Abstract: Embodiments are directed to micro-scale or meso-scale hydraulically or pneumatically actuated devices, methods for forming such devices using multi-layer, multi-material electrochemical fabrication methods and particularly fabricating (i.e. building up) a plurality of components of devices that are moveable relative to one another in pre-assembled configurations wherein special features are designed into the devices (e.g. wide gaps in fabrication positions and narrowed gaps in working regions of component movement, mechanisms that inhibit the return of device components to fabrication positions after being moved into working regions, used of cylindrical interference and/or checkerboard bushings, etching holes in selected locations to allow removal of sacrificial material) to allow such fabrication to occur without violating intra-layer minimum feature size constraints while still obtaining effective gaps between components that are smaller than the minimum features size limits.

Abstract: Embodiments are directed to methods for forming multi-layer three-dimensional structures involving the joining of at least two structural elements, at least one of which is formed as a multi-layer three-dimensional structure, wherein the joining occurs via one of: (1) elastic deformation and elastic recovery and subsequent retention of elements relative to each other, (2) relative deformation of an initial portion of at least one element relative to another portion of the at least one element until the at least two elements are in a desired retention position after which the deformation is reduced or eliminated and a portion of at least one element is brought into position which in turn locks the at least two elements together via contact with one another including contact with the initial portion of at least one element, or (3) moving a retention region of one element into the retention region of the other element, without deformation of either element, along a path including a loading region of the other el

Abstract: Embodiments of invention are directed to the formation of microprobes (i.e. compliant electrical or electronic contact elements) on a temporary substrate, dicing individual probe arrays, and then transferring the arrays to space transformers or other permanent substrates. Some embodiments of the invention transfer probes to permanent substrates prior to separating the probes from a temporary substrate on which the probes were formed while other embodiments do the opposite. Some embodiments, remove sacrificial material prior to transfer while other embodiments remove sacrificial material after transfer. Some embodiments are directed to the bonding of first and second electric components together using one or more solder bumps with enhanced aspect ratios (i.e. height to width ratios) obtained as a result of surrounding the bumps at least in part with rings of a retention material. The retention material may act be a solder mask material.

Abstract: RF and microwave radiation directing or controlling components are provided that may be monolithic, that may be formed from a plurality of electrodeposition operations and/or from a plurality of deposited layers of material, that may include switches, inductors, antennae, transmission lines, filters, and/or other active or passive components. Components may include non-radiation-entry and non-radiation-exit channels that are useful in separating sacrificial materials from structural materials. Preferred formation processes use electrochemical fabrication techniques (e.g. including selective depositions, bulk depositions, etching operations and planarization operations) and post-deposition processes (e.g. selective etching operations and/or back filling operations).

Abstract: Multi-layer structures are electrochemically fabricated by depositing a first material, selectively etching the first material (e.g. via a mask), depositing a second material to fill in the voids created by the etching, and then planarizing the depositions so as to bound the layer being created and thereafter adding additional layers to previously formed layers. The first and second depositions may be of the blanket or selective type. The repetition of the formation process for forming successive layers may be repeated with or without variations (e.g. variations in: patterns; numbers or existence of or parameters associated with depositions, etchings, and or planarization operations; the order of operations, or the materials deposited). Other embodiments form multi-layer structures using operations that interlace material deposited in association with some layers with material deposited in association with other layers.

Abstract: Permanent or temporary alignment and/or retention structures for receiving multiple components are provided. The structures are preferably formed monolithically via a plurality of deposition operations (e.g. electrodeposition operations). The structures typically include two or more positioning fixtures that control or aid in the positioning of components relative to one another, such features may include (1) positioning guides or stops that fix or at least partially limit the positioning of components in one or more orientations or directions, (2) retention elements that hold positioned components in desired orientations or locations, and/or (3) positioning and/or retention elements that receive and hold adjustment modules into which components can be fixed and which in turn can be used for fine adjustments of position and/or orientation of the components.

Abstract: Some embodiments of the invention provide an instrument for mechanically removing segments of tissue from a patient during a minimally invasive surgical procedure. An exemplary instrument provides an inlet for receiving tissue a mechanism for cutting away received tissue and for simultaneously moving the cut away tissue away from the inlet to allow additional material to enter the inlet for removal wherein multiple specimens can be captured and eventually removed from the patient's body without the need of removing the instrument after each capture.

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Abstract: Multi-layer fabrication methods (e.g. electrochemical fabrication methods) for forming microscale and mesoscale devices or structures (e.g. turbines) provide bushings or roller bearing that allow rotational or linear motion which is constrained by multiple structural elements spaced from one another by gaps that are effectively less than minimum features sizes associated with the individual layers used to form the structures. In some embodiments, features or protrusions formed on different layers on opposing surfaces are offset along the axis of layer stacking so as to bring the features into positions that are closer than allowed by the minimum features sizes associated with individual layers. In other embodiments, interference is used to create effective spacings that are less than the minimum features sizes.

