Patents Assigned to Microchip Technology, Inc.
  • Publication number: 20220342582
    Abstract: A system and method for double data rate (DDR) chip-kill decoding using an array of ECC erasure decoders operating in parallel to identify a location of a chip-kill event associated with a DDR memory device. The ECC erasure decoder that correctly identifies the chip-kill location is then used to decode subsequent DDR bursts transmitted from the DDR memory device.
    Type: Application
    Filed: February 14, 2022
    Publication date: October 27, 2022
    Applicant: Microchip Technology Inc.
    Inventor: Peter John Waldemar Graumann
  • Publication number: 20220342668
    Abstract: In one implementation devoid of an effective address generator a method of call operation comprises pushing one or more parameters onto a first stack, pushing the contents of one or more registers onto a second stack, popping off the first stack one or more of the parameters into one or more of the registers whose contents were pushed onto the second stack, performing register to register operations on the one or more registers whose contents were pushed onto the second stack with a result of the register to register operations being stored in a result register, the result register being one of the one or more registers whose contents were pushed onto the second stack, popping off the second stack the contents of all the one or more registers into their respective registers from which they came, and returning control to an instruction following the call.
    Type: Application
    Filed: September 7, 2021
    Publication date: October 27, 2022
    Applicant: Microchip Technology Inc.
    Inventor: Christopher I. W. NORRIE
  • Publication number: 20220300793
    Abstract: A method and apparatus for performing a convolution of a N×N matrix. A weights matrix for a N×N Convolutional Neural Network (CNN) is received and is divided into 3×3 weights matrixes. Lines of image values are read and are stored in a buffer as sets of image values. A 3×3 convolution is performed to generate a 3×3 convolution value. All 3×3 convolution values associated with a particular N×N convolution and a particular set of image values are summed. The 3×3 convolutions and the summing are repeated until all columns in the set of image values have been processed; and the reading, the storing, the performing 3×3 convolutions, the summing and the repeating performing 3×3 convolutions are repeated until all lines of image values have been processed. The sums associated with a particular N×N convolution are added together to generate an N×N convolution value for each of the N×N convolutions.
    Type: Application
    Filed: September 21, 2021
    Publication date: September 22, 2022
    Applicant: Microchip Technology Inc.
    Inventors: Sathishkumar Donthu, Battu Prakash Reddy
  • Patent number: 11449456
    Abstract: System and method for sharing a PCIe endpoint device with a plurality of host computers, by allocating a quantum of time to a host computer of a plurality of host computers coupled to a PCIe switch, wherein the quantum of time identifies a duration of time during which the host computer has exclusive access to a shareable PCIe endpoint device coupled to the PCIe switch. Requests from the host computer are transmitted to an emulated PCIe endpoint device of the PCIe switch during the quantum of time and the requests are then redirected from the emulated PCIe endpoint device to the shareable PCIe endpoint device during the quantum of time allocated to the host computer.
    Type: Grant
    Filed: January 18, 2021
    Date of Patent: September 20, 2022
    Assignee: Microchip Technology Inc.
    Inventors: Derin Jose, Sachindranath Pv, Viswas G
  • Publication number: 20220270698
    Abstract: A method for reading a flash memory device includes storing configuration files of reliability-state Classification Neural Network (CNN) models and Regression Neural Network (RNN) inference models, and storing reliability-state tags corresponding to reliability states. The current number of P/E cycles is identified and a reliability-state CNN model is selected corresponding to the current number of P/E cycles. A neural network operation of the selected reliability-state CNN model is performed to identify a predicted reliability state. Corresponding reliability-state tags are identified and a corresponding RNN inference model is selected. A neural network operation of the selected RNN inference model is performed, using the reliability-state tags as input, to generate output indicating the shape of a threshold-voltage-shift read-error (TVS-RE) curve.
    Type: Application
    Filed: April 20, 2021
    Publication date: August 25, 2022
    Applicant: Microchip Technology Inc.
