Abstract: A monolithic integrated circuit (1) incorporating an inductive component (2) and comprising:
a semiconductor substrate layer (2);
a passivation layer (4) covering the substrate layer (2);
metal contact pads (5) connected to the substrate (2) and passing through the passivation layer (4) in order to be flush with the upper face (6) of the passivation layer (4);
which circuit also includes a spiral winding (20) which forms an inductor and lies in a plane parallel to the upper face (6) of the passivation layer (4), said winding (20) consisting of copper turns (21-23, 27, 28) having a thickness of greater than 10 microns, the winding ends forming extensions (12) which extend below the plane of the winding (20) and are connected to the contact pads (5).
Type:
Grant
Filed:
March 15, 2000
Date of Patent:
October 1, 2002
Assignee:
Memscap S.A.
Inventors:
Laurent Basteres, Ahmed Mhani, François Valentin, Jean-Michel Karam
Abstract: An inductor assembly for use in RF and microwave circuits wherein the inductor is formed of a first spiral wound metal strip that is mounted on a flat surface of a quartz substrate. The metal strip is formed of copper and has a height above the flat surface that is about 30 microns.
Type:
Grant
Filed:
February 24, 2000
Date of Patent:
September 24, 2002
Assignee:
Memscap and Planhead-Silmag PHS
Inventors:
Laurent Basteres, Ahmed Mhani, François Valentin, Jean-Michel Karam
Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in:
Type:
Application
Filed:
May 20, 2002
Publication date:
September 19, 2002
Applicant:
Memscap
Inventors:
Catherine Charrier, Eric Bouchon, Alain Campo, Guy Imbert, Francois Valentin, Laurent Basteres
Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in:
depositing a first metal layer on an oxide layer (2), said first metal layer being intended to form the fixed plate;
depositing a metal ribbon (10, 11) on at least part of the periphery and on each side of the fixed plate (1), said ribbon being intended to serve as a spacer between the fixed plate (1) and the deformable membrane (20);
depositing a sacrificial resin layer (15) over at least the area of said fixed plate (1);
generating, by lithography, a plurality of wells in the surface of said sacrificial resin layer;
depositing, by electrolysis, inside the wells formed in the sacrificial resin (15), at least one metal region intended to form the deformable membrane (20), this metal region extending between sections of the metal ribbon (10, 11) which are located o
Type:
Grant
Filed:
May 15, 2001
Date of Patent:
September 3, 2002
Assignee:
Memscap and Planheas-Silmag PHS
Inventors:
Catherine Charrier, Eric Bouchon, Alain Campo, Guy Imbert, François Valentin, Laurent Basteres
Abstract: A microcomponent including a capacitive component, wherein the capacitive component consists of at least two elementary capacitors (C1, C2, C3, C4) connected in series, each elementary capacitor comprising two plates, namely:
Abstract: Apparatus and Method relating to a microcomponent such as an inductor in which copper segments are mounted in parallel channels of a non-conductive substrate so that the top surfaces of the segments are coplanar with the top surface of the substrate. A core material is placed over the top surface of the substrate and conductive arches are arranged to connect one end of each segment with the opposite end of an adjacent segment to form a coil that encircles the core.
Type:
Grant
Filed:
April 26, 2000
Date of Patent:
August 6, 2002
Assignee:
Memscap & Planhead-Silmag PHS
Inventors:
Jean-Michel Karam, Laurent Basteres, Ahmed Mhani, Catherine Charrier, Eric Bouchon, Guy Imbert, Patrick Martin, François Valentin
Abstract: Inductive microcomponent (1), such as a microinductor or microtransformer, comprising a metal winding (2) having the shape of a solenoid and a magnetic core (4) made of a ferromagnetic material positioned at the center of the solenoid (2), wherein the core (4) consists of several sections (13-16) separated by cutouts (17-19) oriented parallel to the main axis (20) of the solenoid (4).
Abstract: Inductive microcomponent (1), such as a microinductor or microtransformer, comprising a metal winding (2) having the shape of a solenoid, and a magnetic core (4) including a strip made of a ferromagnetic material, positioned at the center of the solenoid (2), and characterized in that the core comprises at least one additional strip made of a ferromagnetic material (13), separated from the other strip (12) by a spacer layer (14) made of a non-magnetic material, the thickness of which is such that the strips (12, 13) located on either side of the spacer layer (14) are antiferromagnetically coupled.
Abstract: Process for fabricating electronic components, of the variable capacitor or microswitch type, comprising a fixed plate (1) and a deformable membrane (20) which are located opposite each other, which comprises the following steps, consisting in:
Type:
Application
Filed:
May 15, 2001
Publication date:
November 15, 2001
Applicant:
Memscap
Inventors:
Catherine Charrier, Eric Bouchon, Alain Campo, Guy Imbert, Francois Valentin, Laurent Basteres