Patents Assigned to MEDIATEK
  • Patent number: 12277022
    Abstract: A method for adaptively adjusting state transition time in a Peripheral Component Interconnect (PCI) Express (PCIe) system and associated apparatus such as a root complex (RC) device and an endpoint device are provided. The method may include: toggling a clock request signal on a signal path coupled between the RC device and the endpoint device based on a request from the RC device or on a request from the endpoint device, wherein when the clock request signal toggles, the endpoint device transits from a first state to a second state; and toggling a reference clock signal from the RC device at a timing determined according to a training parameter among at least one predetermined parameter which is set dependent on at least one of the factors: a transition time, a restoration delay, a latency tolerance report (LTR) and a bias state, after the clock request signal toggles.
    Type: Grant
    Filed: January 12, 2023
    Date of Patent: April 15, 2025
    Assignee: MEDIATEK INC.
    Inventor: Sheng-Ya Tung
  • Patent number: 12279230
    Abstract: A method of handling Paging Early Indication with Paging Subgrouping (PEIPS) assistance information when a UE is registered to the same or different PLMN/SNPN networks is proposed. The PEIPS assistance information includes PEIPS parameters such as a PEIPS subgroup ID that is used by the UE for monitoring paging with PEIPS for power saving. If the UE registers to the same PLMN/SNPN via 3GPP access and non-3GPP access, then the UE handles the PEIPS parameters as one common parameters. If the UE registers to different PLMN/SNPN via 3GPP access and non-3GPP access, then the UE handles the PEIPS parameters as two independent parameters.
    Type: Grant
    Filed: December 13, 2022
    Date of Patent: April 15, 2025
    Assignee: MediaTek Inc.
    Inventor: Yuan-Chieh Lin
  • Patent number: 12278992
    Abstract: A method and apparatus for joint sign prediction of transform coefficients. At the encoder side, a maximum number is determined according to coding context of the current block. A set of jointly predicted coefficient signs associated with a set of selected transform coefficients is determined where a total number of the set of jointly predicted coefficient signs is equal to or smaller than the maximum number. Joint sign prediction for the set of jointly predicted coefficient signs is determined by selecting one hypothesis from a group of hypotheses corresponding to combinations of the set of jointly predicted coefficient signs that achieves a minimum cost.
    Type: Grant
    Filed: November 8, 2022
    Date of Patent: April 15, 2025
    Assignee: MEDIATEK INC.
    Inventor: Shih-Ta Hsiang
  • Publication number: 20250119173
    Abstract: A method for dynamically allocating radio frequency (RF) exposure across multiple RF groups including a first RF group and a second RF group includes: estimating RF exposure of the first RF group according to at least one message of the first RF group, in order to generate estimated RF exposure; calculating RF exposure of the second RF group according to at least one message of the second RF group, the estimated RF exposure, and one or more equations, in order to generate calculated RF exposure, wherein the one or more equations are associated with a predetermined regulation; and determining a TX power limit corresponding to the first RF group and a TX power limit corresponding to the second RF group according to the estimated RF exposure and the calculated RF exposure, respectively.
    Type: Application
    Filed: September 11, 2024
    Publication date: April 10, 2025
    Applicant: MEDIATEK INC.
    Inventors: Fu-Tse Kao, Yi-Hsuan Lin, Tsung-Po Yu
  • Publication number: 20250117229
    Abstract: An electronic device includes a processor arranged to execute an application, a platform and a middleware. The application is configured to execute operations of: providing at least one acceptable quality and at least one priority of the at least one profile parameter. The platform is configured to execute an operation of: providing platform information in response to a demand request. The middleware is configured to execute operations of: receiving the at least one acceptable quality and the at least one priority from the application; receiving the platform information from the platform; performing a self-adaptive algorithm according to the platform information to generate a result; adjusting the at least one profile parameter according to the result, the at least one acceptable quality and the at least one priority; and transmitting an adjustment notification to the platform, after adjusting the at least one profile parameter.
    Type: Application
    Filed: October 3, 2024
    Publication date: April 10, 2025
    Applicant: MEDIATEK INC.
