Abstract: A sensor device for measuring a physical parameter. The sensor device comprises at least three sensing elements. Each sensing element comprises a first node and a second node. The first nodes of all sensing elements are connected together, and the second nodes are accessible to a readout circuit for measuring differential signals between the second nodes. At least three of the sensing elements have a different sensitivity to the physical parameter.

Abstract: A method of manufacturing a sensor device (100) comprises forming (200) a substrate (102) comprising a sensor element followed by forming (202) a cap layer (104). The cap layer (104) is then bonded (204) to the substrate (102) before the substrate (102) is thinned (206). A via is formed (210) between the sensor element and a back side of the thinned substrate (102). An electrical connection is provided between the sensor element and the back side of the thinned substrate (102). A mask is formed (208) on the cap layer (104) to define an area about a predetermined window region (108) before forming (210) of the via. A portion of the cap layer (104) about the predetermined window region (108) of the cap layer (104) is removed (212) after formation (210) of the via.

Abstract: A method of digitally processing a plurality of pixels of an image captured using an array of sensing pixels of an optical sensor device. The method comprises identifying a measurement pixel of the plurality of pixels corresponding to a measurement point on a target to be measured. The method then comprises identifying a number of pixels of the plurality of pixels neighbouring the measurement pixel, the number of pixels having a number of intensity values, respectively. A curve is then fitted to the number of pixels and the number of respective intensity values. An estimated intensity value is then determined from the curve in respect of the measurement pixel, thereby simulating a predetermined field of view in respect of the measurement pixel narrower than an actual field of view of the measurement pixel.

Abstract: A lighting system includes a master node, one or more gateway nodes, a first communication bus connecting the one or more gateway nodes to the master node, a plurality of slave nodes such that each slave node is connected to a lighting source and is arranged for conveying data messages, and one or more second communication buses, each connecting one of the gateway nodes with one or more slave nodes of the plurality. The master node is arranged for conveying a unique network address to the one or more gateway nodes via the first communication bus, and the one or more gateway nodes are arranged for conveying a unique network address to the plurality of slave nodes via one of the second communication buses. At least one gateway node is arranged for storing a lighting plan for lighting one or more slave nodes connected to that gateway node.

Abstract: A trench capacitor includes a plurality of unit trench capacitors arranged in a 2D repetitive pattern in a substrate. The unit trench capacitors are separated by elongated trenches or elongated walls between the unit trench capacitors. The trench capacitor includes a plurality of stress compensation elements. Each unit trench capacitor has one or more closed trenches, with each trench further having a bottom electrode, a top electrode, and a dielectric between the bottom electrode and the top electrode. The unit trench capacitors are connected in parallel and the stress compensation elements are arranged between the unit trench capacitors such that they interrupt the elongated walls or trenches.

Abstract: A heat flux sensor device (100) comprising a semiconductor substrate layer (104) and a cap layer (102) that has a substrate-facing side (106) and a reception side (108). The cap layer (102) is bonded on the substrate-facing side (106) to the substrate layer (104), and the substrate layer (104) and the cap layer (102) together defining a first cavity (116). A first thermal sensor element (120, 122) is disposed within the first cavity (116) and configured to translate thermal energy proportional to a temperature difference between the cap layer (102) and the substrate layer (104) into first electrical energy. Signal processing circuitry is provided operably coupled to the first thermal sensor element (120, 122) and configured to use the first electrical energy generated by the first thermal sensor element (120, 122) to measure a heat flux flowing from the cap layer (102) to the substrate layer (104).

Abstract: An evaluation and control unit (100) for a broadband lambda probe (200) and a method for operating the same are disclosed.

Abstract: A motion or saturation determination apparatus (100) comprising: a light source configured to emit light and an optoelectronic device (102) configured to receive an electromagnetic signal and to translate the signal to a plurality of electrical output signals corresponding to a plurality of predetermined phase offset values in accordance with an indirect time of flight measurement technique. A signal processing circuit (110, 116, 126, 132, 136) of the apparatus (100) is configured to process the electrical output signals to calculate a plurality of measurement vectors derived from the plurality of electrical signals. The vectors are in respect of a plurality of frequencies and comprise a first measurement vector for a fundamental harmonic frequency and a second measurement vector for a non-fundamental frequency.

Abstract: In a method of optical detection, a carrier signal of a carrier signal period and a code sequence over an exposure time period are generated. Each code (406) of the sequence comprises a plurality of symbols (408, 410, 412, 414, 416) with a timing delay (418, 420, 422, 424) in between. The carrier signal is phase shifted in response to the code sequence (406) depending upon a value of a symbol (408, 410, 412, 414, 416). The modulated carrier signal is applied to a light source, thereby modulating the light which is emitted. An electrical sensor signal is generated in response to received reflected light. A plurality of predetermined phase offset values is applied to the modulated carrier signal, and a plurality of electrical output signals is generated and stored by applying said resulting signal to the electrical sensor signal in accordance with the indirect time of flight measurement technique over the exposure time period.

Abstract: In a heating appliance comprising a substrate for receiving an item of cookware, a method of measuring reflectivity comprises emitting a time-varying electromagnetic signal from a first side of the substrate, a portion of the time-varying electromagnetic signal propagating through the substrate. Electromagnetic radiation is then received at the first side of the substrate, the received electromagnetic radiation comprising a background ambient component received and a component reflected by the substrate. A gain factor is applied to translate the received electromagnetic radiation to a receive electrical signal. An offset signal component is then identified from the receive electrical signal, the offset signal component arising from the background ambient component of the received electromagnetic radiation.

