Abstract: The etching agent is an aqueous solution including at least one acid selected from the group consisting of inorganic acids other than nitric acid, and organic acids; and an organic nitrogen compound having a molecular structure containing N—OH or N—O?. The acid concentration of the etching agent is 0.05 to 3% by weight, and the organic nitrogen compound concentration of the etching agent is 0.005 to 5% by weight. By bringing the etching agent into contact with a surface of a magnesium component, fine irregularities can be formed on the surface of the magnesium component even when etching depth is large.

Abstract: Disclosed is an etching agent for steel. The etching agent is an acidic aqueous solution including ferrous ions, ferric ions, and an acetylene group-containing water-soluble compound. The concentration of ferrous ion A % by weight and the concentration of ferric ion B % by weight in the etching agent is preferably from 0.1 to 2.5. Also disclosed is a replenishing liquid that is added to the etching agent when the etching agent is continuously or repeatedly used. The replenishing liquid is an aqueous solution including an acetylene group-containing water-soluble compound.

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract: Provided are a surface roughening agent for aluminum and a surface roughening method using said surface roughening agent wherein it is possible to easily reduce costs for the surface roughening step and to improve the adhesiveness between aluminum and a resin. Specifically, provided is a surface roughening agent for aluminum comprising an aqueous solution containing: an alkali source, an amphoteric metal ion, a nitrate ion, and a thio compound. Moreover, provided is a surface roughening method for aluminum which involves a surface roughening step in which the surface of aluminum is treated with the aforementioned surface roughening agent.

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract: Disclosed is a microetching solution, a replenishment solution added to said microetching solution and a method for production of a wiring board using said microetching solution. The microetching solution for copper consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, a polymer and a nonionic surfactant. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. In the microetching solution of the present invention, a value of A/B is 2000 to 9000 and a value of A/D is 500 to 9000, where a concentration of the halide ion is A % by weight, a concentration of the polymer is B % by weight and a concentration of the nonionic surfactant is D % by weight. Using this microetching solution, adhesion to a resin or the like can be uniformly maintained even with a low etching amount.

Abstract: The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 ?m.

Abstract: Provided are a surface roughening agent for aluminum and a surface roughening method using said surface roughening agent wherein it is possible to easily reduce costs for the surface roughening step and to improve the adhesiveness between aluminum and a resin. Specifically, provided is a surface roughening agent for aluminum comprising an aqueous solution containing: an alkali source, an amphoteric metal ion, a nitrate ion, and a thio compound. Moreover, provided is a surface roughening method for aluminum which involves a surface roughening step in which the surface of aluminum is treated with the aforementioned surface roughening agent.

Abstract: Provided are: a coating-forming liquid composition capable of forming a coating for bonding copper to a photosensitive resin, which includes an aqueous solution containing an azole having only nitrogen as ring hetero atom, an acid having a logarithm of the reciprocal of acid dissociation constant of 3 to 8 at 25° C., and a salt thereof, has a pH of more than 4 and not more than 7 at 25° C., and can stably form a coating for improving adhesion between copper and a photosensitive resin even when used continuously or repeatedly; and a method of forming a coating for bonding copper to a photosensitive resin, which comprises bringing the surface of the copper into contact with the coating-forming liquid composition to form the coating.

Abstract: The method for forming a laminate of the present invention is a method for forming a laminate, comprising a silane coupling agent treatment step of applying an aqueous solution of a silane coupling agent onto a surface of a metal layer, and drying the resultant applied film to form a silane coupling agent coating, and a lamination step of laminating a resin layer on the silane coupling agent coating, these steps being continuously performed, wherein when the formed silane coupling agent coating is analyzed in the silane coupling agent treatment step by FT-IR with a reflection absorption spectrometry and then the peak area of Si—O is turned to a value less than a predetermined threshold value, at least one part of the aqueous solution of the silane coupling agent is renewed, thereby conducting the silane coupling agent treatment while the peak area is controlled into a predetermined range.

Abstract: The method for forming a laminate of the present invention is a method for forming a laminate, comprising a silane coupling agent treatment step of applying an aqueous solution of a silane coupling agent onto a surface of a metal layer, and drying the resultant applied film to form a silane coupling agent coating, and a lamination step of laminating a resin layer on the silane coupling agent coating, these steps being continuously performed, wherein when the formed silane coupling agent coating is analyzed in the silane coupling agent treatment step by FT-IR with a reflection absorption spectrometry and then the peak area of Si—O is turned to a value less than a predetermined threshold value, at least one part of the aqueous solution of the silane coupling agent is renewed, thereby conducting the silane coupling agent treatment while the peak area is controlled into a predetermined range.