    Inventors: Yi-Wei Ho, Hsien-Hsi Hsieh, Kan-Yao Chang, Wei-Shuo Chen, Chung-Yang Chen, Cheng-Che Chen
  • Publication number: 20250119841
    Abstract: A method for performing mapping between one or more radio modules and one or more radiofrequency (RF) groups includes: separating the one or more radio modules into the one or more RF groups according to one or more messages, wherein the one or more messages comprise a previous TX power ratio, a TX power ratio margin, one or more weighting information, one or more TX performance indices, one or more receiving (RX) performance indices, one or more configurations, or one or more usage scenarios; accumulating RF exposure of the one or more radio modules to at least one RF group among the one or more RF groups; and determining at least one transmitting (TX) power limit corresponding to the at least one RF group according to accumulated RF exposure of the at least one RF group.
    Type: Application
    Filed: October 1, 2024
    Publication date: April 10, 2025
    Applicant: MEDIATEK INC.
    Inventors: Tsung-Po Yu, Yi-Hsuan Lin, Fu-Tse Kao
  • Patent number: 12272755
    Abstract: A semiconductor structure includes several semiconductor stacks over a substrate, and each of the semiconductor stacks extends in a first direction, wherein adjacent semiconductor stacks are spaced apart from each other in a second direction, which is different from the first direction. Each of the semiconductor stacks includes channel layers above the substrate and a gate structure across the channel layers. The channel layers are spaced apart from each other in the third direction. The gate structure includes gate dielectric layers around the respective channel layers, and a gate electrode along sidewalls of the gate dielectric layers and a top surface of the uppermost gate dielectric layer. The space in the third direction between the two lowermost channel layers is greater than the space in the third direction between the two uppermost channel layers in the same semiconductor stack.
    Type: Grant
    Filed: January 23, 2024
    Date of Patent: April 8, 2025
    Assignee: MEDIATEK INC.
    Inventors: Cheng-Tien Wan, Ming-Cheng Lee
  • Patent number: 12273878
    Abstract: Various solutions for dynamic cross-carrier scheduling with respect to user equipment and network apparatus in mobile communications are described. An apparatus may receive a physical downlink control channel (PDCCH) on a first component carrier (CC). The apparatus may receive a physical downlink shared channel (PDSCH) on the first CC scheduled by the PDCCH. The apparatus may determining a second CC to transmit a physical uplink control channel (PUCCH) according to a configuration of dynamic switching of CC. The apparatus may transmit the PUCCH corresponding to the PDSCH on the second CC scheduled by the PDCCH.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: April 8, 2025
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Jozsef G. Nemeth, Mohammed S. Aleabe Al-Imari, Abdellatif Salah
  • Patent number: 12272022
    Abstract: The quality of a frame sequence is enhanced by a booster engine collaborating with a first stage circuit. The first stage circuit adjusts the quality degradation of the frame sequence when a condition in constrained resources is detected. The quality degradation includes at least one of uneven resolution and uneven frame per second (FPS). The booster engine receives the frame sequence from the first stage circuit, and generates an enhanced frame sequence based on the frame sequence for transmission to a second stage circuit.
    Type: Grant
    Filed: August 24, 2022
    Date of Patent: April 8, 2025
    Assignee: MediaTek Inc.
    Inventors: Yao-Sheng Wang, Pei-Kuei Tsung, Chiung-Fu Chen, Wai Mun Wong, Chao-Min Chang, Yu-Sheng Lin, Chiani Lu, Chih-Cheng Chen
  • Patent number: 12273295
    Abstract: A receive (Rx) UE performs blind detection to decode a first-stage Sidelink Control Information (SCI) in a received signal. The first-stage SCI contains control information for the Rx UE to locate time-and-frequency resources used by a transmit (Tx) UE. The time-and-frequency resources are used to transmit the first-stage SCI and a second-stage SCI via a Physical Sidelink Control Channel (PSCCH) and to transmit data via a Physical Sidelink Shared Channel (PSSCH) associated with the PSCCH. The Rx UE locates the second-stage SCI in the time-and-frequency resources based on the first-stage SCI. The second-stage SCI contains additional control information from the Tx UE to the Rx UE for the sidelink V2X communication. The Rx UE decodes the second-stage SCI using at least in part an identifier which identifies the Rx UE as a destination of the received signal.