    Inventors: Lorenzo Zuolo, Rino Micheloni
  • Patent number: 11424902
    Abstract: System and method for synchronizing a plurality of nodes to a timing signal using a daisy-chain network having a forward transmission path and a reverse transmission path connected at a midpoint. Latency of the timing signal to the midpoint of the daisy-chain network is determined, a respective latency of the timing signal from the node to the midpoint of the daisy-chain network is determined, and a respective timing offset for each of the plurality of nodes is calculated. A local time-of-day counter at each of the plurality of nodes is adjusted based upon the respective timing offset of the node to synchronize the plurality of nodes to the timing signal.
    Type: Grant
    Filed: April 28, 2021
    Date of Patent: August 23, 2022
    Assignee: Microchip Technology Inc.
    Inventors: Atanu Chattopadhyay, Andras de Koos
  • Publication number: 20220262434
    Abstract: A ReRAM memory array includes ReRAM memory cells and a select circuit having two series-connected select transistors connected in series with a ReRAM device. When ReRAM memory cell(s) are selected for erasing, the bit line coupled to the ReRAM memory cell(s) to be erased is biased at a first voltage potential. The source line coupled to the ReRAM memory cell(s) to be erased is biased at a second voltage potential greater than the first voltage potential, the difference between the first voltage potential and the second voltage potential being sufficient to erase the ReRAM device. The gates of the series-connected select transistors coupled to the ReRAM memory cell(s) to be erased are supplied with positive voltage pulses. The gates of the series-connected select transistors coupled to the ReRAM memory cell(s) unselected for erasing are supplied with a voltage potential insufficient to turn them on.
    Type: Application
    Filed: May 4, 2022
    Publication date: August 18, 2022
    Applicant: Microchip Technology Inc.
    Inventors: Victor Nguyen, Fethi Dhaoui, John L. McCollum, Fengliang Xue
  • Patent number: 11398291
    Abstract: A method and apparatus for determining when actual wear of a flash memory device differs from a reliability state. Configuration files of a reliability-state classification neural network model are stored. The operation of a flash memory device is monitored to identify current physical characteristic values. A read of the flash memory device is performed to determine a number of errors. A neural network operation is performed using as input a set of threshold voltage shift offset values currently being used to perform reads of the flash memory device and the calculated number of errors, to identify a predicted reliability state. The identified current physical characteristic values are compared to corresponding tags associated with the predicted reliability state and a flag or other indication is stored when the comparison indicates that the identified current physical characteristic values do not correspond to the respective tags associated with the predicted reliability state.
    Type: Grant
    Filed: March 26, 2021
    Date of Patent: July 26, 2022
    Assignee: Microchip Technology Inc.
    Inventors: Lorenzo Zuolo, Rino Micheloni
  • Patent number: 11392385
    Abstract: A system and method for monitoring processors operating in lockstep to detect mismatches in pending pipelined instructions being executed by the processors. A lockstep monitor implemented in hardware is provided to detect the mismatches in the pending pipelined instructions executing on the lockstep processors and to initiate an auto-recovery operation at the processors if a mismatch is detected.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: July 19, 2022
    Assignee: Microchip Technology Inc.
    Inventor: Pierre Selwan
  • Publication number: 20220188604
    Abstract: A method for performing a neural network operation includes receiving weight and bias values of a deep neural network (DNN). An array of feature values, a bias value and a set of weight values for a single layer of the DNN are coupled to a neural network engine. Multiply-and-accumulate operations are performed on the single layer at one or more multiply and accumulate circuit (MAC) to obtain a sum corresponding to each neuron in the single layer. A layer output value corresponding to each neuron in the single layer is coupled to a corresponding input of the MAC. The coupling a bias value and a set of weight values, the performing multiply-and-accumulate operations and the coupling a layer output value are repeated to generate an output-layer-sum corresponding to each output-layer neuron and an activation function is performed on each output-layer-sum to generate DNN output values.
