Patents Assigned to MICROELECTRONIC TECHNOLOGIES, INC.
  • Patent number: 11264963
    Abstract: An input buffer circuit includes an input differential amplifier unit, a differential amplifier stage, and a buffer. The input differential amplifier unit has input terminals and at least one output terminal, wherein at least two of the input terminals of the input differential amplifier unit are configured to be capacitively coupled respectively so as to provide at least one pair of signal paths for a first input signal and a second input signal of a differential input signal. The differential amplifier stage, coupled to the input differential amplifier unit, has first and second differential input terminals, and a corresponding output terminal, wherein the first and second differential input terminals are capable of being coupled to the first input signal and the second input signal respectively. The buffer, coupled to the output terminal of the differential amplifier stage, is used for outputting an output single-ended signal.
    Type: Grant
    Filed: August 14, 2020
    Date of Patent: March 1, 2022
    Assignee: ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC.
    Inventors: Cheng-Hung Tsai, Chien-Yi Chang
  • Patent number: 11211903
    Abstract: An over charge protection method applied to a voltage converter which can operate in a quaternary modulation mode (Q mode) or a ternary modulation mode (T mode). The over charge protection method comprises: (a) determining whether the voltage converter operates in the Q mode or the T mode; and (b) setting a current threshold of the voltage converter to a first over current threshold if the voltage converter operates in the T mode; and (c) setting the current threshold to a second over current threshold if the voltage converter operates in the Q mode, wherein the first current threshold is smaller than the second over current threshold.
    Type: Grant
    Filed: November 3, 2020
    Date of Patent: December 28, 2021
    Assignee: Elite Semiconductor Microelectronics Technology Inc.
    Inventors: Ya-Mien Hsu, Deng-Yao Shih, Yang-Jing Huang
  • Patent number: 11127477
    Abstract: An E-fuse circuit comprising: an E-fuse group, comprising a plurality of E-fuse sections, wherein each one of the E-fuse sections comprises a plurality of E-fuses; a multi-mode latch circuit, configured to receive an input signal to generate a first output signal in a burn in mode, and configured to receive an address to be compared to generate a second output signal in a normal mode; a first logic circuit group, configured to receive a first part of bits of the first output signal to generate a control signal in the burn in mode; and a second logic circuit group, configured to receive the control signal and a second part of bits of the first output signal to generate a selection signal in the burn in mode, to select which one of the E-fuse sections is activated.
    Type: Grant
    Filed: October 22, 2020
    Date of Patent: September 21, 2021
    Assignee: Elite Semiconductor Microelectronics Technology Inc.
    Inventors: Tse-Hua Yao, Yi-Fan Chen
  • Patent number: 11121682
    Abstract: A boost class-D amplifier includes a PWM modulator, a boost level controller coupled to the PWM modulator, a pre-driver coupled to the PWM modulator and the boost level controller, a system voltage source, an inductor coupled to the system voltage source, a first switch, a second switch, a third switch, a fourth switch, a first diode coupled between the third switch and a voltage ground, a second diode coupled between the fourth switch and the voltage ground, and a capacitor coupled between the first switch and the fourth switch. The PWM modulator is for receiving an input signal and generating a first modulated signal accordingly. The boost level controller is for receiving the first modulated signal and generating a second modulated signal accordingly. The pre-driver is for receiving the first modulated signal and the second modulated signal and generating control signals accordingly.
    Type: Grant
    Filed: September 4, 2020
    Date of Patent: September 14, 2021
    Assignee: Elite Semiconductor Microelectronics Technology Inc.
    Inventors: Che-Wei Hsu, Wun-Long Yu, Deng-Yao Shih
  • Patent number: 11100963
    Abstract: A data first-in first-out (FIFO) circuit includes a register unit, a plurality of data multiplexers, and an output multiplexer. The register unit includes a plurality of decoders and a plurality of N registers. The decoders are used for outputting a plurality of decoded signals in response to a plurality of corresponding input control signals and at least one input enabling signal. The N registers are configured to receive input data in response to the corresponding decoded signals from the corresponding decoders. The data multiplexers each are coupled to M ones of the registers, wherein N and M are positive integers, N is equal to or greater than four, M is equal to or greater than two, and N is greater than M. The output multiplexer, coupled to the data multiplexers, is used for providing a corresponding output from the data multiplexers sequentially.