    Type: Grant
    Filed: September 25, 2019
    Date of Patent: April 8, 2025
    Assignee: MEDIATEK INC.
    Inventors: Chien-Yi Wang, Ju-Ya Chen, Tao Chen
  • Patent number: 12269761
    Abstract: Methods are proposed to define UE behavior for performing synchronization signal block (SSB) based radio link monitoring (RLM) and channel state information reference signal (CSI-RS) based RLM. In a first novel aspect, if CSI-RS based RLM-RS is not QCLed to any CORESET, then UE determines that CSI-RS RLM configuration is error and does not perform RLM accordingly. In a second novel aspect, SSB for RLM and RLM CSI-RS resources are configured with different numerologies. UE perform SSB based RLM and CSI-RS based RLM based on whether the SSB and CSI-RS resources are TDMed configured by the network. In a third novel aspect, when multiple SMTC configurations are configured to UE, UE determines an SMTC period and whether SMTC and RLM-RS are overlapped for the purpose of RLM evaluation period determination.
    Type: Grant
    Filed: July 29, 2023
    Date of Patent: April 8, 2025
    Assignee: MediaTek Inc.
    Inventors: Hsuan-Li Lin, Kuhn-Chang Lin
  • Patent number: 12273838
    Abstract: Various solutions for synchronization in non-terrestrial network (NTN) communications are proposed. An apparatus implemented in a user equipment (UE) obtains at least one of a downlink (DL) pre-compensated frequency value applied on a service link from a satellite of a non-terrestrial network (NTN) and a feeder link delay drift rate of a feeder link between a network node and the satellite. The apparatus further obtains a Doppler frequency shift value. Then, the apparatus performs a timing compensation through adjusting a sampling rate according to at least one of the DL pre-compensated frequency value, the feeder link delay drift rate, and the Doppler frequency shift value.
    Type: Grant
    Filed: January 12, 2022
    Date of Patent: April 8, 2025
    Assignee: MEDIATEK SINGAPORE PTE. LTD.
    Inventors: Abdelkader Medles, Gilles Charbit
  • Patent number: 12272887
    Abstract: An antenna is provided. The antenna includes a first radiator positioned at a first level and connected to a ground plane at a second level. In a top view, the first radiator has a first edge, a second edge, a third edge, a fourth edge and a first arc edge. The second edge and the third edge are connected to opposite ends of the first edge. The fourth edge is connected to an end of the third edge opposite to the first edge. The first arc edge with a first radius has opposite ends respectively connected to the second edge and the fourth edge. The first arc edge has a first arc length corresponding to a first central angle, which is less than 90 degrees.
    Type: Grant
    Filed: January 31, 2023
    Date of Patent: April 8, 2025
    Assignee: MEDIATEK INC.
    Inventors: Chung-Hsin Chiang, Nai-Chen Liu, Shih-Huang Yeh
  • Publication number: 20250111215
    Abstract: A method can include determining which computing units in a computing-in-memory (CIM) macro are to be turned off, the CIM macro including an array of the computing units with X rows and Y columns, the X rows of computing units being organized into N row-groups, each row-group including multiple rows of computing units, the Y columns of computing units being organized into M column-groups, each column-group including multiple columns of computing units, based on the determination of which computing units in the CIM macro are to be turned off, turning off at least one row-group or column-group of computing units, each row-group and column-group of computing units being separately controllable to be turned off, and performing a computation based on kernel weights and activations of a neural network stored in the active computing units in the CIM macro that are not turned off.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: MEDIATEK INC.
    Inventors: Chieh-Fang TENG, En-Jui CHANG, Chih Chung CHENG
  • Publication number: 20250112166
    Abstract: A flip-chip package includes a substrate having a bond pad in a die-mounting area of the substrate. A DRAM die is mounted on the die-mounting area of the substrate in a flip chip fashion. The DRAM die includes an input/output (I/O) pad on its active surface and the I/O pad is electrically coupled to the t bond pad through a connecting element. The bond pad has a diameter that is smaller than a diameter of the I/O pad. A SoC die is mounted on the substrate in a flip chip fashion. The DRAM die and the SoC die are mounted on the substrate in a side-by-side manner.
