Abstract: An etchant for copper includes an acid and one or more compounds selected from the group consisting of an aliphatic noncyclic compound, an aliphatic heterocyclic compound and a heteroaromatic compound. The aliphatic noncyclic compound is a saturated aliphatic noncyclic compound (A) including only two or more nitrogen atoms as heteroatoms, and 2 to 10 carbon atoms. The aliphatic heterocyclic compound is a compound (B) including a five-, six-, or seven-membered ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring. The heteroaromatic compound is a compound (C) including a six-membered heteroaromatic ring having one or more nitrogen atoms as one or more heteroatoms constituting the ring.

Abstract: Disclosed are: a microetching agent which can form roughened shapes less affected by differences in the crystallinity of the copper and with which roughened shape excellent in terms of adhesiveness to resins, etc. can be formed on either electrolytic copper or rolled copper; and a method for producing a wiring board which includes a step of roughening a copper surface using the microetching agent. In the present invention, the microetching agent for copper is an acidic aqueous solution containing an inorganic acid, a cupric ion source, a halide ion source, and a polymer. The polymer has a functional group containing a nitrogen atom. It is preferable that the microetching agent contain a sulfate ion source.

Abstract: This invention is related to a heating plate for a heated clothing and a connecting structure of the same. The heating plate comprises a heater strip which two ends are connected with two electric wires respectively, and each electric wire comprises sequentially a first right angle, a horizontal segment, a second right angle, and a vertical segment. The vertical segments of the electric wires go out from a covering piece which covers the heater strip and the electric wires. Therefore, when the electric wires of the heating plate are pulled, the pull strength is dispersed at the right-angle bend to be decreased, avoiding the heater strip moving. Furthermore, when the heating plate is set on the heated clothing, according to different size of the heated clothing, the length of an assembly electric wire is relative to the distance between the heating plates.

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract: A break-proof assembly for wires of a temperature control switch of a heated clothing is revealed. Several first wires are extended from a switch body of the temperature control switch of the heated clothing and connected to second wires respectively while the second wires are connected to a heating plate of the heated clothing. A first end of a protective pad is connected to an edge of the switch body and extended toward a second end thereof to cover a part of the first wire outside the switch body. Thereby the first wires and the edge of the switch body are connected to one part to prevent breakage of the first wires caused by wear between the edge of the switch body and the first wires. Therefore the heated clothing can be washed directly in a washer and convenience in use is improved.

Abstract: Provided is a method for producing a heat sink that can easily and effectively form a heat radiating film on the surface of a substrate without requiring enormous heat energy for increasing the temperature of the substrate. The method is a method for producing a heat sink having a substrate and a heat radiating film formed on the surface of the substrate, including a first step of casting a substrate by injecting molten metal into a cavity of molding dies; and a second step of applying a heat radiating coating to the substrate through spraying or dropping in the period from when the molding dies are opened after the casting until when the temperature of the substrate that has been cast becomes lower than the deposition temperature that is a temperature necessary to deposit the heat radiating coating on the substrate.

Abstract: This invention relates to a main optical system for an endoscope, in particular, to a main optical system for an endoscope that is focally imaging in the visible and near-infrared lights, which belongs to the technical field of minimally invasive surgery. The used approach is: the objective lens set has a positive off-focus and positive field curvature. The steering set has the negative off-focus and negative field curvature. Moreover, a field lens set is added between the objective lens set and the steering set. The field lens set is located near the focus of the objective lens set. After the field lens is combined with the objective lens set, it will have the positive off-focus and positive field curvature that match to the steering set so that the 850 m defocus amount is less than 0.05 mm and the edge field curvature is less than 0.1 mm in the main endoscope optical system. The system is good in imaging.

Abstract: The invention relates to a washing solution for a tin plating film after electroless tin plating and before water washing. The invention also relates to a method for forming a tin plating film, the method includes a step of washing step using the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution has a chloride ion concentration of 2 wt % or more, and a tin concentration of 0.5 wt % or less. The washing solution according to the present invention has good washing property for a tin plating film surface, and allows a tin plating film to easily maintain its properties. In addition the washing solution causes little influence on a tin plating film surface even when continuously used and is excellent in temporal stability.

Abstract: The etching agent is an aqueous solution including at least one acid selected from the group consisting of inorganic acids other than nitric acid, and organic acids; and an organic nitrogen compound having a molecular structure containing N—OH or N—O?. The acid concentration of the etching agent is 0.05 to 3% by weight, and the organic nitrogen compound concentration of the etching agent is 0.005 to 5% by weight. By bringing the etching agent into contact with a surface of a magnesium component, fine irregularities can be formed on the surface of the magnesium component even when etching depth is large.