    Type: Grant
    Filed: July 22, 2020
    Date of Patent: August 24, 2021
    Assignee: ELITE SEMICONDUCTOR MICROELECTRONICS TECHNOLOGY INC.
    Inventors: Po-Hsun Wu, Jen-Shou Hsu
  • Patent number: 10923792
    Abstract: The present disclosure relates to a satellite signal feeding module and circuit board structure. The circuit board includes a dielectric substrate, a plurality of grounding sheets, a plurality of top feed sheets, a plurality of bottom feed sheets, and a conductive layer. The dielectric substrate includes a main segment having an opening, a rib segment extending across a full width of the opening, and a plurality of extending segments connected to the main segment. The grounding sheets cover the rib segment and a majority portion of the main segment. The top feeding sheets and the bottom sheets cover the extending segments. The conductive layer is disposed in first holes disposed in the main segment and the rib segment for electrically coupling the grounding sheets. The conductive layer is further disposed in second holes in the extending segments for electrically coupling the top and bottom feeding sheets.
    Type: Grant
    Filed: March 25, 2019
    Date of Patent: February 16, 2021
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: Kuo-Tien Chang, Yen-Fen Lin, Hung-Yu Lei
  • Patent number: 10810480
    Abstract: The present disclosure provides an electronic system including an electronic device and an electronic tag. The electronic device includes a printed circuit board. The electronic tag includes a substrate and an antenna, wherein the substrate is disposed at a height over the printed circuit board. The substrate has a first side and a second side, wherein the first side is opposite to the second side. The antenna has a first portion and a second portion, wherein the first portion is disposed on the first side, the second portion is to disposed on the second side, and the first portion is electrically coupled to the second portion via plated through holes.
    Type: Grant
    Filed: June 25, 2018
    Date of Patent: October 20, 2020
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: Chang-Chun Chen, Wei Huang Chen, Tung-Hua Yang
  • Patent number: 10778193
    Abstract: The present disclosure provides a resampling apparatus and a resampling method. The resampling apparatus includes a control unit, a memory device, a resolution identifier, a phase rate generator, a coefficient generator, and a resample filter. The control unit controls reading and writing operations of the resampling apparatus according to a control signal. The memory device transmits the control signal to the control unit. The resolution identifier sets a resolution bandwidth identity according to an interpolation/decimation (I/D) value of the control signal. The phase rate generator generates a phase select signal and a counter enable signal according to the resolution bandwidth identity. The coefficient generator generates a coefficient select signal according to the resolution bandwidth identity. The resample filter generates a resampled output data according to the phase select signal, the coefficient select signal, and an input data.
    Type: Grant
    Filed: November 27, 2019
    Date of Patent: September 15, 2020
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventor: Chih-Jung Huang
  • Patent number: 10770780
    Abstract: The present disclosure provides an antenna apparatus and a circuit board thereof for an RFD device to provide wide field effect coverage. The antenna apparatus includes a housing having a concavity defined therein, a printed circuit board disposed inside the concavity of the housing, two plates respectively located on opposite side portions of the circuit board, and a metal pattern sandwiched between and wirelessly coupled to the two plates. By disposing the metal pattern at the central portion of the circuit board and sandwiched between and coupled to the two plates, the field effect is enhanced, and the sensitivity of the antenna apparatus when detecting an object passing through the field (near field detection) is improved.
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: September 8, 2020
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: Chang-Chun Chen, Wei Huang Chen, Tung-Hua Yang
  • Patent number: 10320048
    Abstract: A communication device includes a circuit board having an upper surface and a lower surface, an upper housing disposed on the upper surface, and a lower housing disposed on the lower surface. The circuit board includes a top metal frame disposed on the upper surface, wherein the top metal frame defines a top cavity; a bottom metal frame disposed on the bottom surface, wherein the bottom metal frame defines a bottom cavity corresponding to the top cavity; a microstrip line disposed on the upper surface and extending into the top cavity; and a side coupler disposed on the lower surface and extending into the bottom cavity. The upper housing includes a depression corresponding to the top cavity, and the lower housing includes an aperture corresponding to the bottom cavity.