    Type: Application
    Filed: September 22, 2024
    Publication date: April 3, 2025
    Applicant: MEDIATEK INC.
    Inventors: Pei-Haw Tsao, Te-Chi Wong
  • Publication number: 20250113108
    Abstract: An image adjustment method, applied to an image sensing system comprising an image sensor, comprising: (a) sensing a target image by the image sensor; (b) dividing the target image to a plurality of image regions; (c) acquiring location information of at least one first target feature in the image regions; (d) computing brightness information of each of the image regions; (e) generating adjustment curves according to the brightness information and according to required brightness values of each of the image regions; and (f) adjusting brightness values of the image regions according to the adjustment curves. The step (d) adjusts the brightness information according to the location information or the step (e) adjusts the adjustment curves according to the location information.
    Type: Application
    Filed: September 28, 2023
    Publication date: April 3, 2025
    Applicant: MEDIATEK INC.
    Inventors: Jan-Wei Wang, Huei-Han Jhuang, Po-Yu Huang, Ying-Jui Chen, Chi-Cheng Ju
  • Publication number: 20250110515
    Abstract: The present invention provides a circuitry including a regulator and a control circuit is disclosed. The regulator is configured to receive an input signal to generate an output voltage. The control circuit is configured to select one of a first reference voltage and a second reference voltage to serve as an output reference voltage according to an output signal of the regulator, and generate a control signal according to the output reference voltage to control a voltage level of the output voltage of the regulator.
    Type: Application
    Filed: December 12, 2024
    Publication date: April 3, 2025
    Applicant: MEDIATEK INC.
    Inventors: Chih-Chien Huang, Chuan-Chang Lee
  • Publication number: 20250112665
    Abstract: An electronic device and a method for estimating scattering parameters of a two-port network are provided. The electronic device includes a two-port network, a directional coupler, an input calibration kit placed in front of the two-port network, an output calibration kit placed behind the two-port network, and a control switch connected between the directional coupler and the two-port network. The directional coupler transmits a desired signal and receives a forward signal and a reverse signal from the two-port network. When the control switch is turned off, input calculation results are calculated according to the forward signal and the reverse signal by controlling the input calibration kit. When the control switch is turned on, output calculation results are calculated according to the forward signal and the reverse signal by controlling the output calibration kit. The scattering parameters are estimated according to the input calculation results and the output calculation results.
    Type: Application
    Filed: October 3, 2023
    Publication date: April 3, 2025
    Applicant: MEDIATEK INC.
    Inventors: Kuo-Hao Chen, Toru Matsuura
  • Publication number: 20250111120
    Abstract: A layout dependent statistical leakage analyzing method includes providing pre-silicon data, acquiring an i-th pre-silicon leakage value of an i-th cell group according to the pre-silicon data, acquiring an (i,j)-th abutment possibility of a j-th cell group abutted on the i-th cell group according to physical information extracted from the pre-silicon data, acquiring an i-th scaling factor for a Silicon-to-SPICE (S2S) of the i-th cell group according to the pre-silicon data, acquiring an (i,j)-th layout dependent effect (LDE) factor between the i-th cell group and the j-th cell group according to the pre-silicon data and post-silicon data, and generating an estimated silicon leakage of a block according to N pre-silicon leakage values, N2 abutment possibilities, N scaling factors, and N2 LDE factors.
    Type: Application
    Filed: September 26, 2024
    Publication date: April 3, 2025
    Applicant: MediaTek Singapore Pte. Ltd.
    Inventors: Jiayi Xu, Heng-Liang Huang, Chao Xue
  • Publication number: 20250112197
    Abstract: A semiconductor package includes a carrier substrate comprising a first surface and a second surface opposite to the first surface. A first electronic component and a second electronic component are mounted on the first surface of the carrier substrate in a side-by-side manner. The first electronic component is provided with first data (DQ) pads along a first side directly facing the second electronic component. The second electronic component is provided with second data (DQ) pads along a second side in proximity to the first electronic component. The first DQ pads are directly connects to the second DQ pads through first bond wires.
    Type: Application
    Filed: September 23, 2024
    Publication date: April 3, 2025
    Applicant: MEDIATEK INC.
    Inventors: Yu-Liang Hsiao, Ming-Hsien Chou