold a portion of a printed circuit board, and a second moveable support member attached to the first support member to support another portion of the printed circuit board. The platform is preferably adapted to be attached to a workstation of a processing machine, such as a stenciling machine for printing older or adhesive onto the printed circuit board. The first support member preferably has an elongated sidewall, a first endwall extending transversely from the sidewall, and a second endwall spaced apart from the first endwall along the sidewall and extending transversely from the sidewall.

Abstract: A method for calibrating a pick and place machine including picking a calibrated chip having a first calibration mark from a parts pick up jig with a placing head of the pick and place machine, placing the calibrated chip on a calibrated plate having a second calibration mark with the pick and place machine placing head, the calibrated plate being located on a pick and place machine assembly table and comparing the relative alignment of the first calibration mark and the second calibration mark.

Abstract: A method for calibrating the "Z" origin position of a pick and place machine including a planar element sized and configured to permit the planar element to be removably mounted on the assembly table of the machine. The "Z" origin calibration jig also includes a vertical displacement measurement device for measuring the relative vertical displacement of a part placement nozzle with relationship to a fixed elevation, typically the upper surface of the panel. In one embodiment of the invention, the vertical displacement measurement device includes a dial gauge attached to the planar element. One embodiment of the "Z" origin calibration jig includes a the planar element having a first aperture formed therein for accommodating the location of the dial portion of the dial gauge therethrough. In this embodiment the dial gauge is removably mountable within the first aperture with the dial portion of the gauge viewable at the top surface of the planar element.

Abstract: A method and apparatus for bending a plurality of leads of a component, in order to straighten and/or repair damaged or misaligned leads, is disclosed. The apparatus includes: a securing structure for receiving and holding the component; a first member for engaging the plurality of leads of the component; and a second member for engaging the plurality of leads of the component, wherein the first and second dowels cooperate with one another so as to form the plurality of leads into a desired configuration.

Abstract: A universal fixture for holding printed circuit board assemblies during stencil printing, pick-and-place processing, and other PCB assembly processes. In one embodiment, a universal printed circuit board holder has a base and a plurality of support members movably attached to the base. The support members may project away from the base along support paths, and the support members are selectively positionable along the support paths when the support members engage a side of a printed circuit board assembly. Accordingly, the support members may be selectively positioned at heights corresponding to a topography of the side of the printed circuit board assembly to uniformly support the printed circuit board assembly.