Abstract: The present invention is directed to an apparatus suitable for regulating, with an impinging flow of gas, the temperature of an electronic component under thermal stress testing at selected temperatures. The apparatus comprises a sensor which senses the temperature of the electronic component and provides an electrical signal representative of sensed temperature to a controller. A gas flow regulator is used to control flow directed to impinge the flow of gas upon the electronic component as necessary to adjust the temperature. The gas flow regulator ms controlled by the controller which operates the regulator so as to adjust the temperature of the electronic components.

Abstract: A thermal control system for use with a burn-in system, the thermal control system capable of delivering a thermally preconditioned liquid to a plurality of semiconductor devices during burn-in. The thermal control system comprises a liquid reservoir containing a liquid, a pump, and a plurality of spray nozzle arrays. The liquid contained in the liquid reservoir is thermally preconditioned through the use of a heating element and a cooling element and the temperature of the liquid provided to each spray nozzle array is individually controlled through the use of a pipe heating element. The liquid is collected and returned to the liquid reservoir after being sprayed on the semiconductor devices.

Abstract: An interconnection system for electrically connecting a burn-in board with one or more driver/receiver boards in a burn-in system. The interconnection system comprises a burn-in board located in an environmental test chamber, a first driver/receiver board having a first edge connector at a first end and a second driver/receiver board having a second edge connector at a first end. The first and second edge connectors are double density edge connectors having a slot into which the burn-in board can be inserted. A plurality of control components are mounted on the first driver/receiver board and the second driver/receiver board to provide test signals or stimuli for exercising electronic circuit components on the burn-in board. The burn-in board has a plurality of sockets thereon for insertion of the electronic circuit components.

Abstract: A test signal generating system for providing test signals to electronic circuit components under test in a burn-in system, the test signal generating system having a timing arrangement for eliminating glitches from the test signals, The test signal generating system comprises a data generator, a timing generator and a format selector, each of which provides an input signal to a test signal selector, A first, second and third flip-flop are electrically connected to the data generator, timing generator and format selector, respectively. A fourth flip-flop is electrically connected to an output of the test signal selection means, Each of the flip-flops is triggered by the same clock.

Abstract: A bipolar power supply capable of selectably supplying either a positive or a negative voltage at an output terminal. The power supply comprises a first operational amplifier, a second operational amplifier, a first transistor electrically connected to a positive voltage source and a second transistor electrically connected to a negative voltage source. The first transistor is electrically connected to the first operational amplifier and the second transistor is electrically connected to the second operational amplifier so that the first and second amplifiers control the operation of the first and second transistors respectively. The inputs of the first and second operational amplifiers are electrically connected in a manner that prevents them from simultaneously providing large positive voltages at their outputs.

Abstract: A method for the construction of a high density electrical connector for connecting a printed circuit board with a burn-in board in a burn-in system. The method comprises the steps of attaching a standard edge connector to a printed circuit board to form a first set of contacts, attaching two outer contact strips to the printed circuit board to form a second set of contacts, and enclosing the outer contact strips and the edge connector in an outer housing. The edge connector and the outer contact strips are secured to the printed circuit board through soldering. A burn-in board having a plurality of contact pads thereon can be inserted into the electrical connector such that the contact pads come into contact with the first and second set of contacts.

Abstract: A pair of mother burn-in boards are placed back to back, and are adequately supported with respect to each other to form an assembly. Each of the boards supports a nose board or connector board so that two sets of connectors are available for conductors and sockets on the exposed sides of the mother boards. The conductors on the two burn-in boards are connected in parallel to permit using test signals from each connector on the nose board for a socket on each of the mother burn-in boards. The assembly is made to be rigid, reliable, and to provide a wide ability to adapt components for mounting on available standard burn-in socket packages to increase the number of components that can be simultaneously tested.

Abstract: A rear module wall before a burn-in system that provides burn-in boards for electronic components to permit passing connections through slots while maintaining a good heat seal. The module rear wall is a sandwich type construction of a plurality of layers with insulating silicon rubber sandwiched between slotted backing sheets to provide for double insulation for the boards as then are slid through the slots from the interior of the oven into a tempered zone or to the exterior where they are connected to driver receiver boards and other connections.

Abstract: A burn-in board construction mounts and provides operational signals to circuit packages, for example, digital devices in an environmental stress operation such as in an oven/chamber for dynamic burn-in. Each of the circuit packages has connections to circuits and which connections are connected to conductors on the burn-in board. At least one auxiliary board is mounted on a main burn-in board and carries contacts to double the number of test connections for digital devices on such burn-in board without changing the basic mounting or environmental chamber construction. The construction permits two 128 pin driver/receiver boards of standard design to be connected to each burn-in board module. This permits coupling several hundred driver connections to a single burn-in board while still utilizing standard connectors as the interconnects.