Patents Assigned to MEMC
  • Publication number: 20140273409
    Abstract: In one aspect, a system for depositing a layer on a substrate is provided. The system includes a processing chamber, a gas injecting port, a gas distribution plate, and a plug. The gas injecting port is disposed upstream from the processing chamber. The gas distribution plate is disposed between the gas injecting port and the processing chamber, and includes an elongate planar body and an array of holes therein. The plug is sized to be received within one of the holes, and includes an orifice therethrough for permitting the passage of gas. The plug is capable of being removably secured to the gas distribution plate within one of the holes.
    Type: Application
    Filed: March 14, 2013
    Publication date: September 18, 2014
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: John Allen Pitney, Manabu Hamano
  • Publication number: 20140273748
    Abstract: A method of polishing a wafer is disclosed that includes determining a removal profile. The wafer is measured to determine a starting wafer profile and then the wafer is polished. The wafer is again measured after being polished to determine a polished wafer profile. The starting wafer profile and the polished wafer profile are compared to each other to determine the removal profile by computing the amount and shape of material removed from the first wafer during polishing.
    Type: Application
    Filed: March 13, 2013
    Publication date: September 18, 2014
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Sumeet S. Bhagavat, Khiam How Low, Ichiron Yoshimura, John Allen Pitney
  • Publication number: 20140224175
    Abstract: A gas distribution manifold for a chemical vapor deposition reactor includes a first gas distribution zone including a central gas port located in a central portion of the manifold. The manifold also includes a second gas distribution zone including at least two intermediate ports adjacent the central gas port. The manifold further includes a third gas distribution zone including at least two outer ports, each one of the outer ports spaced from the central gas port by one of the intermediate ports. The gas distribution manifold includes a fourth gas distribution zone comprising at least two edge ports, each edge port being spaced from the central outlet port by at least one of the intermediate and outer ports.
    Type: Application
    Filed: February 14, 2013
    Publication date: August 14, 2014
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventor: Arash Abedijaberi
  • Patent number: 8784561
    Abstract: Methods are disclosed for inhibiting heat transfer through lateral sidewalls of a support member positioned beneath a crucible in a directional solidification furnace. The methods include the use of insulation positioned adjacent the lateral sidewalls of the support member. The insulation inhibits heat transfer through the lateral sidewalls of the support member to ensure the one-dimensional transfer of heat from the melt through the support member.
    Type: Grant
    Filed: June 25, 2012
    Date of Patent: July 22, 2014
    Assignee: MEMC Singapore Pte. Ltd. (UEN200614794D)
    Inventors: Rituraj Nandan, Benjamin Michael Meyer, Lee William Ferry
  • Publication number: 20140182115
    Abstract: A method of aligning an ingot of semiconductor or solar-grade material with a mounting block includes supporting the ingot using adjustable supports, aligning a predetermined centerline of the ingot with a reference line using a laser, and attaching the mounting block to the ingot such that the predetermined centerline remains aligned with the reference line.
    Type: Application
    Filed: December 31, 2012
    Publication date: July 3, 2014
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Dusan Krulj, John Michael Pogany
  • Publication number: 20140182776
    Abstract: A method of producing rectangular seeds for use in semiconductor or solar material manufacturing includes connecting an adhesive layer to a top surface of a template, the template including a plurality of parallel slots, and drawing alignment lines on the adhesive layer, the alignment lines aligned with at least some of the parallel slots. The method also includes connecting quarter sections to the alignment layer such that an interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines drawn on the adhesive layer, and slicing each of the quarter sections to separate the rectangular seed portions from the curved wing portions.
    Type: Application
    Filed: December 31, 2012
    Publication date: July 3, 2014
    Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
    Inventors: Jihong John Chen, Susan S. Dwyer, Shawn Hayes, Tom Doane, Dale A. Witte, Linda K. Swiney, Travis Hambach
  • Publication number: 20140183806
    Abstract: An alignment system for aligning an ingot of semiconductor or solar-grade material is provided. The alignment system includes a mounting block for attachment to the ingot, an optical device for aligning a predetermined centerline of the ingot with a reference line, and adjustable supports configured for supporting the ingot on at least four support points and configured to adjust the position of the ingot. The mounting block is movable between a horizontal position and a vertical position.
