Abstract: A semiconductor burn-in oven includes a housing including a burn-in chamber and an opening to the burn-in chamber surrounded by a front face, a heating device, testing circuitry, a door and a sealing mechanism. The door has an open position, in which the burn-in chamber is accessible through the opening, and a closed position, in which the door covers the opening. The sealing mechanism is configured to form a seal around the opening between an interior side of the door and the front face when the door is in the closed position. The sealing mechanism includes at least one sealing member having a recessed position, in which a gap extends between the front face and the interior side of the door, and a sealing position, in which the at least one sealing member closes the gap and forms the seal.

Abstract: A remote diode temperature sensing circuit for use in a burn-in system to sense a temperature of a semiconductor device under test includes a temperature sense circuit and an adapter circuit. The temperature sense circuit is configured to output temperature sense currents (Is) during a temperature sense routine. The adapter circuit is configured to drive mirrored sense currents (Ims), which mirror the temperature sense currents, through a diode of the semiconductor device that is connected to an input/output package pin, and present voltage differences across the diode responsive to the mirrored sense currents to the temperature sense circuit. The temperature sense circuit is configured to discharge a temperature output signal that is indicative of the temperature of the diode based on the voltage differences.

Abstract: A remote diode temperature sensing circuit for use in a burn-in system to sense a temperature of a semiconductor device under test includes a temperature sense circuit and an adapter circuit. The temperature sense circuit is configured to output temperature sense currents (Is) during a temperature sense routine. The adapter circuit is configured to drive mirrored sense currents (Ims), which mirror the temperature sense currents, through a diode of the semiconductor device that is connected to an input/output package pin, and present voltage differences across the diode responsive to the mirrored sense currents to the temperature sense circuit. The temperature sense circuit is configured to discharge a temperature output signal that is indicative of the temperature of the diode based on the voltage differences.

Abstract: A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment below the valve tray. Each valve tray has a plenum formed above it to provide a separate chamber that is a source of cooling air. Each valve tray has a plurality of valves, one over each of a number openings in the tray. Each opening overlies an integrated circuits or device under test on the burn-in-board below the valve tray. The valves control the flow of air for cooling the integrated circuits. The flow of air through the valves is the only path for cooling airflow to the integrated circuits on the burn-in-boards.

Abstract: A burn-in system includes a testing stage configured to stress test one an integrated circuit and a power stage having a voltage control mode and a current control mode. The power stage is configured to supply power to the testing stage. One embodiment of the power stage includes a pulse width modulator, a current control circuit and a voltage control circuit. The pulse width modulator is configured to generate a modulated power output that is coupled to the testing stage. The current control circuit is configured to produce a current error output signal that is based on a difference between a measured load current, which is indicative of the current that is supplied to the testing stage by the modulated power output, and target load current.

Abstract: A burn-in system includes a testing stage configured to stress test one an integrated circuit and a power stage having a voltage control mode and a current control mode. The power stage is configured to supply power to the testing stage. One embodiment of the power stage includes a pulse width modulator, a current control circuit and a voltage control circuit. The pulse width modulator is configured to generate a modulated power output that is coupled to the testing stage. The current control circuit is configured to produce a current error output signal that is based on a difference between a measured load current, which is indicative of the current that is supplied to the testing stage by the modulated power output, and target load current.

Abstract: A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment below the valve tray. Each valve tray has a plenum formed above it to provide a separate chamber that is a source of cooling air. Each valve tray has a plurality of valves, one over each of a number openings in the tray. Each opening overlies an integrated circuits or device under test on the burn-in-board below the valve tray. The valves control the flow of air for cooling the integrated circuits. The flow of air through the valves is the only path for cooling airflow to the integrated circuits on the burn-in-boards.

Abstract: A burn-in system includes single and dual power modes, a testing stage, first and second power stages, a single mode power control circuit and a dual mode power control circuit. When the burn-in system is in the single power mode, the first power stage produces a first power output to the testing stage based on a single mode error signal generated by the single mode power control circuit. When the burn-in system is in the dual power mode the first power stage produces the first power output and the second power stage produces a second power output in response to a dual mode error signal produced by the dual mode power control circuit. The first and second power outputs are coupled together when the burn-in system is in the dual power mode.

Abstract: A heat exchange system that can accommodate a high power integrated circuit chip for burn-in temperature stressing includes a heat sink having a chip engaging surface that is adapted to engage a surface of the chip. A liquid layer fills a heat exchange gap between the surface of the chip and the chip engaging surface of the heat sink. The liquid layer provides a low thermal resistance juncture between the chip engaging surface of the heat sink and the surface of the chip, which allows for greater heat transfer therebetween.

Abstract: A burn-in oven is provided with a plurality of spaced, stacked burn-in-boards, each with a plurality of individual circuits being tested under heated conditions, and a plurality of valve trays positioned between two burn-in-boards to form a heat exchange compartment below the valve tray. Each valve tray has a plenum formed above it to provide a separate chamber that is a source of cooling air. Each valve tray has a plurality of valves, one over each of a number openings in the tray. Each opening overlies an integrated circuits or device under test on the burn-in-board below the valve tray. The valves control the flow of air for cooling the integrated circuits. The flow of air through the valves is the only path for cooling airflow to the integrated circuits on the burn-in-boards.

Abstract: A burn-in oven is provided with a wall that has a number of vertically stacked, laterally extending slots aligned with each of the burn-in-board supports in the oven. When a burn-in-board is placed in the oven on the supports, an edge portion of the burn-in-board extends through a slot into a connector area. Each of the slots has a shutter associated therewith that will move from an open position to permit the burn-in-board connector portion to extend through the slot, to a closed position wherein the shutter covers the slot. A cam operator moves the shutters to a closed position, except when a burn-in-board is extending through a particular slot, it will support the shutter in its open position and the shutter will not be moved by the cam. All the shutters associated with openings through which no burn-in-board connector portion extends will be closed to prevent air flow from the burn-in oven.

