Patents Assigned to MEC Company Ltd.
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Patent number: 11937573Abstract: In order to achieve a music providing system capable of controlling the behavioral state of a non-human animal using music, this music providing system for a non-human animal is provided with: a state information acquisition unit for acquiring state information relating to the motion state of an animal of interest; a state estimation processing unit for estimating the current behavioral state of the animal of interest from the state information; a target state storage unit for storing information relating to a target behavioral state for the animal of interest; a sound source storage unit for storing multiple music information pieces; a music information selection unit for detecting the degree of divergence of the current behavioral state from the target behavioral state and selecting one specific music information piece on the basis of the multiple music information pieces stored in the sound source storage unit; and a music information output unit for outputting the specific music information by wireless coType: GrantFiled: June 27, 2019Date of Patent: March 26, 2024Assignee: MEC COMPANY LTD.Inventors: Kiyoto Tai, Yuji Adachi, Hideshi Hamaguchi
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Publication number: 20230407486Abstract: The present invention includes an etching agent that selectively etches a copper layer of a processing target in which a noble metal layer containing a metal nobler than copper and the copper layer coexist, the etching agent including: a copper ion; one or more nitrogen-containing compounds selected from the group consisting of a heterocyclic compound having two or more nitrogen atoms in a ring and an amino group-containing compound having 8 or less carbon atoms; a polyalkylene glycol; and a halogen ion, in which the polyalkylene glycol is contained in an amount of 0.0005% by weight or more and 7% by weight or less, and the halogen ion is contained in an amount of 1 ppm or more and 250 ppm or less.Type: ApplicationFiled: September 30, 2021Publication date: December 21, 2023Applicant: MEC COMPANY LTDInventors: Yu FUKUI, Daisaku AKIYAMA, Dai NAKANE, Kenji NISHIE
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Patent number: 11230644Abstract: Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.Type: GrantFiled: March 1, 2021Date of Patent: January 25, 2022Assignee: MEC COMPANY LTD.Inventors: Koki Morikawa, Masahiro Hayashizaki, Motohiro Nakano, Masataka Araki
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Publication number: 20220017755Abstract: Provided are a coating film-forming composition for forming a coating film on a metal surface that exhibits excellent adhesiveness between a metal and a resin, and a surface-treated metal member having a coating film formed by using the composition. The coating film-forming composition is a solution containing a silane coupling agent having an amino group, a metallic ion and a halide ion. The metallic ion is preferably a copper ion, and a copper ion concentration in the solution is preferably 0.1 to 60 mM. The amount of Si based on the amount of Cu in the solution is preferably 30 or less, in terms of molar ratio. The pH of the solution is preferably 2.8 to 6.2.Type: ApplicationFiled: March 1, 2021Publication date: January 20, 2022Applicant: MEC COMPANY LTD.Inventors: Koki MORIKAWA, Masahiro HAYASHIZAKI, Motohiro NAKANO, Masataka ARAKI
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Patent number: 11208726Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 ?m or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.Type: GrantFiled: August 20, 2018Date of Patent: December 28, 2021Assignee: MEC COMPANY LTD.Inventors: Yuki Ogino, Takahiro Sakamoto, Kaoru Urushibata
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Publication number: 20210387255Abstract: The present invention relates to a copper powder for additive manufacturing, a method for producing the same, an additive manufactured product, a method for producing the same and the like, and an object of the present invention is to provide a copper powder for additive manufacturing that can sufficiently improve the mechanical strength and electrical conductivity of an additive manufactured product. The means for achieving the above-mentioned object of the present invention is, for example, a copper powder for additive manufacturing having a mean particle size of 1 ?m or more and 150 ?m or less, containing copper oxide in an amount of 0.10 g/m2 or more and 7.0 g/m2 or less per unit surface area and 0.5 mass % or more and 9.4 mass % or less per unit mass.Type: ApplicationFiled: November 29, 2019Publication date: December 16, 2021Applicants: MEC COMPANY., LTD., OSAKA RESEARCH INSTITUTE OF INDUSTRIAL SCIENCE AND TECHNOLOGYInventors: Daisuke KATAYAMA, Masato NAKAZAWA, Kaori IGAMI, Takahiro SUGAHARA, Takayuki NAKAMOTO, Takao MIKI, Sohei UCHIDA