Abstract: A unit trench capacitor in a substrate includes one or more trenches in the substrate, a dielectric layer, a first electrode and a second electrode. Walls of the one or more trenches are covered by the dielectric layer which separates the first electrode from the second electrode. Each trench follows a closed curve. The closed curve of each trench has one or more elongated parts in directions in which the substrate has a maximum elastic modulus, or the closed curve of each trench has a circular shape if the substrate has an isotropic elastic modulus.

Abstract: A method for autoconfiguration of a plurality of nodes in a linear network allows extracting the address and position of each node. The nodes are identified by a unique identifier. The method comprises choosing a node in a network and extracting its identifier, and for the first node to the last but one node, transmitting a current in the network from the chosen node, and reading the direction of the current flowing through at least the nodes not chosen in previous iteration cycles. The identifier is linked with the direction of the current for said not chosen nodes, obtaining the position of said not chosen nodes relative to the chosen node. These steps are repeated by choosing a different node not chosen before. Autoconfiguration is finished when the identifier of each node is extracted, and the physical position of each node is determined.

Abstract: A phase angle error calculation apparatus (100) comprising a light source (102) that emits light according to an indirect time of flight (iToF) measurement technique. A photonic mixer cell (104) generates and stores a plurality of electrical output signals corresponding to a plurality of predetermined phase offset values. A signal processing circuit processes the electrical output signals according to the iToF measurement technique in order to calculate a reference vector and a reference phase angle therefrom. The output signals correspond to measurement at a first level of precision. The circuit processes a subset of output signals according to the iToF measurement technique and calculates a measurement vector and a measurement phase angle therefrom. The subset of the output signals corresponds to measurement at a second level of precision lower than the first level of precision. The circuit calculates a phase angle correction value using the reference phase angle and the measurement phase angle.

Abstract: A safety related light system includes: one light source, a first control circuit, and a second control circuit. One of the first control circuit or the second control circuit is selectively enabled to operate in a drive mode to operate the one light source.

Abstract: A thermal sensor array device (100) comprises a substrate having a cavity (291) formed therein. An infrared absorbing membrane (200) is suspended over the cavity from a first and second beams (202, 206), the first beam (202) being thermally coupled at one end thereof to the substrate (Cj1) at a first cold junction and the second beam (206) being thermally coupled at one end thereof to a second substrate cold junction (Cj2). Thermocouples are disposed over the first and second beams (202, 206) and on the membrane (200). The thermocouples are arranged on the first and second beams (202, 206) and the membrane (200) as first and second thermopiles (300, 320). The first and second thermopiles (300, 320) are arranged on the membrane (200) to measure a sum of first temperature differentials between the first substrate cold junction (Cj1) and a hot junction (Hj) on the membrane (200), and second temperature differentials between the second substrate cold junction (Cj2) and the hot junction (Hj) on the membrane.

Abstract: A system for characterizing a transistor circuit which has a local minimum in its transfer characteristic by finding its local minimum. The system comprises: a bias voltage generator for generating a toggling signal; a multiplier configured for multiplying an electrical signal which is a function of the drain source current of the transistor circuit, with a waveform alternating between two predefined values synchronously with the toggling signal; a first integrator configured for integrating the electrical signal from the multiplier, and wherein if more integrators are present, linear combinations of output signals of the integrators are provided to the further integrators; a summator configured for summing the toggling signal and an integration signal and configured for outputting the sum to the gate of the transistor circuit.

Abstract: An integrated device comprises an electrically conductive substrate having an upper surface comprising a recess and a lower surface for contacting the device, a multi-layer stack provided on the upper surface of the substrate and lining the recess, and an electrically conductive layer for contacting the device provided on the multi-layer stack. The multi-layer stack comprises a first, a second, a third and a fourth dielectric layer. Immediately adjacent dielectric layers have different bandgaps to trap charge carriers at respective interfaces between the dielectric layers during operation of the device.

Abstract: An optical range calculation apparatus (100) comprises a light source configured to emit light in accordance with an indirect time of flight measurement technique. A photonic mixer cell (102) is configured to generate and store a plurality of electrical output signals respectively corresponding to a plurality of predetermined phase offset values applied (112) in accordance with the indirect time of flight measurement technique. A signal processing circuit (110, 124) is configured to process the plurality of electrical output signals in accordance with the indirect time of flight measurement technique in order to calculate a measurement vector and a measured phase angle from the measurement vector.

Abstract: A pressure sensing element (100) for a pressure sensor device comprises a substrate portion (102) comprising a cavity (104) formed therein, a mouth (184) of the cavity (104) having an opening periphery (186). A membrane layer (106) overlies the opening periphery (186) of the cavity (104), and a strain gauge element (166, 168, 170, 172) is disposed on the membrane layer (106) over the cavity (104). The cavity (104) comprises a primary cavity (118) and a first annex (120) integrally formed with the primary cavity (118).

Abstract: A sensor interface circuit includes at least two sensor inputs and at least two front-end circuits to obtain sensor signal acquisitions from the at least two sensor inputs; a test circuit configured to test correct functionality of at least part of one of the front end circuits by applying a test input to the front end circuit under test, by reading a test output of the front end circuit, and by comparing the test output with an expected result thus obtaining at least one test result. The test input is applied intermittently between sensor signal acquisitions; a processing device is configured to compare the sensor signal acquisitions from the different sensor inputs and combine the comparison with the at least one test result to evaluate correct functionality of the sensor interface circuit.