Abstract: Disclosed is an etching agent for steel. The etching agent is an acidic aqueous solution including ferrous ions, ferric ions, and an acetylene group-containing water-soluble compound. The concentration of ferrous ion A % by weight and the concentration of ferric ion B % by weight in the etching agent is preferably from 0.1 to 2.5. Also disclosed is a replenishing liquid that is added to the etching agent when the etching agent is continuously or repeatedly used. The replenishing liquid is an aqueous solution including an acetylene group-containing water-soluble compound.

Abstract: A surface treatment method for a metal material is provided which includes applying diluted sulfuric acid to a surface of the metal material that is composed primarily of iron, performing a heat treatment on the metal material in the presence of at least one of CO, CO2 and organic gas under nitriding conditions under which a nitrided layer is formed in a superficial layer of the metal material after the application of the diluted sulfuric acid to form a carbon film which includes at least one of carbon nanocoils, carbon nanotubes and carbon nanofilaments on a surface of the nitrided layer of the metal material.

Abstract: A metal cellular wheel (10) for a pressure wave supercharger comprising an outer sleeve (12) arranged coaxial to a rotational axis (y), an inner sleeve (14) arranged coaxial to the outer sleeve (12), and at least one intermediate sleeve (18) arranged between and coaxial to the outer sleeve (12) and the inner sleeve (14). Fins (16) are arranged between successive sleeves (12, 18; 18, 14), aligned radially to axis (y), and joined to adjacent sleeves (12, 18; 18, 14). On outer sleeve (12), outer sealing sleeves (24) engage over the outer sleeve (12), are joined with the outer sleeve (12), and have a sealing profile (30) for a labyrinth seal. A drive shaft (13) along axis (y) is joined with the inner sleeve (14), and the intermediate sleeve(s) (18) has (have) notches (26) extending, between adjacent fins (16), from both end faces (11) of the cellular wheel (10).

Abstract: An oil-based release agent of the present invention contains a petroleum-based hydrocarbon solvent (a) and a high temperature adhesive (b), is applied to a metal die used for die casting or casting, has high adhesion and high lubricity even with respect to a metal die at a high temperature particularly of 300° C. or higher, and can prevent seizure. In addition, the present invention provides a method for applying the oil-based release agent of the present invention by controlling an adhesion amount thereof by micronization and speed-control thereof with respect to a metal die at a high temperature, and an electrostatic application method.

Abstract: The present invention relates to a push button switch 5 comprising a curved deformable contact element 4. The push button switch 5 comprises at least one first terminal point 1, at least one second terminal point 2, and at least one third terminal point 3. The deformable contact element 4 is switched between a first and a second state. In the first state the deformable contact element 4 connects the at least one first terminal point 1 with the at least one second terminal point 2 whereas there is neither contact between the at least one third terminal point 3 and the at least one first terminal point 1 nor between the at least one third terminal point 3 and the at least one second terminal point 2.

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract: Provided are a surface roughening agent for aluminum and a surface roughening method using said surface roughening agent wherein it is possible to easily reduce costs for the surface roughening step and to improve the adhesiveness between aluminum and a resin. Specifically, provided is a surface roughening agent for aluminum comprising an aqueous solution containing: an alkali source, an amphoteric metal ion, a nitrate ion, and a thio compound. Moreover, provided is a surface roughening method for aluminum which involves a surface roughening step in which the surface of aluminum is treated with the aforementioned surface roughening agent.

Abstract: Disclosed is a microetching solution for copper, a replenishment solution therefor and a method for production of a wiring board. The microetching solution of the present invention consists of an aqueous solution containing a cupric ion, an organic acid, a halide ion, an amino group-containing compound having a molecular weight of 17 to 400 and a polymer. The polymer is a water-soluble polymer including a polyamine chain and/or a cationic group and having a weight average molecular weight of 1000 or more. When a concentration of the amino group-containing compound is A % by weight and a concentration of the polymer is B % by weight, a value of A/B of the microetching solution of the present invention is 50 to 6000. According to the present invention, an adhesion between copper and a resin or the like may be maintained even with a low etching amount.

Abstract: A method for producing a cellular wheel, wherein a tool having a cylindrical inner shell, the diameter of which corresponds to the inner diameter of the subsequent sleeve, is placed on the free end edges of the fins for fixing the angular orientation of the fins. A molding material mixture is applied in the cells bounded by the inner shell of the tool and the fins and cured. After removing the tool, the subsequent sleeve is placed on the free end edges of the fins fixed in place by the cured molding material mixture. The free end edges of the fins are joined to the subsequent sleeve to the cells. The cured molding material mixture is thermally treated and is removed from the cells.