Patents Assigned to MEMC
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Publication number: 20140273409Abstract: In one aspect, a system for depositing a layer on a substrate is provided. The system includes a processing chamber, a gas injecting port, a gas distribution plate, and a plug. The gas injecting port is disposed upstream from the processing chamber. The gas distribution plate is disposed between the gas injecting port and the processing chamber, and includes an elongate planar body and an array of holes therein. The plug is sized to be received within one of the holes, and includes an orifice therethrough for permitting the passage of gas. The plug is capable of being removably secured to the gas distribution plate within one of the holes.Type: ApplicationFiled: March 14, 2013Publication date: September 18, 2014Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: John Allen Pitney, Manabu Hamano
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Publication number: 20140273748Abstract: A method of polishing a wafer is disclosed that includes determining a removal profile. The wafer is measured to determine a starting wafer profile and then the wafer is polished. The wafer is again measured after being polished to determine a polished wafer profile. The starting wafer profile and the polished wafer profile are compared to each other to determine the removal profile by computing the amount and shape of material removed from the first wafer during polishing.Type: ApplicationFiled: March 13, 2013Publication date: September 18, 2014Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Sumeet S. Bhagavat, Khiam How Low, Ichiron Yoshimura, John Allen Pitney
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Publication number: 20140224175Abstract: A gas distribution manifold for a chemical vapor deposition reactor includes a first gas distribution zone including a central gas port located in a central portion of the manifold. The manifold also includes a second gas distribution zone including at least two intermediate ports adjacent the central gas port. The manifold further includes a third gas distribution zone including at least two outer ports, each one of the outer ports spaced from the central gas port by one of the intermediate ports. The gas distribution manifold includes a fourth gas distribution zone comprising at least two edge ports, each edge port being spaced from the central outlet port by at least one of the intermediate and outer ports.Type: ApplicationFiled: February 14, 2013Publication date: August 14, 2014Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventor: Arash Abedijaberi
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Patent number: 8784561Abstract: Methods are disclosed for inhibiting heat transfer through lateral sidewalls of a support member positioned beneath a crucible in a directional solidification furnace. The methods include the use of insulation positioned adjacent the lateral sidewalls of the support member. The insulation inhibits heat transfer through the lateral sidewalls of the support member to ensure the one-dimensional transfer of heat from the melt through the support member.Type: GrantFiled: June 25, 2012Date of Patent: July 22, 2014Assignee: MEMC Singapore Pte. Ltd. (UEN200614794D)Inventors: Rituraj Nandan, Benjamin Michael Meyer, Lee William Ferry
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Publication number: 20140182115Abstract: A method of aligning an ingot of semiconductor or solar-grade material with a mounting block includes supporting the ingot using adjustable supports, aligning a predetermined centerline of the ingot with a reference line using a laser, and attaching the mounting block to the ingot such that the predetermined centerline remains aligned with the reference line.Type: ApplicationFiled: December 31, 2012Publication date: July 3, 2014Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Dusan Krulj, John Michael Pogany
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Publication number: 20140182776Abstract: A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the alignment layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.Type: ApplicationFiled: December 31, 2012Publication date: July 3, 2014Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)Inventors: Jihong John Chen, Susan S. Dwyer, Shawn Hayes, Tom Doane, Dale A. Witte, Linda K. Swiney, Travis Hambach
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Publication number: 20140183806Abstract: An alignment system for aligning an ingot of semiconductor or solar-grade material is provided. The alignment system includes a mounting block for attachment to the ingot, an optical device for aligning a predetermined centerline of the ingot with a reference line, and adjustable supports configured for supporting the ingot on at least four support points and configured to adjust the position of the ingot. The mounting block is movable between a horizontal position and a vertical position.Type: ApplicationFiled: December 31, 2012Publication date: July 3, 2014Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Dusan Krulj, John Michael Pogany
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Publication number: 20140186486Abstract: An apparatus for producing rectangular seeds for use in semiconductor or solar material manufacturing includes a template having a top surface and parallel slots, and an adhesive layer connected to the top surface of the template. The adhesive layer includes alignment lines aligned with the parallel slots. The apparatus also includes quarter sections made of a semiconductor or solar material and connected to the alignment layer. An interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines. A wire web is adapted to slice through the interface of each quarter section to separate the rectangular seed portions from the curved wing portions to produce rectangular seeds.Type: ApplicationFiled: December 31, 2012Publication date: July 3, 2014Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)Inventors: Jihong John Chen, Susan S. Dwyer, Shawn Hayes, Tom Doane, Dale A. Witte, Linda K. Swiney, Travis Hambach
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Publication number: 20140174129Abstract: A support fixture for use in a directional solidification system for the production of multi-crystalline ingots having a housing with a passage that extends into an inner assembly having a crucible includes a collar, an alignment bracket, and an arm. The collar has a mounting structure for attaching the collar to the housing. A passage extends through the collar and defines a longitudinal axis. The alignment bracket is in spaced relation to the collar. The arm extends from the collar to the alignment bracket to support the alignment bracket and prevent movement of the alignment bracket with respect to the collar. The arm is shaped to allow an operator access to an area adjacent to the longitudinal axis.Type: ApplicationFiled: December 21, 2012Publication date: June 26, 2014Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)Inventors: John David Hilker, John Gibbons
