Abstract: Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.

Abstract: A method and apparatus for producing a sandwich structure that is lightweight and many times stiffer than regular sheet metal, and which is easily formable into curved structures as well as structures having compound curves. In one embodiment, a formed core includes a plurality of cells comprising alternating front and rear projections extending outwardly in front of and behind a median plane, with each projection having a bonding surface area or land configured to be bonded with corresponding external sheets on both sides of the formed core. A plurality of micro-abrasions or indentations are formed on the bonding lands, allowing stronger bonding joints to be formed between the core and the external sheets by facilitating improved capillary action by the core during the bonding process.

Abstract: The invention provides a water-soluble polymer having formula I: where R1 and R2 are independently —H, -alkylCO2A, —(CH2)n-aryl-(CH2)nCO2A, —(CH2)n-heterocycle-(CH2)nCO2A, or —(CH2)n-cycloalkyl-(CH2)nCO2A, where n is an integer from 0 to 200, and A is an alkali metal cation, with the proviso that only one of R1 and R2 is —H. Methods of preparing the water-soluble polymers and thin films prepared therefrom are also described.

Abstract: A leaning post seat assembly includes a D-ring having a D-shape and a cross tube disposed in the D-ring for defining a rectangular boundary having long sides and short sides. Two side frames are removably attached at opposite ends of the D-ring and a crossbar is removably attached between the side frames. A seat cushion is pivotably attached to the crossbar and a soft-sided storage compartment is removably attached to the rectangular boundary.

Abstract: A method is disclosed for rounding and/or flattening an annular part that is out of round and/or not flat due to non-uniform internal stresses. The part is first checked for out of round and/or out of flat conditions. Out of round parts are then rounded by introducing compressive stresses into selected surface sections of the part whereby the introduced compressive stresses cause deformation of the annular part thereby rounding the annular part. Alternatively, out of round parts are rounded by relieving compressive stresses in selected surface sections of the part whereby the relieving of compressive stresses causes deformation of the annular part thereby rounding the annular part. Out of flat parts are flattened by introducing compressive stresses into selected surface sections of the part whereby the introduced compressive stresses cause deformation of the annular part thereby flattening the annular part.

Abstract: A method for preparing particles to retain a charge such that the particles are rendered electrostatically or electrokinetically mobile. The method involves coating the particles with a coating medium which facilitates attachment of a charge director material, and contacting the particles with the coating medium thereon with a charge director medium to impart a positive or negative charge thereto and thereby render the particles electrostatically or electrokinetically mobile. Electrostatically and electrokinetically mobile particles for use in an electrostatic or electrokinetic deposition process. The particles include a coating medium and a charge director on particle bodies.

Abstract: Metallic particles for electrokinetic or electrostatic deposition, and a method for making such particles, comprising metallic particle bodies, an organic acid film on the particle bodies, and a charge director adhered to the organic acid film.

Abstract: An improved process for preparing regioregular substituted polythiophenes is described where a substituted thiophene having at least two leaving groups is treated with an organomagnesium halide followed by zinc chloride or bromide and the resulting reaction mixture in solution is polymerized with a Ni(II) catalyst.

Abstract: An alloy suitable for use in a ball grid array or chip scale package, the alloy comprising from 0.05-1.5 wt. % copper; from 2.5-5 wt. % silver; one or both of from 0.005-0.3 wt % nickel and/or from 0.003-0.3 wt % chromium; from 0-0.1 wt. % phosphorus; from 0-0.1 wt. % germanium; from 0-0.1 wt. % gallium; from 0-0.3 wt. % of one or more rare earth elements; from 0-0.3 wt. % indium; from 0-0.3 wt. % magnesium; from 0-0.3 wt. % calcium; from 0-0.3 wt. % silicon; from 0-0.3 wt. % aluminium; from 0-0.3 wt. % zinc; from 0-2 wt. % bismuth; from 0-1 wt. % antimony; from 0-0.2 wt % manganese; from 0-0.3 wt % cobalt; from 0-0.3 wt % iron; and from 0-0.1 wt % zirconium; and the balance tin, together with unavoidable impurities.