    Type: Application
    Filed: June 14, 2021
    Publication date: June 16, 2022
    Applicant: Microchip Technology Inc.
    Inventors: Lorenzo Zuolo, Rino Micheloni
  • Publication number: 20220191144
    Abstract: A network switch and associated method of operation for establishing a low latency transmission path through the network which bypasses the packet queue and scheduler of the switch fabric. The network switch transmits each of a plurality of data packets to the identified destination egress port over the low latency transmission if the data packet is identified to be transmitted over the low latency transmission path from the ingress port to the destination egress port, and transmits the data packet to the destination egress port through the packet queue and scheduler if the data packet is not identified to be transmitted over the low latency transmission path from the ingress port to the destination egress ports.
    Type: Application
    Filed: July 23, 2021
    Publication date: June 16, 2022
    Applicant: Microchip Technology Inc.
    Inventor: Morten Terstrup
  • Patent number: 11355187
    Abstract: A method for erasing a ReRAM memory cell that includes a ReRAM device having a select circuit with two series-connected select transistors. The method includes determining if the ReRAM cell is selected for erasing. If the ReRAM cell is selected for erasing, the bit line node is biased at a first voltage potential, the source line node is biased at a second voltage potential greater than the first voltage potential and the gates of the series-connected select transistors are supplied with positive voltage pulses. The difference between the first voltage potential and the second voltage potential is sufficient to erase the ReRAM device in the ReRAM cell. If the ReRAM cell is unselected for erasing, the gate of the one of the series-connected select transistors having its drain connected to an electrode of the ReRAM device is supplied with a voltage potential insufficient to turn it on.
    Type: Grant
    Filed: January 2, 2021
    Date of Patent: June 7, 2022
    Assignee: Microchip Technology Inc.
    Inventors: Victor Nguyen, Fethi Dhaoui, John L McCollum, Fengliang Xue
  • Publication number: 20220165348
    Abstract: A method and apparatus for determining when actual wear of a flash memory device differs from a reliability state. Configuration files of a reliability-state classification neural network model are stored. The operation of a flash memory device is monitored to identify current physical characteristic values. A read of the flash memory device is performed to determine a number of errors. A neural network operation is performed using as input a set of threshold voltage shift offset values currently being used to perform reads of the flash memory device and the calculated number of errors, to identify a predicted reliability state. The identified current physical characteristic values are compared to corresponding tags associated with the predicted reliability state and a flag or other indication is stored when the comparison indicates that the identified current physical characteristic values do not correspond to the respective tags associated with the predicted reliability state.
    Type: Application
    Filed: March 26, 2021
    Publication date: May 26, 2022
    Applicant: Microchip Technology Inc.
    Inventors: Lorenzo Zuolo, Rino Micheloni
  • Patent number: 11341304
    Abstract: A method for integrated circuit design with delay verification includes storing configuration files for a slew-rate Machine Learning (ML) model, a net-delay ML model and a cell-delay ML model. A user design is received, slew-rate feature values, net-delay feature values and cell-delay feature values are extracted from the user design, the configuration files are loaded to form inference cores, and operations of the slew-rate inference core are performed to calculate predicted slew-rate values that are sent to ML design tools. Operations of the net-delay inference core are performed to calculate predicted net-delay values that are sent to the ML design tools. Operations of the cell-delay inference core are performed to generate predicted cell-delay values that are sent to the ML design tools. The user design is iterated until a user design is obtained that is free of timing violations.
    Type: Grant
    Filed: December 3, 2020
    Date of Patent: May 24, 2022
    Assignee: Microchip Technology Inc.
    Inventors: Madhusudan Raman, Nizar Abdallah, Julien G. Dunoyer
  • Publication number: 20220136869
    Abstract: A redundant angular position sensor comprising a first angular position sensor including a first excitation coil, a first sensing coil and a second sensing coil and a second angular position sensor. The second angular position sensor including a second excitation coil, a third sensing coil and a fourth sensing coil. Each of the first, second, third and fourth sensing coils comprising a respective clockwise winding portion and a respective counter-clockwise winding portion. The redundant angular position sensor further comprises a rotatable inductive coupling element positioned in overlying relation to the sensing coils and separated from the sensing coils by a gap, wherein the rotatable inductive coupling element comprises four, substantially evenly radially spaced, sector apertures.