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Patent number: 11053594Abstract: Disclosed are: a microetching agent which can form roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shape excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a method for producing a wiring board which includes a step of roughening a copper surface using the microetching agent. In the present invention, the microetching agent for copper is an acidic aqueous solution containing an inorganic acid, a cupric ion source, a halide ion source, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetching agent contain a sulfate ion source.Type: GrantFiled: January 7, 2020Date of Patent: July 6, 2021Assignee: MEC COMPANY LTD.Inventor: Keisuke Matsumoto
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Patent number: 10883027Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of ?1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.Type: GrantFiled: March 2, 2018Date of Patent: January 5, 2021Assignee: MEC COMPANY LTD.Inventors: Itsuro Tomatsu, Kosuke Kumazaki, Yasutaka Amitani, Yuko Shibanuma, Ikuyo Katayama
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Method for Producing Film Formation Substrate, Film Formation Substrate, and Surface Treatment Agent
Publication number: 20200325583Abstract: An object is to provide, for example, a method for manufacturing a film-forming substrate that can sufficiently improve both bleeding of a resin composition and adhesion between the resin composition and a metal substrate surface. For example, provided is a method for manufacturing a film-forming substrate having a film of a resin composition formed on a metal substrate surface, the method including: an etching step of etching a metal substrate surface with a micro-etching agent; a surface treatment step of bringing the etched metal substrate surface into contact with a surface treatment agent to perform a surface treatment such that a contact angle of water on the surface is 50° or more and 150° or less; and a film forming step of forming a film of a resin composition on the surface-treated metal substrate surface by an inkjet method.Type: ApplicationFiled: October 11, 2018Publication date: October 15, 2020Applicant: MEC COMPANY., LTD.Inventors: Kenji Nisie, Yuki Oka, Tomoko Ichihashi, Takuto Fujii -
Patent number: 10801112Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.Type: GrantFiled: December 15, 2017Date of Patent: October 13, 2020Assignee: MEC COMPANY LTD.Inventors: Daisaku Akiyama, Itsuro Tomatsu, Yasutaka Amitani, Keisuke Joko, Tokuya Satomi
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Publication number: 20200263308Abstract: A microetching agent is an acidic aqueous solution containing an organic acid, cupric ions, and halide ions. The molar concentration of halide ion of the microetching agent is 0.005 to 0.1 mol/L. By bringing the microetching agent into contact with a copper surface, the copper surface is roughened. An average etching amount in the depth direction during roughening is preferably 0.4 ?m or less. The microetching agent can impart on copper surfaces a roughened shape having excellent adhesiveness to resins and the like, even with a low etching amount.Type: ApplicationFiled: August 20, 2018Publication date: August 20, 2020Applicant: MEC COMPANY LTD.Inventors: Yuki OGINO, Takahiro SAKAMOTO, Kaoru URUSHIBATA
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Publication number: 20200157394Abstract: The coating film-forming composition includes an aromatic compound having an amino group and an aromatic ring in one molecule, and thio compound (sulfur oxoacids having a pKa of ?1.9 or less and salts thereof are excluded). pH of the coating film-forming composition is 4 to 10. The thio compound is preferably one that ionized to form anions in a solution, and thiosulfate and thiocyanate are especially preferable. By bringing the coating film-forming composition into contact with the surface of a metal member, a coating film is formed on the surface of the metal member, so that a surface-treated metal member can be obtained.Type: ApplicationFiled: March 2, 2018Publication date: May 21, 2020Applicant: MEC COMPANY LTD.Inventors: Itsuro TOMATSU, Kosuke KUMAZAKI, Yasutaka AMITANI, Yuko SHIBANUMA, Ikuyo KATAYAMA
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Publication number: 20200141010Abstract: Disclosed are: a microetching agent which can form roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shape excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a method for producing a wiring board which includes a step of roughening a copper surface using the microetching agent. In the present invention, the microetching agent for copper is an acidic aqueous solution containing an inorganic acid, a cupric ion source, a halide ion source, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetching agent contain a sulfate ion source.Type: ApplicationFiled: January 7, 2020Publication date: May 7, 2020Applicant: MEC COMPANY LTD.Inventor: Keisuke MATSUMOTO