Abstract: Electrochemical fabrication processes and apparatus for producing multi-layer structures where each layer includes the deposition of at least two materials and wherein the formation of at least some layers including operations for providing coatings of dielectric material that isolate at least portions of a first conductive material from (1) other portions of the first conductive material, (2) a second conductive material, or (3) another dielectric material, and wherein the thickness of the dielectric coatings are thin compared to the thicknesses of the layers used in forming the structures. In some preferred embodiments, portions of each individual layer are encapsulated by dielectric material while in other embodiments only boundaries between distinct regions of materials are isolated from one another by dielectric barriers.

Abstract: Embodiments of the invention are directed to the formation of beam-like structures using electrochemical fabrication techniques where the beam like structures have narrow regions and wider regions such that a beam of desired compliance is obtained. In some embodiments, narrower regions of the beam are thinner than a minimum feature size but are formable as a result of the thicker regions. In some embodiments the beam-like structures are formed from a plurality of adhered layers.

Abstract: Embodiments of the invention provide fabrication processes for the co-fabrication of microprobe arrays along with one or more space transformers wherein the fabrication processes include the forming and adhering of a plurality of layers to previously formed layers and wherein at least a portion of the plurality of layers are formed from at least one structural material and at least one sacrificial material that is at least in part released from the plurality of layers after formation and wherein the space transformer includes a plurality of interconnect elements that connect one side to the array of probes that has a first spacing to another side that has a second spacing where the second spacing is greater than the first spacing. In some embodiments, the fabrication process includes a plurality of electrodeposition operations.

Abstract: Various embodiments of the invention are directed to formation of mesoscale or microscale devices using electrochemical fabrication techniques where structures are formed from a plurality of layers as opened structures which can be folded over or other otherwise combined to form structures of desired configuration. Each layer is formed from at least one structural material and at least one sacrificial material. The initial formation of open structures may facilitate release of the sacrificial material, ability to form fewer layers to complete a structure, ability to locate additional materials into the structure, ability to perform additional processing operations on regions exposed while the structure is open, and/or the ability to form completely encapsulated and possibly hollow structures.

Abstract: Some embodiments of the present invention provide processes and apparatus for electrochemically fabricating multilayer structures (e.g. mesoscale or microscale structures) with improved endpoint detection and parallelism maintenance for materials (e.g. layers) that are planarized during the electrochemical fabrication process. Some methods involve the use of a fixture during planarization that ensures that planarized planes of material are parallel to other deposited planes within a given tolerance. Some methods involve the use of an endpoint detection fixture that ensures precise heights of deposited materials relative to an initial surface of a substrate, relative to a first deposited layer, or relative to some other layer formed during the fabrication process. In some embodiments planarization may occur via lapping while other embodiments may use a diamond fly cutting machine.

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.

Abstract: Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Abstract: Some embodiments of the invention are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that partially coats the surface of the probe. Other embodiments are directed to the electrochemical fabrication of microprobes which are formed from a core material and a material that completely coats the surface of each layer from which the probe is formed including interlayer regions. These first two groups of embodiments incorporate both the core material and the coating material during the formation of each layer. Still other embodiments are directed to the electrochemical fabrication of microprobe arrays that are partially encapsulated by a dielectric material during a post layer formation coating process. In even further embodiments, the electrochemical fabrication of microprobes from two or more materials may occur by incorporating a coating material around each layer of the structure without locating the coating material in inter-layer regions.

Abstract: Multi-layer structures are electrochemically formed on porous dielectric substrates. In some embodiments, the substrates have at least one surface which is infiltrated with a sacrificial conductive material, all pores (e.g. openings in between dielectric regions of the substrate) or selected pores near the surface of the substrate are opened, and a structural material is deposited to fill at least a portion of the opened pores. If more pores are opened than have been filled or will be filled by the structural material a sacrificial material may be deposited to fill the additional pores. After completing formation of an initial patterned surface on the substrate, a plurality of layers are formed on the substrate (e.g. via electrodeposition operations) and after layer formation is complete, the conductive sacrificial material filling the pores is removed.

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.

Abstract: Some embodiments of the present invention are directed to techniques for building up single layer or multi-layer structures on dielectric or partially dielectric substrates. Certain embodiments deposit seed layer material directly onto substrate materials while other embodiments use an intervening adhesion layer material. Some embodiments use different seed layer materials and/or adhesion layer materials for sacrificial and structural conductive building materials. Some embodiments apply seed layer and/or adhesion layer materials in what are effectively selective manners while other embodiments apply the materials in blanket fashion. Some embodiments remove extraneous depositions (e.g. depositions to regions unintended to form part of a layer) via planarization operations while other embodiments remove the extraneous material via etching operations.