Abstract: The object of the invention is to provide an adhesive layer forming liquid capable of maintaining the performance of forming an adhesive layer easily and keeping adhesive property to a resin certainly, and an adhesive layer forming process using the liquid. The adhesive layer forming liquid of the invention is an adhesive layer forming liquid for forming an adhesive layer for bonding a copper and a resin to each other, which is an aqueous solution comprising an acid, a stannous salt, a stannic salt, a complexing agent, and a stabilizer, and which is prepared to set the value of B/A to 0.010 or more and 1.000 or less at the time of the preparation, wherein A represents the concentration (unit: % by mass) of the stannous salt as the concentration of bivalent tin ions, and B represents the concentration (unit: % by mass) of the stannic salt as the concentration of tetravalent tin ions.

Abstract: The present invention provides a copper compound having a decomposition temperature in a range of 100° C. to 300° C. and including one unit or a plurality of connected units represented by the following Formula (1): [R1COO]n[NH3]mCuX1p??(1) where n is 1 to 3; m is 1 to 3; p is 0 to 1; n pieces of R1 respectively represent the following Formula (2), CH2X2, CH2X2(CHX2)q, NH2, or H, and may be the same or different from each other, or n is 2 and two pieces of [R1COO] represent together the following Formula (3); R2, R3, and R4 are respectively CH2X2, CH2X2(CHX2)q, NH2, or H; R5 is —(CHX2)r—; X2 is H, OH, or NH2; r is 0 to 4; q is 1 to 4; and X1 is NH4+, H2O, or solvent molecules According to the above configuration, there are provided a copper compound capable of forming a copper thin film required for producing an electronic device or the like safely, inexpensively, and easily, and a method for producing a copper thin film using the copper compound.

Abstract: An object of the present invention is to provide an adhesive layer forming liquid about which deterioration in adhesive-layer-forming capability with the passage of time can be restrained and further the smoothness of an adhesive layer surface can be certainly kept. The adhesive layer forming liquid of the present invention is an adhesive layer forming liquid, which is a liquid for forming an adhesive layer for bonding copper and a resin to each other, and which is an aqueous solution comprising an acid, a stannic salt, a complexing agent, a stabilizer, and a complexing restrainer for restraining a complexing reaction between the complexing agent and copper.

Abstract: The object of the present invention is to provide an electroconductive layer that retains bondability to a resin layer certainly and is further a layer from which a copper-tin alloy layer is easily removed in a subsequent step, a laminate using this layer, and producing processes thereof. The electroconductive layer of the present invention is an electroconductive layer which is to be bonded to a resin layer, and which contains a copper layer and a copper-tin alloy layer laminated over the copper layer, wherein the copper-tin alloy layer has a thickness of 0.001 to 0.020 ?m.

Abstract: An adhesive layer for resin according to the present invention is formed of copper or a copper alloy for adhering a resin to a layer of copper or a copper alloy. The adhesive layer is formed of a metal layer of a coralloid structure made of an aggregation of a number of particles of copper or a copper alloy with gaps between the particles, and a plurality of micropores are present on the surface. The micropores have an average diameter in a range of 10 nm to 200 nm, and at least two micropores in average are present per 1 ?m2 of the metal layer surface. Thereby, sufficient adhesion between the resin and the copper or copper alloy is provided. This serves to prevent ion migration caused by dendrites, which has been a problem in a conventional layer of tin or a tin alloy, and the adhesion to a resin having a high-glass transition temperature (Tg) is improved as well. The present invention also provides a method of producing a laminate including the adhesive layer.

Abstract: An etchant for copper and copper alloys, includes an aqueous solution containing: 14 to 155 g/liter of cupric ion source in terms of a concentration of copper ions; 7 to 180 g/liter of hydrochloric acid; and 0.1 to 50 g/liter of azole, the azole including nitrogen atoms only as heteroatoms residing in a ring. A method for producing a wiring by etching of copper or copper alloys, includes the step of: etching a portion of a copper layer on an electrical insulative member that is not covered with an etching resist using the above-described etchant so as to form the wiring. Thereby, a fine and dense wiring pattern with reduced undercut can be formed.

Abstract: A metal removing solution of the present invention is a solution for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, and the metal removing solution contains a chain thiocarbonyl compound. A removing method of the present invention for removing palladium, tin, silver, palladium alloy, silver alloy, and tin alloy is a method for selectively removing a metal other than copper or copper alloy, from a system that includes copper or copper alloy and at least one selected from palladium, tin, silver, palladium alloy, silver alloy, and tin alloy, by using a metal removing solution containing a chain thiocarbonyl compound.

Abstract: An etchant of the present invention includes an aqueous solution containing hydrochloric acid, nitric acid, and a cupric ion source. An etching method of the present invention includes bringing the etchant into contact with at least one metal selected from nickel, chromium, nickel-chromium alloys, and palladium. Another etching method of the present invention includes bringing a first etchant that includes an aqueous solution containing at least the following components A to C (A. hydrochloric acid; B. at least one compound selected from the following (a) to (c): (a) compounds with 7 or less carbon atoms, containing a sulfur atom(s) and at least one group selected from an amino group, an imino group, a carboxyl group, a carbonyl group, and a hydroxyl group; (b) thiazole; and (c) thiazole compounds; and C.