    Type: Application
    Filed: January 12, 2021
    Publication date: May 5, 2022
    Applicant: Microchip Technology Inc.
    Inventor: Ganesh Shaga
  • Patent number: 11323123
    Abstract: A circuit for correcting phase interpolator rollover integral non-linearity errors includes a rollover detector circuit for detecting when a rollover event of a phase interpolator has occurred, and a correction circuit that adds a signed predistortion correction to a VCO clock cycle phase fraction value when the rollover detector circuit has detected the interpolator rollover event.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: May 3, 2022
    Assignee: Microchip Technology Inc.
    Inventor: Mike Willingham
  • Patent number: 11313702
    Abstract: A system and method for monitoring analog front-end (AFE) circuitry of an inductive position sensor. A redundant AFE channel is provided and alternatively utilized with a sine AFE channel or a cosine AFE channel of the AFE circuitry to obtain a voltage difference that may result in a detection angle error at the electronic control unit (ECU) of the inductive position sensor.
    Type: Grant
    Filed: October 20, 2020
    Date of Patent: April 26, 2022
    Assignee: Microchip Technology Inc.
    Inventors: Stephane Le Goff, Mathieu Sureau, Jebas Paul Daniel T, Naveen Cannankurichi, Subhasis Sasmal, Sunny Joel
  • Publication number: 20220115282
    Abstract: A method for forming a packaged electronic die includes forming a plurality of bonding pads on a device wafer. A photoresist layer is deposited over the device wafer and is patterned so as to form a photoresist frame that completely surrounds a device formed on the device wafer. Conductive balls are deposited over the bonding pads. The wafer is cut to form the electronic die and the electronic die is placed over the substrate. The conductive balls are heated and compressed, moving the electronic die closer to the substrate such that the photoresist frame is in direct contact with the substrate or with a landing pad formed on the substrate. Encapsulant material is deposited such that the encapsulant material covers the electronic die and the substrate. The encapsulant material is cured so as to encapsulate the electronic die. The substrate is cut to separate the packaged electronic die.
    Type: Application
    Filed: December 20, 2021
    Publication date: April 14, 2022
    Applicant: Microchip Technology Inc.
    Inventors: Matthias Klein, Andreas Zakrzewski, Richard Gruenwald
  • Publication number: 20220093397
    Abstract: A silicon carbide semiconductor device includes a silicon carbide (SiC) substrate having a SiC epitaxial layer disposed over a surface of the SiC substrate, the SiC substrate having a first conductivity and the SiC epitaxial layer having the first conductivity. A contact region and a well region are formed in the SiC epitaxial layer, the contact region and the well region have a doping level of a second conductivity opposite the first conductivity. The contact region lies completely within the well region, is not in contact with a region having the first conductivity and has edges recessed from edges of the well region.
    Type: Application
    Filed: December 3, 2021
    Publication date: March 24, 2022
    Applicant: Microchip Technology Inc.
    Inventors: Amaury Gendron-Hansen, Bruce Odekirk
  • Patent number: 11271712
    Abstract: A PHY chip for a synchronous Ethernet system includes N network input/output (I/O) ports, a first external recovered clock input, a first recovered clock output, and a first clock multiplexer having a plurality of data inputs, a select input, and an output coupled to the first recovered clock output, at least one of the data inputs coupled to a first recovered clock from a respective one of the N network I/O ports, a first additional data input coupled to the first external recovered clock input.
    Type: Grant
    Filed: March 23, 2020
    Date of Patent: March 8, 2022
    Assignee: Microchip Technology Inc.
    Inventors: Thomas Joergensen, Brian Branscomb