    Type: Grant
    Filed: May 14, 2018
    Date of Patent: June 11, 2019
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventor: Ping-Chin Tseng
  • Patent number: 10290914
    Abstract: The present disclosure provides a waveguide apparatus for receiving wireless signals. The waveguide apparatus includes a first waveguide member and a second waveguide member attached to the first waveguide member to form a waveguide having an aperture for receiving wireless signals. The first waveguide member includes a first wall and a second wall forming a first corner of the aperture, and the second waveguide member includes a third wall and a fourth wall forming a third corner of the aperture. After the first waveguide member is attached to the second waveguide member, the second wall and the third wall form a second corner of the aperture, and the fourth wall and the first wall form a fourth corner of the aperture.
    Type: Grant
    Filed: May 15, 2017
    Date of Patent: May 14, 2019
    Assignee: MICROELECTRONICS TECHNOLOGY, INC
    Inventors: Hui-Na Liu, Chang-Chun Chen, Wei Huang Chen
  • Patent number: 10256926
    Abstract: The present disclosure provides a method for configuring a communication system with a variable attenuator. The method includes measuring a first attenuation accuracy of the communication system at a first attenuation rate of the variable attenuator, and setting the variable attenuator based on the first attenuation accuracy so that the variable attenuator has a second attenuation rate and the communication system has a second attenuation accuracy. The method further includes obtaining a plurality of first gains at first temperatures and first frequencies, and performing an interpolation process to obtain, from the plurality of first gains, a plurality of second gains at second temperatures and/or second frequencies. The method also includes building a three-dimensional gain table with respect to the temperature, the frequency and the attenuation rate.
    Type: Grant
    Filed: April 2, 2018
    Date of Patent: April 9, 2019
    Assignee: MICROELECTRONICS TECHNOLOGY, INC
    Inventors: Ruei-Yuen Chen, Hsiang-Hao Sung
  • Patent number: 10231256
    Abstract: A method for radio source scheduling implemented in a communication network, the method comprising steps of establishing a connection between a baseband unit (BBU) and at least one transceiving device; transmitting, by the BBU, a plurality of downlink packets according to a downlink scheduling of the BBU; arranging each of the downlink packets to a plurality of transceiving devices; receiving, by the transceiving devices, the downlink packets and transmitting, by the transceiving devices, a plurality of uplink packets; and receiving the uplink packets, by the BBU, according to the downlink scheduling of the BBU.
    Type: Grant
    Filed: February 9, 2017
    Date of Patent: March 12, 2019
    Assignee: Microelectronics Technology Inc.
    Inventor: Aleksandra Checko
  • Patent number: 10193227
    Abstract: The present disclosure provides a waveguide transition structure for receiving satellite signals, which can be implemented in a low noise block down-converter. In some embodiments of the present disclosure, the low noise block down-converter includes a feed horn structure having at least a first waveguide extending along a first direction, a housing having at least a second waveguide extending along a second direction and communicating with the first waveguide, and a circuit board positioned within the housing. The second direction is substantially not in parallel to the first direction. The circuit board has a receiving pin configure to receive microwave signals propagating in the second waveguide.
    Type: Grant
    Filed: August 11, 2016
    Date of Patent: January 29, 2019
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: Kuotien Chang, Yenfen Lin, Yu-Chih Wu
  • Patent number: 10090571
    Abstract: A transmission switch includes a dielectric substrate; a conductive ground layer disposed over an upper surface of the dielectric substrate, wherein the conductive ground layer comprises a first ground section and a second ground section separated from the first ground section; a tunable dielectric layer disposed over the conductive ground layer, wherein the tunable dielectric layer has a first dielectric constant at a first DC voltage and a second dielectric constant at a second DC voltage; and a conductive signal layer disposed over the tunable dielectric layer, wherein the conductive signal layer comprises a first signal section, a second signal section, and an impedance-matching section connecting the first signal section and the second signal section.
    Type: Grant
    Filed: October 24, 2016
    Date of Patent: October 2, 2018
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: Chang-Chun Chen, Chia-Yu Chou
  • Patent number: 10070181
    Abstract: The present disclosure provides a satellite signal reception system comprising a low noise block down-converter for receiving satellite signals; a plurality of receivers configured to transmit the satellite signals from the low noise block down-converter to a display device; and a power splitter. The power splitter includes a first port electrically connected to the low noise block down-converter via a single cable; a plurality of second ports electrically connected to the plurality of receivers; a signal-distributing circuit electrically connecting the first port to the plurality of second ports; a plurality of power-supplying circuits electrically connecting the plurality of second ports to the first port; and a command-transmitting circuit electrically connecting the plurality of second ports to the first port, wherein the command-transmitting circuit includes a controller unit programmed to forward DiSEqC commands from the plurality of second ports to the first port in a first-in-first-out manner.
