Abstract: A method has been formed for direct solder "bumping" of wafers, chips and interconnection pads or traces on hard to solder surfaces such as aluminum and indium tin oxide. It has been discovered that conventional solders modified by the addition of a light reactive metal can be jetted in the form of microdroplets onto a hard to solder substrate and that the modified droplets will wet and bond to the surface of the hard to solder substrate. This makes it possible for the first time to create solder bumps on bare uncoated hard to solder substrates such as aluminum and indium tin oxide without the need for first applying a different surface which conventional solder will wet.

Abstract: Process for manufacturing arrays of metal balls for interconnect testing and/or interconnect bonding of microelectronic devices and the like with substrates are formed by securing metal balls in predetermined patterns of apertures in an insulating membrane or film. The pattern of apertures corresponds with the pattern of metal interconnect pads on a microelectronic device or the like and the corresponding pattern of interconnect pads on the substrate. The metal ball arrays may be used for testing and/or may be heated and reflowed to bond the microelectronic device to the substrate.

Abstract: A method for manufacturing ink jet printheads and the product printheads derived therefrom. The method involves the electro-deposition passivation of ink channels in ink jet printheads.

Abstract: A compact printhead assembly is designed for employment in a soldering operation without the need for fluxes and without conducting the operation in a confined chamber. A self-contained printhead assembly has an internal reservoir and internal heating elements for raising the temperature above the melting temperature of solder or other liquid to be dispensed in microdroplets from a working surface at one end of the printhead housing. A jetting device containing an electro-mechanical transducer is pulsed to produced droplets at an exit orifice located at the working surface. Inert gas is preheated by the housing and delivered to the working surface to establish an oxygen-free atmosphere around the exit orifice and between the working surface and a substrate located a working distance away, whereby microdrops can be formed and deposited without harmful oxidation.

Abstract: Thermo-cycling for biological material is provided by a channel such as a capillary tube extending through a series of temperature control elements. Each temperature control element maintains the adjacent portion of the channel at a desired temperature. Fluid to be processed is introduced into the tube through the inlet and flows, preferably through capillary action, to the outlet. The temperature of the fluid changes as it passes each temperature control element and is thus thermo-cycled through a predetermined sequence of temperatures.

Abstract: Biological material is cycled through a sequence of temperatures by containing the material in a vessel positioned in a chamber maintained at a temperature which is no higher than the lowest temperature in a predetermined temperature sequence. The vessel is then irradiated with varying levels of electromagnetic radiation to heat the material and cycle it through a sequence of predetermined temperatures.

Abstract: A method for direct printing of micro-optical components (82) onto optical substrates (84) or active devices to create optical circuit elements as well as micro-optical components and systems, such as plano-convex circular, cylindrical or square lenslets, anamorphic lenslets, waveguides, couplers, mixers and switches and monolithic lenses deposited directly onto optical components such as diode lasers and optical fibers. The method provides a means for precisely depositing a wide range of materials in a wide variety of shapes for fabricating a full range of passive and active micro-optic devices.

Abstract: A method for manufacturing ink jet printheads and the product printheads derived therefrom. The method involves the electrodeposition passivation of ink channels in ink jet printheads.

Abstract: The present invention relates to the process of die bonding semiconductor integrated circuit microchips with adhesive deposited from microjets in a precise pattern. Print-head technology equivalent to that used in inkjet printers is used to apply the adhesive substance (most commonly an epoxy). The use of microjets in an "array printhead" to deposit an adhesive pattern provides advantages in the ability to control the location and size of the adhesive droplets with a high degree of precision. The method also provides for individual actuation of the microjets providing the ability to rapidly change from pattern to pattern without the need to change and clean heads and equipment or to provide multiple heads. The method has application in standard die bonding as well as "flip-chip" processes using "bumped dies.

Abstract: Arrays of electro-mechanical dispensers are used to form extremely small drops of fluid and locate them precisely on substrate surfaces in miniature arrays. The printed arrays may consist of DNA, immunoassay reagents or the like. A positioning support such as an X-Y table moves the dispensing devices and substrate surfaces relative to each other to locate the drops on the substrates in predetermined patterns. Arrays of probes as dense as one thousand per square centimeter with center-to-center spacing as small as twenty-five micrometers are formed.

Abstract: Depoling and aging of a piezoelectric transducers used at elevated temperatures is controlled by poling the transducer, applying a bias voltage in the same direction as the transducer is poled to maintain the piezoelectric transducer at an elevated potential, and applying a drive voltage having a lesser magnitude than the bias voltage to induce elastic strain in the transducer.

