Abstract: A method and apparatus for calibrating surface mounting processes in the manufacturing of printed circuit board assemblies. In one embodiment of a method in accordance with the invention, a test pad of adhesive is deposited onto a substrate, and then a test module is mounted to the substrate at the test pad. The test module is representative of an electrical component that is to be mounted to a printed circuit board, and the test module is mounted to the substrate in a manner in which the electrical component is to be mounted to a printed circuit board. After the test module is mounted to the substrate, the profile of the test pad is detected through the substrate and/or the test module to determine whether the test pad contacts enough of the test module to sufficiently adhere the test module to the substrate without interfering with the terminals of the test module.

Abstract: A PCB support for supporting PCBs during surface mounting processing and other PCB assembly processes. In one embodiment, a PCB stand has a support structure attachable to an elevator table of a PCB processing machine and a platform connected to the support structure. The support structure may be a superstructure that can project away from the elevator table, and the platform may be a beam or other member that can support a significant portion of the surface area on the backside of the PCB. The superstructure and platform operate together to position the height of the platform with respect to the elevator table at an elevation at which the platform supports and interior region of the PCB assembly when the elevator table is in a processing position.

Abstract: An apparatus for calibrating surface mounting processes in the manufacturing of printed circuit board assemblies. In one embodiment of the invention, a test pad of adhesive is deposited onto a substrate, and then a test module is mounted to the substrate at the test pad. The test module is representative of an electrical component that is to be mounted to a printed circuit board, and the test module is mounted to the substrate in a manner in which the electrical component is to be mounted to a printed circuit board. After the test module is mounted to the substrate, the profile of the test pad is detected through the substrate and/or the test module to determine whether the test pad contacts enough of the test module to sufficiently adhere the test module to the substrate without interfering with the terminals of the test module. Accordingly, this embodiment of the invention provides an indication or estimate of the desired volume of an adhesive pad to mount a specific component to a PCB.

Abstract: An apparatus and method for the rapid switchover between different height modules in an automatic module testing and handling machine. The multi-chip module (MCM) handling apparatus comprises a bottom rail and a guide rail which has an upwardly extending wall and an outwardly extending flange which form a channel. This channel provides a passageway through which a MCM of a first thickness can pass laterally such that the first MCM is in contact with the top surface which positions contact nodes provided on the first MCM at a predetermined vertical position with respect to the top surface. This handling apparatus further comprises a removable justifying plate (RJP) which is removably attached within the first channel, thereby forming a second channel. This second channel provides a passage way through which a MCM of a second thickness, which is less than the first thickness of the first MCM, can pass laterally.

Abstract: A universal fixture for holding printed circuit board assemblies during stencil printing and other PCB assembly processes. In one embodiment, a universal printed circuit board holder has a plurality of supports adapted to be moveably connected to a platform of a printed circuit board processing machine. Each support has a connection end for engaging the platform, a support end to support a first side of a printed circuit board populated with components, and an attachment element at the support end to releasably hold the PCB to the support. The connection ends of the supports are moveably attachable to the platform at a plurality of different positions to selectively locate the attachment elements in alignment with support points on the first side of the printed circuit board. Accordingly, the universal printed circuit board holder preferably supports the populated first side of the printed circuit board in a manner that allows the second side to be manipulated by the printed circuit board processing machine.

Abstract: A salvage device facilitates detaching a plurality of components soldered to a plurality of modules used in printed circuit board assemblies. In one embodiment, a salvage device has a component receptacle with a component receiver that is adapted to hold a plurality of detached components. The salvage device also has a module holder attached to the component receptacle. In operation, the module holder suspends a plurality of modules over the component receiver to space the components attached to the modules apart from the component receiver. The salvage device is then placed in an oven to melt the solder contacts that bond the components to the modules. After the solder contacts reach a molten state, the components are preferably separated from the module by vibrating the components and the modules to break the surface tension of the molten solder. The components then fall into the component receiver and are removed from the oven.

Abstract: A carrier socket for receiving a component having a lead portion extending outwardly from the component, wherein the lead portion is a section of a lead remaining after another portion of the lead has been removed, the socket including: a housing having a cavity for receiving the component therein; a contact wheel positioned within the cavity so as to make electrical contact with the lead portion of the component when the component is inserted into the cavity; and a foot portion, extending outwardly from a surface of the housing so as to make electrical contact with an external contact, wherein the foot portion is electrically coupled to the contact wheel when the component is inserted into the cavity.

Abstract: The present invention is a universal fixture for holding printed circuit boards with different sizes and shapes during stencil printing and other manufacturing processes related to printed circuit boards. In one embodiment, a universal fixture for holding a printed circuit board has a platform with a work surface, a first support member attached to the platform to hold a portion of a printed circuit board, and a second moveable support member attached to the first support member to support another portion of the printed circuit board. The platform is preferably adapted to be attached to a workstation of a processing machine, such as a stenciling machine for printing solder or adhesive onto the printed circuit board. The first support member preferably has an elongated sidewall, a first endwall extending transversely from the sidewall, and a second endwall spaced apart from the first endwall along the sidewall and extending transversely from the sidewall.

Abstract: Disclosed is a thermal environment enclosure for a semiconductor test system, said enclosure comprising a housing having an exterior surface, an interior chamber and a window therethrough. The housing further comprised of a substantially rectangular top, a pair of substantially rectangular side walls, a front wall, a back wall, a top perimeter edge, and a bottom perimeter edge with an attached sealing gasket. The bottom perimeter edge defines an opening into the interior chamber which is configured for sealed mating with the recessed test area to define a imposed thermal environment test area. The top of the housing comprises a hingeably attached lid with a closing latch, the lid including an attached interior surface sealing gasket defining the interior chamber in combination with other walls when the lid is closed.

Abstract: A method of providing electrical contact between an external contact element and an electrical lead of a component includes the act of inserting the electrical component into a carrier socket having a housing and a cavity within the housing for receiving the electrical component. The method further includes electrically connecting the electrical lead and a first electrically conductive member, wherein the first conductive member includes a portion which extends into the cavity so as to make electrical contact with the electrical lead; securing the electrical component within the cavity; and electrically connecting the first conductive member to a second electrically conductive member, wherein the second conductive member includes a portion which extends outwardly from the housing so as to make electrical contact with the external contact element.

Abstract: A method for preserving solder paste in the manufacturing of printed circuit board assemblies. In one embodiment, the method utilizes a preserving device which has a frame adapted to be positioned on a stencil plate of a solder paste stenciling machine and a cover coupled to the frame. The frame has a wall that is configured to substantially surround at least a portion of the solder paste on the stencil plate between printing cycles. In a preferred embodiment, the wall is configured to surround a working region on the stencil plate defined by the area on the stencil plate that the solder paste contacts during a printing cycle. The cover is coupled to the frame to form a protective compartment that substantially houses the solder paste between printing cycles. As a result, the preserving device restricts the airflow across the solder paste to protect the solder paste from environmental elements within the stenciling machine.