    Type: Application
    Filed: December 31, 2012
    Publication date: July 3, 2014
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Dusan Krulj, John Michael Pogany
  • Publication number: 20140186486
    Abstract: An apparatus for producing rectangular seeds for use in semiconductor or solar material manufacturing includes a template having a top surface and parallel slots, and an adhesive layer connected to the top surface of the template. The adhesive layer includes alignment lines aligned with the parallel slots. The apparatus also includes quarter sections made of a semiconductor or solar material and connected to the alignment layer. An interface between a rectangular seed portion and a curved wing portion of each quarter section is aligned with at least one of the alignment lines. A wire web is adapted to slice through the interface of each quarter section to separate the rectangular seed portions from the curved wing portions to produce rectangular seeds.
    Type: Application
    Filed: December 31, 2012
    Publication date: July 3, 2014
    Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
    Inventors: Jihong John Chen, Susan S. Dwyer, Shawn Hayes, Tom Doane, Dale A. Witte, Linda K. Swiney, Travis Hambach
  • Publication number: 20140174129
    Abstract: A support fixture for use in a directional solidification system for the production of multi-crystalline ingots having a housing with a passage that extends into an inner assembly having a crucible includes a collar, an alignment bracket, and an arm. The collar has a mounting structure for attaching the collar to the housing. A passage extends through the collar and defines a longitudinal axis. The alignment bracket is in spaced relation to the collar. The arm extends from the collar to the alignment bracket to support the alignment bracket and prevent movement of the alignment bracket with respect to the collar. The arm is shaped to allow an operator access to an area adjacent to the longitudinal axis.
    Type: Application
    Filed: December 21, 2012
    Publication date: June 26, 2014
    Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
    Inventors: John David Hilker, John Gibbons
  • Publication number: 20140144846
    Abstract: A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation.
    Type: Application
    Filed: November 26, 2012
    Publication date: May 29, 2014
    Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
    Inventors: Alexis Grabbe, Sasha Joseph Kweskin, Larry Wayne Shive, Henry Frank Erk
  • Publication number: 20140145309
    Abstract: A process is provided for treating coolant fluid used in wire-saw cutting of semiconductor wafers and which contains silicon-containing impurities. The process comprises changing the properties of the used coolant fluid so that the silicon-containing impurities may be filtered and separated from the coolant fluid to thereby yield a coolant fluid filtrate suitable for use in a wire-saw cutting operation.
    Type: Application
    Filed: November 26, 2012
    Publication date: May 29, 2014
    Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
    Inventor: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
  • Patent number: 8735261
    Abstract: A method and a system are described herein for applying etchant to edges of a plurality of wafers. The system includes a sump configured for holding etchant, a roller having an outer surface in fluid communication with the sump and configured to have etchant thereon, a wafer cassette configured to retain wafers positioned therein so that edges of the wafers are in contact with the roller. The cassette permits axial rotation of the wafers about an axis. A method of applying etchant to the edge of the wafer includes placing the wafer edge in contact with the roller and rotating the roller about a longitudinal axis of the roller. At least a portion of the roller contact an etchant contained in a sump during rotation so that etchant is applied to the wafer edge.
    Type: Grant
    Filed: November 16, 2009
    Date of Patent: May 27, 2014
    Assignee: MEMC Electronic Materials, Inc.
    Inventor: Robert W. Standley
  • Publication number: 20140137395
    Abstract: A method of producing rectangular seed bricks for use in semiconductor or solar manufacturing is disclosed. The method includes connecting an alignment layer to a top surface of a template, drawing alignment lines on the alignment layer to demarcate a plurality of nodes, connecting cylindrical rods to the alignment layer such that a center of each rod is aligned with a corresponding node, and slicing through the rods and the alignment layer with a wire web to produce rectangular seed bricks.
    Type: Application
    Filed: November 19, 2012
    Publication date: May 22, 2014
    Applicant: MEMC Singapore, Pte. Ltd (UEN200614797D)
    Inventors: Dale A. Witte, Jihong John Chen, Travis L. Hambach, Linda K. Swiney
  • Publication number: 20140137794
    Abstract: A method of preparing a directional solidification system (DSS) furnace for use in semiconductor or solar manufacturing includes slicing a plurality of cylindrical rods to produce a plurality of rectangular seed bricks, a plurality of corner portions, and a plurality of quarter sections, and cropping the plurality of rectangular seed bricks into a plurality of rectangular seeds.