Abstract: A burn-in oven is provided with a wall that has a number of vertically stacked, laterally extending slots aligned with each of the burn-in-board supports in the oven. When a burn-in-board is placed in the oven on the supports, an edge portion of the burn-in-board extends through a slot into a connector area. Each of the slots has a shutter associated therewith that will move from an open position to permit the burn-in-board connector portion to extend through the slot, to a closed position wherein the shutter covers the slot. A cam operator moves the shutters to a closed position, except when a burn-in-board is extending through a particular slot, it will support the shutter in its open position and the shutter will not be moved by the cam. All the shutters associated with openings through which no burn-in-board connector portion extends will be closed to prevent air flow from the burn-in oven.

Abstract: A chip temperature sensor includes a support member, a resistance temperature detector (RTD), and signal leads. The support member is slidably mountable within a heat sink bore of a burn-in oven heat exchange system and includes first and second ends, a socket formed in the first end, a bore extending from the socket through the second end, and a flange positioned between the first and second ends. The RTD is seated in the socket and includes a chip contact surface that is raised relative to the first end. The RTD is configured to produce a temperature signal that is indicative of a temperature at the chip contact surface. The signal leads are attached to the RTD and extend through the bore of the support member and out the second end of the support member. A heat exchange system that includes the above-described chip temperature sensor.

Abstract: A holder for holding an integrated circuit device to be tested in contact with a contact set on a circuit board has a support base that supports a contact set circuit board, and a hinged cover that will move between an open and a closed position. The hinged cover is pivotally mounted on a vertically slidable frame. The frame is cam actuated to move the frame and cover toward and away from the base. When the cam operator is moved to move the cams, to in turn move the frame and cover away from the base, a portion of the cam operator engages an arm on the cover and pivots the cover to an open position. The cover can easily be moved to its closed position manually and then the cam operator becomes accessible for operating the cams to clamp the integrated circuit to be tested against a contact set printed circuit board on the support base.

Abstract: A test and burn-in socket assembly designed to hold an integrated circuit module during testing or burn-in has a base that mounts a printed circuit connection board. The base has a central opening in which the integrated circuit module can be inserted. A pair of locking arms that will engage and clamp the integrated circuit module onto the printed circuit board are supported on a movable frame that is movable toward and away from the base. The arms are moved between clamping and release positions as the movable frame is moved. The movable frame is actuate by cams that are simultaneously moved by a handle or bail. The clamping arms are controlled so that they will move perpendicular to the integrated circuit when they are close to the board and move laterally to provide a space for installing and removing a board from its installed position. The board that has been tested to be removed and a new board to be inserted.

Abstract: A heat sink is used for thermally controlling a chip on a burn-in board which is being tested in a burn-in oven. The heat sink includes a resiliently mounted block that will engage a chip under resilient pressure and which is housed in a separate cup that permits accommodating misalignments or shifting of the heat sink when it contacts the chip. Additionally, the block carries a temperature sensor that is resiliently loaded against a chip which the heat sink engages. A bore mounts the temperature sensor and is also connected to a source of helium to provide a layer of helium between a surface of the heat sink and the adjacent surface of the chip for modifying the thermal coupling between the heat sink and the chip.

Abstract: A rack for supporting a plurality of burn-in boards and thermal boards which carry heat sinks to be associated with circuit chips mounted on the burn-in boards, has a first side frames that support the burn-in boards in a fixed position. Movable frames adjacent each of the side frame have a plurality of supports for thermal boards which include heat sinks, temperature sensors and other components. The movable frames are slidably mountable in a direction perpendicular to the burn-in board. Cams control the movement of the movable frames so that the thermal boards and components carried thereby can be moved from a position clearing the burn-in boards to permit insertion of the burn-in boards, onto the rack to a position wherein the components contact chips on the burn-in boards for good thermal control of the circuits on the burn-in boards.

Abstract: An automatic loading and unloading support for use on the interior of a burn-in oven includes a frame that supports a rack of printed circuit burn-in boards connected to connectors along edges of the burn-in boards at one end of the rack. The frame has a track for supporting the rack for movement from an open end toward a closed end of the oven. Driver/receiver boards are mounted at the closed end and have connectors aligning with the connectors on the burn-in boards on a rack. When the rack is moved to a position closely adjacent to the driver/receiver board connectors, alignment pins will align the rack properly and then actuators are used for moving inserter bars that press against the back side of the rack and push the connectors on the burn-in boards into the connectors on the driver/receiver boards.

Abstract: A batch test or burn-in board system has a driver/receiver board having a plurality of driver/receiver circuits that are used for burning in individual circuits on a second board in a desired environment. The driver/receiver board sends timed pulses to each of the circuits on the second board. Calibration values for insuring appropriate timing of the pulses from the driver/receiver circuits are stored in a memory that is mounted directly on the driver/receiver board. The calibration values are retrieved from memory under computer control for operating the driver/receiver board for the batch test or burn-in sequence.

Abstract: A temperature control system for high power burn-in of integrated circuit chips which includes an individual heat sink at each of the integrated circuit chips to dissipate heat generated by the integrated circuit. A heater for each chip is provided and is temperature controlled so that heat may be added by the heater as a function of the heat generated by the integrated circuit chip. A temperature sensor is provided in close thermal contact with the integrated circuit chip to sense the temperature of the integrated circuit chip. A closed loop temperature controller is used to vary the amount of current provided to the heater to maintain a desired range of temperature. Thermal contact between the temperature sensor and the integrated circuit chips is insured by utilizing a spring to urge the sensor toward the integrated circuit chip.