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Publication number: 20140144846Abstract: A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation.Type: ApplicationFiled: November 26, 2012Publication date: May 29, 2014Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)Inventors: Alexis Grabbe, Sasha Joseph Kweskin, Larry Wayne Shive, Henry Frank Erk
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Publication number: 20140145309Abstract: A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation.Type: ApplicationFiled: November 26, 2012Publication date: May 29, 2014Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)Inventor: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
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Patent number: 8735261Abstract: A method and a system are described herein for applying etchant to edges of a plurality of wafers. The system includes a sump configured for holding etchant, a roller having an outer surface in fluid communication with the sump and configured to have etchant thereon, a wafer cassette configured to retain wafers positioned therein so that edges of the wafers are in contact with the roller. The cassette permits axial rotation of the wafers about an axis. A method of applying etchant to the edge of the wafer includes placing the wafer edge in contact with the roller and rotating the roller about a longitudinal axis of the roller. At least a portion of the roller contact an etchant contained in a sump during rotation so that etchant is applied to the wafer edge.Type: GrantFiled: November 16, 2009Date of Patent: May 27, 2014Assignee: MEMC Electronic Materials, Inc.Inventor: Robert W. Standley
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Publication number: 20140137395Abstract: A method of producing rectangular seed bricks for use in semiconductor or solar manufacturing is disclosed. The method includes connecting an alignment layer to a top surface of a template, drawing alignment lines on the alignment layer to demarcate a plurality of nodes, connecting cylindrical rods to the alignment layer such that a center of each rod is aligned with a corresponding node, and slicing through the rods and the alignment layer with a wire web to produce rectangular seed bricks.Type: ApplicationFiled: November 19, 2012Publication date: May 22, 2014Applicant: MEMC Singapore, Pte. Ltd (UEN200614797D)Inventors: Dale A. Witte, Jihong John Chen, Travis L. Hambach, Linda K. Swiney
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Publication number: 20140137794Abstract: A method of preparing a directional solidification system (DSS) furnace for use in semiconductor or solar manufacturing includes slicing a plurality of cylindrical rods to produce a plurality of rectangular seed bricks, a plurality of corner portions, and a plurality of quarter sections, and cropping the plurality of rectangular seed bricks into a plurality of rectangular seeds.Type: ApplicationFiled: November 19, 2012Publication date: May 22, 2014Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)Inventors: Dale A. Witte, Jihong John Chen, Travis Hambach, Linda Swiney
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Patent number: 8728574Abstract: Gas distribution units of fluidized bed reactors are configured to direct thermally decomposable compounds to the center portion of the reactor and away from the reactor wall to prevent deposition of material on the reactor wall and process for producing polycrystalline silicon product in a reactor that reduce the amount of silicon which deposits on the reactor wall.Type: GrantFiled: April 25, 2012Date of Patent: May 20, 2014Assignee: MEMC Electronic Materials, Inc.Inventors: Milind S. Kulkarni, Puneet Gupta, Balaji Devulapalli, Jameel Ibrahim, Vithal Revankar, Kwasi Foli
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Patent number: 8715597Abstract: Production of polycrystalline silicon in substantially closed-loop processes and systems is disclosed. The processes and systems generally involve disproportionation of trichlorosilane to produce silane or dichlorosilane and thermal decomposition of silane or dichlorosilane to produce polycrystalline silicon.Type: GrantFiled: December 16, 2011Date of Patent: May 6, 2014Assignee: MEMC Electronic Materials, Inc.Inventors: Puneet Gupta, Yue Huang, Satish Bhusarapu
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Patent number: 8712575Abstract: Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the grinding wheels. Pattern detection software is used to predict a grinding stage based on the measured electrical current. The hydrostatic pressure is changed by flow control valves at each stage to change the clamping pressure applied to the wafer and to thereby improve nanotopology in the processed wafer.Type: GrantFiled: March 16, 2011Date of Patent: April 29, 2014Assignee: MEMC Electronic Materials, Inc.Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura
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Publication number: 20140112831Abstract: A method and apparatus for determining the fluidization quality of a fluidized bed reactor is disclosed. The method includes measuring pressure within the fluidized bed reactor to obtain a pressure signal. The pressure signal is then transformed using wavelet decomposition into higher-frequency details and lower-frequency approximations. The dominance of the various features is then calculated based on the energy of each feature in relation to the normalized wavelet energies. The fluidization quality of the fluidized bed reactor is then determined from a comparison over time of the calculated energies.Type: ApplicationFiled: October 19, 2012Publication date: April 24, 2014Applicant: MEMC ELECTRONIC MATERIALS, INC.Inventors: Jia Wei Chew, Satish Bhusarapu, Keith E. Weatherford
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Patent number: 8696811Abstract: A feed assembly and method of use thereof of the present invention is used for the addition of a high pressure dopant such as arsenic into a silicon melt for CZ growth of semiconductor silicon crystals. The feed assembly includes a vessel-and-valve assembly for holding dopant, and a feed tube assembly, attached to the vessel-and-valve assembly for delivering dopant to a silicon melt. An actuator is connected to the feed tube assembly and a receiving tube for advancing and retracting the feed tube assembly to and from the surface of the silicon melt. A brake assembly is attached to the actuator and the receiving tube for restricting movement of the feed tube assembly and locking the feed tube assembly at a selected position.Type: GrantFiled: November 25, 2009Date of Patent: April 15, 2014Assignee: MEMC Electronic Materials, Inc.Inventors: Massoud Javidi, Steve Garner
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Patent number: 8691055Abstract: The present disclosure relates to processes and systems for purifying technical grade trichlorosilane and/or technical grade silicon tetrachloride into electronic grade trichlorosilane and/or electronic grade silicon tetrachloride.Type: GrantFiled: September 7, 2012Date of Patent: April 8, 2014Assignee: MEMC Electronic Materials SpAInventor: Gianfranco Ghetti