    Type: Application
    Filed: November 19, 2012
    Publication date: May 22, 2014
    Applicant: MEMC SINGAPORE, PTE. LTD (UEN200614797D)
    Inventors: Dale A. Witte, Jihong John Chen, Travis Hambach, Linda Swiney
  • Patent number: 8728574
    Abstract: Gas distribution units of fluidized bed reactors are configured to direct thermally decomposable compounds to the center portion of the reactor and away from the reactor wall to prevent deposition of material on the reactor wall and process for producing polycrystalline silicon product in a reactor that reduce the amount of silicon which deposits on the reactor wall.
    Type: Grant
    Filed: April 25, 2012
    Date of Patent: May 20, 2014
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Milind S. Kulkarni, Puneet Gupta, Balaji Devulapalli, Jameel Ibrahim, Vithal Revankar, Kwasi Foli
  • Patent number: 8715597
    Abstract: Production of polycrystalline silicon in substantially closed-loop processes and systems is disclosed. The processes and systems generally involve disproportionation of trichlorosilane to produce silane or dichlorosilane and thermal decomposition of silane or dichlorosilane to produce polycrystalline silicon.
    Type: Grant
    Filed: December 16, 2011
    Date of Patent: May 6, 2014
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Puneet Gupta, Yue Huang, Satish Bhusarapu
  • Patent number: 8712575
    Abstract: Systems and methods are disclosed for modulating the hydrostatic pressure in a double side wafer grinder having a pair of grinding wheels. The systems and methods use a processor to measure the amount of electrical current drawn by the grinding wheels. Pattern detection software is used to predict a grinding stage based on the measured electrical current. The hydrostatic pressure is changed by flow control valves at each stage to change the clamping pressure applied to the wafer and to thereby improve nanotopology in the processed wafer.
    Type: Grant
    Filed: March 16, 2011
    Date of Patent: April 29, 2014
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Sumeet S. Bhagavat, Roland R. Vandamme, Tomomi Komura
  • Publication number: 20140112831
    Abstract: A method and apparatus for determining the fluidization quality of a fluidized bed reactor is disclosed. The method includes measuring pressure within the fluidized bed reactor to obtain a pressure signal. The pressure signal is then transformed using wavelet decomposition into higher-frequency details and lower-frequency approximations. The dominance of the various features is then calculated based on the energy of each feature in relation to the normalized wavelet energies. The fluidization quality of the fluidized bed reactor is then determined from a comparison over time of the calculated energies.
    Type: Application
    Filed: October 19, 2012
    Publication date: April 24, 2014
    Applicant: MEMC ELECTRONIC MATERIALS, INC.
    Inventors: Jia Wei Chew, Satish Bhusarapu, Keith E. Weatherford
  • Patent number: 8696811
    Abstract: A feed assembly and method of use thereof of the present invention is used for the addition of a high pressure dopant such as arsenic into a silicon melt for CZ growth of semiconductor silicon crystals. The feed assembly includes a vessel-and-valve assembly for holding dopant, and a feed tube assembly, attached to the vessel-and-valve assembly for delivering dopant to a silicon melt. An actuator is connected to the feed tube assembly and a receiving tube for advancing and retracting the feed tube assembly to and from the surface of the silicon melt. A brake assembly is attached to the actuator and the receiving tube for restricting movement of the feed tube assembly and locking the feed tube assembly at a selected position.
    Type: Grant
    Filed: November 25, 2009
    Date of Patent: April 15, 2014
    Assignee: MEMC Electronic Materials, Inc.
    Inventors: Massoud Javidi, Steve Garner
  • Patent number: 8691055
    Abstract: The present disclosure relates to processes and systems for purifying technical grade trichlorosilane and/or technical grade silicon tetrachloride into electronic grade trichlorosilane and/or electronic grade silicon tetrachloride.
    Type: Grant
    Filed: September 7, 2012
    Date of Patent: April 8, 2014
    Assignee: MEMC Electronic Materials SpA
    Inventor: Gianfranco Ghetti