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Publication number: 20200040460Abstract: The coating film-forming composition is a solution of pH 4 to 10 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and an oxidizing agent. As the oxidizing agent, hypochlorous acid, chlorous acid, chloric acid, perchloric acid, persulfuric acid, percarbonic acid, hydrogen peroxide, organic peroxides, or the like is used. The aromatic compound preferably contains a nitrogen-containing aromatic ring, and more preferably contains a primary amino group or a secondary amino group. The coating film-forming composition is used for, for example, forming a coating film on surface of a metal member.Type: ApplicationFiled: December 15, 2017Publication date: February 6, 2020Applicant: MEC COMPANY LTD.Inventors: Daisaku AKIYAMA, Itsuro TOMATSU, Yasutaka AMITANI, Keisuke JOKO, Tokuya SATOMI
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Patent number: 10329453Abstract: The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.Type: GrantFiled: March 13, 2017Date of Patent: June 25, 2019Assignee: MEC COMPANY LTD.Inventors: Daisaku Akiyama, Yoichi Sengoku, Itsuro Tomatsu, Masao Okada, Ryoko Mitani, Keisuke Joko, Yasutaka Amitani, Tokuya Satomi, Masaru Takahashi
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Publication number: 20190127606Abstract: The coating film-forming composition is a solution of pH 6 to 9 and includes an aromatic compound having an amino group and an aromatic ring in one molecule, a polybasic acid having two or more carboxy groups, and a halide ion. The content of polybasic acid in the coating film-forming composition is 0.05 to 10 times the content of aromatic compound, and the halide ion concentration is 5 to 600 mM. A coating film with excellent adhesion to a resin can be formed on a surface of a metal member by bringing the coating film-forming composition into contact with the surface of the metal member.Type: ApplicationFiled: March 13, 2017Publication date: May 2, 2019Applicant: MEC COMPANY LTD.Inventors: Daisaku AKIYAMA, Yoichi SENGOKU, Itsuro TOMATSU, Masao OKADA, Ryoko MITANI, Keisuke JOKO, Yasutaka AMITANI, Tokuya SATOMI, Masaru TAKAHASHI
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Patent number: 10174428Abstract: An etchant for copper includes an acid and one or more compounds selected from the group consisting of an aliphatic noncyclic compound, an aliphatic heterocyclic compound and a heteroaromatic compound. The aliphatic noncyclic compound is a saturated aliphatic noncyclic compound (A) including only two or more nitrogen atoms as heteroatoms, and 2 to 10 carbon atoms. The aliphatic heterocyclic compound is a compound (B) including a five-, six-, or seven-membered ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring. The heteroaromatic compound is a compound (C) including a six-membered heteroaromatic ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring.Type: GrantFiled: May 31, 2016Date of Patent: January 8, 2019Assignee: MEC Company Ltd.Inventors: Hirofumi Kodera, Ikuyo Katayama, Shota Hishikawa
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Publication number: 20190003062Abstract: Disclosed are: a microetching agent which can form roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shape excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a method for producing a wiring board which includes a step of roughening a copper surface using the microetching agent. In the present invention, the microetching agent for copper is an acidic aqueous solution containing an inorganic acid, a cupric ion source, a halide ion source, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetching agent contain a sulfate ion source.Type: ApplicationFiled: February 8, 2017Publication date: January 3, 2019Applicant: MEC COMPANY LTD.Inventor: Keisuke MATSUMOTO
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Patent number: 9932678Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.Type: GrantFiled: August 1, 2016Date of Patent: April 3, 2018Assignee: MEC COMPANY LTD.Inventors: Masayo Kurii, Kiyoto Tai, Mami Nakamura
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Publication number: 20170342566Abstract: The invention relates to a washing solution for a tin plating film after electroless tin plating and before water washing. The invention also relates to a method for forming a tin plating film, the method includes a step of washing step using the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution has a chloride ion concentration of 2 wt % or more, and a tin concentration of 0.5 wt % or less. The washing solution according to the present invention has good washing property for a tin plating film surface, and allows a tin plating film to easily maintain its properties. In addition the washing solution causes little influence on a tin plating film surface even when continuously used and is excellent in temporal stability.Type: ApplicationFiled: September 17, 2015Publication date: November 30, 2017Applicant: MEC COMPANY LTD.Inventors: Yuko SHIBANUMA, Tatsuya GODA, Jojiro NIGORO, Tomoko ICHIHASHI, Keisuke JOKO, Takahiro YAMADA, Tsuyoshi AMATANI