Abstract: A method for direct printing of micro-optical components onto optical substrates or active devices to create optical circuit elements as well as micro-optical components and systems, such as plano-convex circular, cylindrical or square lenslets, anamorphic lenslets, waveguides, couplers, mixers and switches and monolithic lenses deposited directly onto optical components such as diode lasers and optical fibers. The method provides a means for precisely depositing a wide range of materials in a wide variety of shapes for fabricating a full range of passive and active micro-optic devices.

Abstract: Microdroplets of liquids at elevated temperatures are formed by transferring the liquid to an electrostrictive ejection device and applying an electric field which induces a second order elastic strain in the ejection device. The ejection device responds by ejecting generally spherically-shaped microdroplets. The ejection device comprises an electrostrictive transducer having an orifice through which the liquid is ejected. Drive electronics apply an excitation electric field to the electrostrictive transducer which causes a second order elastic strain in the electrostrictive transducer independent of the polarity of the electric field.

Abstract: Spherical solder drops having precise and accurate shape are formed by an ejection device and solidified to form solder balls for making solder pastes. The diameters of the solidified solder balls are determined by an excitation signal applied to the ejection device and changes in the diameter of the orifice in the ejection device. A solder paste is produced by mixing solidified solder balls of a single diameter or a combination of several different diameters with a carrier.

Abstract: Solder interconnection arrays for joining a plurality of metallic surfaces located on a first surface to a plurality of metallic surfaces located on a second surface are provided which reduce the amount of stress on particular areas of the interconnect array caused by shear forces between the surfaces.

Abstract: A method and apparatus for producing solidified solder balls and for ejecting generally spherical-shaped drops of liquid solder through a controlled atmosphere to impact on a surface to be wetted is disclosed. The apparatus comprises a preload reservoir to hold and maintain solder in a liquid state, an ejection chamber to hold and maintain the solder in a liquid state, a connection between the preload reservoir and the ejection chamber to allow liquid solder in the preload reservoir to be transferred to the ejection chamber while maintaining the oxides in the preload reservoir, a device to pressurize the ejection chamber with an inert gas and an ejection device operatively connected to receive liquid solder from the ejection chamber and to eject generally spherical-shaped drops of liquid solder to a specific location on a surface to be wetted. Structure is included to provide an atmosphere of inert gas between the ejection device and the specific location on a surface to be wetted.

Abstract: Metallic surfaces are soldered together without using flux or solvents. The metallic surfaces are maintained in an atmosphere of inert gas and cleaned with a laser. An ejection device deposits drops of liquid solder on a predetermined one of the metallic surfaces and the metallic surfaces are moved relative to each other so that the solidified solder contacts the other metallic surface. The metallic surfaces and the solidified solder are then heated until the solidified solder reflows and joins the metallic surfaces.

Abstract: A method and apparatus for providing greater precision placement and control of the delivery of laser energy during laser surgery is disclosed and includes a pulse-controlled dye delivery system which may be coordinated with the delivery of laser energy to predetermined tissue. The pulse-controlled dye delivery system comprises at least one ejection head capable of ejecting drops of liquid dye with the diameter of each drop being less than two hundred microns. The dye is responsive to the wavelength of energy delivered by the laser performing the surgery to convert the laser energy from the surgical laser to tissue thermal energy. Circuitry is provided for precisely activating the dye delivery system and the laser energy source such that optimal conditions for successful outcome of the surgery may be achieved.

Abstract: A method of making apparatus for dispensing very small and precise amounts of fluids is disclosed which includes forming a main body with a bore formed coaxially therethrough, attaching a first housing to the main body such that the bores thereof are coaxial, attaching a driver device to the first housing, attaching a second housing to the main body such that the driver device is enclosed by the second housing, attaching a weight to the end of the first housing and applying heat to the first housing at a predetermined location between the weight and the second housing, whereby the end of the first housing is pulled away from the main body to form a tapered end portion on the first housing.

Abstract: A method and apparatus for providing serialization of printed circuit boards and flex circuits during the normal process of manufacture of the boards and circuits is disclosed and includes a print module which prints the serializing information on the surface of the photoresist material with a fluid, which blocks the passage of ultraviolet radiation, before the photoresist material is exposed to ultraviolet radiation through the photomask. If a negative-acting photoresist material is used, the serializing information is reverse printed on the surface of the negative-acting photoresist material. If a positive-acting photoresist material is used, the serializing information is printed on the surface of the positive-acting photoresist material.