    Type: Grant
    Filed: July 20, 2016
    Date of Patent: September 4, 2018
    Assignee: Microelectronics Technology, Inc.
    Inventors: Kuotien Chang, Chia Lun Chen
  • Patent number: 10070548
    Abstract: A circuit board housing assembly includes a housing; a circuit board having an opening attached to the housing; and a board removal tool having a holding member, a rivet and a pin. The holding member has an aperture corresponding to the opening and the rivet is inserted in the opening and the aperture. The rivet has a head with a proximal end and a distal end and a central axis, the head has an internal passage extending parallel to the central axis from the proximal end to the distal end, and the distal end is mechanically connected to legs extending distally from the head and having an internal surface facing the central axis. When the pin is inserted into the internal passage along a direction from the proximal end towards the distal end, the pin applies force to the internal surface of the at least two legs in a direction perpendicular to the central axis.
    Type: Grant
    Filed: December 2, 2016
    Date of Patent: September 4, 2018
    Assignee: Microelectronics Technology, Inc.
    Inventor: Yu Cheng Lin
  • Patent number: 10044087
    Abstract: A switchable radiator includes a dielectric substrate, a first conductive layer having a slot disposed over an upper surface of the dielectric substrate, a tunable dielectric layer disposed over the first conductive layer, and a second conductive layer disposed over the tunable dielectric layer. The tunable dielectric layer has a first dielectric constant at a first DC voltage and a second dielectric constant at a second DC voltage. The second conductive layer includes a first signal section, a second signal section, and an impedance-matching section connecting the first signal section and the second signal section. The operation method of the switchable radiator includes applying a first DC voltage to the tunable dielectric layer to enable the switchable radiator to radiate energy through the slot and applying a second DC voltage to the tunable dielectric layer to disable the switchable radiator from radiating energy through the slot.
    Type: Grant
    Filed: October 14, 2016
    Date of Patent: August 7, 2018
    Assignee: Microelectronics Technology, Inc.
    Inventors: Wei Huang Chen, Chang-Chun Chen, Chia-Yu Chou
  • Patent number: 9912026
    Abstract: A tunable filter element comprises a resonator unit that defines a longitudinal axis, the resonator unit includes an inner conducting portion defining an inner shorting end along the longitudinal axis and an inner capacitive end opposing the inner shorting end, an outer conducting portion arranged around the inner conductor defining an outer shorting end along the longitudinal axis and an outer capacitive end opposite to the outer shorting end. The inner and the outer conductors maintain an annular gap there-between, and are coupled to form a shorting end at one end and a capacitive end at the other. The filter element further comprises a ferrite insert disposed between the inner and the outer conducting portions and substantially filling the annular gap, the ferrite insert being configured to receive a bias magnetic field in a direction substantially parallel to the longitudinal axis.
    Type: Grant
    Filed: October 23, 2015
    Date of Patent: March 6, 2018
    Assignee: Microelectronics Technology Inc.
    Inventor: Öncel Acar
  • Patent number: 9419342
    Abstract: An outdoor unit includes a dish antenna and a low noise block converter positioned at a focus point of the dish antenna. The low noise block converter comprises a housing, a feed cap disposed on top of the housing, and an air permeable membrane disposed on a bottom portion of the housing. The housing includes a base portion, at least one feed horn protruding from the base portion, and a bottom cover attached to a bottom of the base portion so as to form a housing cavity, wherein the bottom cover has a vent hole forming a flow path between the housing cavity and an external environment. The feed cap is disposed on a feed portion of the at least one feed horn and the air permeable membrane is disposed over the vent hole and coupled to the bottom cover via an adhesive, wherein the membrane is configured to permit egress of a gas from the housing cavity therethrough.
    Type: Grant
    Filed: October 3, 2014
    Date of Patent: August 16, 2016
    Assignee: MICROELECTRONICS TECHNOLOGY, INC.
    Inventors: Ruei Yuen Chen, Hsiang Hao Sung, Wen Chi Fu