Abstract: An alloy suitable for use in a ball grid array or chip scale package comprising from 0.05-1.5 wt. % copper, from 0.1-2 wt. % silver, from 0.005-0.3 wt % nickel, from 0.003-0.3 wt % chromium, from 0-0.1 wt. % phosphorus, from 0-0.1 wt. % germanium, from 0-0.1 wt. % gallium, from 0-0.3 wt. % of one or more rare earth elements, from 0-0.3 wt. % indium, from 0-0.3 wt. % magnesium, from 0-0.3 wt. % calcium, from 0-0.3 wt. % silicon, from 0-0.3 wt. % aluminium, from 0-0.3 wt. % zinc, from 0-2 wt. % bismuth, from 0-1 wt. % antimony, from 0-0.2 wt % manganese, from 0-0.3 wt % cobalt, from 0-0.3 wt % iron, and from 0-0.1 wt % zirconium, and the balance tin, together with unavoidable impurities.

Abstract: In the manufacture of products such as printed wiring boards or chip scale packaging and ball grid arrays, incorporating one or more elements selected from among Ni, Co, Cr, Mn, Zr, Fe and Si into a lead-free soldering process to reduce joint embrittlement. In varied embodiments this is accomplished by spraying onto a solder sphere or preform surface, by spraying onto a device substrate surface, or by incorporating into the device substrate alloy.

Abstract: A tool for use in a powder metal process is disclosed. The tool includes an upper tool and a lower tool. The upper and lower tools may include multiple members for each tool. The lower tool having a predetermined cross sectional profile that continuously expands outward from or near a center point of the lower tool. The lower tool is also secured within a press for the powder metal process via a fastening mechanism.

Abstract: A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.

Abstract: A flip chip having solder bumps and an underfill that is thermoplastic and fluxing, as well as methods for making such a device. The resulting device is well suited for a simple one-step application to a printed circuit board, thereby simplifying flip chip manufacturing processes.

Abstract: A powder metal part infiltration process uses a stamped metallic sheet as a source of metal for infiltration to achieve a high strength powder metal part. A powder metal is compacted, and an infiltrant blank is formed from a wrought metal sheet. The infiltrant blank is placed on top of the compact, and the compact is sintered at a temperature sufficient to form a sintered compact with a matrix having pores and to melt the wrought metal such that the melted wrought metal infiltrates the pores of the matrix. The infiltrant blank may be formed with a locating element for engaging a corresponding locating element on the compact to improve positioning of the blank on the compact. Also, the compact may be separately sintered, and the infiltrant blank may then be placed on the sintered compact. The wrought metal is then melted such that the melted wrought metal infiltrates the pores of the matrix.

Abstract: A system for suspending an HVAC unit from one or more wood truss members through the use of one or more top lock plates connected to a top support member, one or more channels connected to the top of the HVAC unit, one or more bottom lock plates slidably connected to the one or more channels, and one or more suspension chains connected between the top lock plates and the bottom lock plates to adjustably suspend the HVAC unit at the desired height and pitch. The suspension system provides a system for suspending HVAC equipment in residential and light commercial applications that is safer, quicker, cheaper, more reliable and more accurate than systems currently in use.

Abstract: Hardmetal compositions each including hard particles having a first material and a binder matrix having a second, different material comprising rhenium or a Ni-based superalloy. A two-step sintering process may be used to fabricate such hardmetals at relatively low sintering temperatures in the solid-state phase to produce substantially fully-densified hardmetals.

Abstract: Generally, the present invention (referred to also as the “suspension system”) is incorporated in a system for suspending an HVAC unit from one or more wood truss members through the use of one or more top lock plates connected to the wood truss, one or more bottom lock plates connected to the HVAC unit, and one or more suspension chains connected between the top lock plates and the bottom lock plates. The suspension system provides a system for suspending HVAC equipment in residential and light commercial applications that is safer, quicker, cheaper, more reliable and more accurate than systems currently in use.

Abstract: A clamp assembly is disclosed including a clamp support half having an attachment end, the attachment end engaging a supporting structure, a lower clamp half releasably secured to the clamp support half, and wherein the lower clamp half accommodates an anti-rotation pin to prevent rotation about a longitudinal axis of the clamp assembly.