Abstract: Methods, systems, and devices for memory write access control are described. In some examples, memory systems may include storage that is access-protected (e.g., write access protected). To enable access to the protected storage, a server node may communicate a command to the memory system that is signed with a private key that is inaccessible to the memory system. They memory system may verify the command using a public key and may enable access to the protected storage. Access commands associated with the protected storage may be processed until access to the protected storage is disabled.

Abstract: Methods and apparatuses for a cross-point memory array and related fabrication techniques are described. The fabrication techniques described herein may facilitate concurrently building two or more decks of memory cells disposed in a cross-point architecture. Each deck of memory cells may include a plurality of first access lines (e.g., word lines), a plurality of second access lines (e.g., bit lines), and a memory component at each topological intersection of a first access line and a second access line. The fabrication technique may use a pattern of vias formed at a top layer of a composite stack, which may facilitate building a 3D memory array within the composite stack while using a reduced number of processing steps. The fabrication techniques may also be suitable for forming a socket region where the 3D memory array may be coupled with other components of a memory device.

Abstract: Methods, systems, and devices for inductive energy harvesting and signal development for a memory device are described. One or more inductors may be included in or coupled with a memory device and used to provide current for various operations of the memory device based on energy harvested by the inductors. An inductor may harvest energy based on current being routed through the inductor or based on being inductively coupled with a second inductor through which current is routed. After harvesting energy, an inductor may provide current, and the current provided by the inductor may be used to drive access lines or otherwise as part of executing one or more operations at the memory device. Such techniques may improve energy efficiency or improve the drive strength of signals for the memory device, among other benefits.

Abstract: Methods, systems, and devices for improved techniques for multi-level memory cell programming are described. A memory array may receive a first command to store a first logic state in a memory cell for storing three or more logic states. The memory array may apply, as part of an erase operation, a first pulse with a first polarity to a plurality of memory cells to store a second logic state different from the first logic state in the plurality of memory cells, where the plurality of memory cells includes the memory cell. The memory array may apply, as part of a write operation or as part of the erase operation, one or more second pulses with a second polarity to the memory cell to store the first logic state in the memory cell based on applying the first pulse.

Abstract: Systems, apparatuses, and methods related to medical device data analysis are described. In some examples, a medical device is implanted in a user of the medical device and the data generated by the medical device is not easily accessible to the user. In an example, a controller can be configured to receive, by a mobile device coupled to a medical device, data from the medical device, where the data is a part of a baseline dataset related to the medical device. The controller can be configured to receive different data from the medical device, where the different data is received from the medical device as the different data is generated by the medical device, analyze the data from the medical device and the different data generated by the medical device, and perform an action based on the analyzed data and the different data generated by the medical device.

Abstract: Memory devices are disclosed. A memory device may include a first row of power supply pads and a first row of input/output (DQ) pads. The memory device may further include a row of vias, wherein the first row of DQ pads is positioned at least partially between the row of vias and the first row of power supply pads. The memory device may also include a number of conductors, wherein each via of the row of vias is coupled, via an associated conductor of the number of conductors, to either a power supply pad of the first row of power supply pads or a DQ pad of the first row of DQ pads. Methods of forming an interface region of a memory device, and electronic systems are also disclosed.

Abstract: Some embodiments include an integrated assembly having first and second pillars of semiconductor material. The first pillar includes a first source/drain region, and the second pillar includes a second source/drain region. First and second bottom electrodes are coupled with the first and second source/drain regions, respectively. The first and second source/drain regions are spaced from one another by an intervening region. First and second leaker-device-structures extend into the intervening region from the first and second bottom electrodes, respectively. Top-electrode-material extends into the intervening region and contacts the first and second leaker-device-structures. Ferroelectric-insulative-material is between the top-electrode-material and the bottom electrodes. Some embodiments include methods of forming integrated assemblies.

Abstract: A method used in forming memory circuitry comprises forming transistors individually comprising one source/drain region and another source/drain region. A channel region is between the one and the another source/drain regions. A conductive gate is operatively proximate the channel region. Digitline structures are formed that are individually directly electrically coupled to the another source/drain regions of multiple of the transistors. The digitline structures individually comprise a conductive digitline and an insulator material thereatop. The insulator material has a top. First insulating material is formed directly above the tops of the insulator material and laterally-over longitudinal sides of the digitline structures and covers across the one source/drain regions laterally-between immediately-adjacent of the digitline structures. Second insulating material is formed over the first insulating material.

Abstract: Some embodiments include an integrated assembly having a first memory region, a second memory region, and an intermediate region between the first and second memory regions. The intermediate region has a first edge proximate the first memory region and has a second edge proximate the second memory region. Channel-material-pillars are arranged within the first and second memory regions. Conductive posts are arranged within the intermediate region. Doped-semiconductor-material is within the intermediate region and is configured as a substantially H-shaped structure having a first leg region along the first edge, a second leg region along the second edge, and a belt region adjacent the panel. Some embodiments include methods of forming integrated assemblies.

Abstract: An apparatus that includes a first interlayer insulating film having a contact hole; a contact plug embedded in the contact hole, the contact plug including a main part and a barrier metal part located between an outer wall of the main part and an inner wall of the contact hole; a second interlayer insulating film covering the first interlayer insulating film; and a first conductive pattern embedded in the second interlayer insulating film and connected to the contact plug. Apart of the second interlayer insulating film is embedded in a gap between a top part of the outer wall of the main part of the contact plug and a top part of the inner wall of the contact hole.

Abstract: Systems, apparatuses, and methods related to isolating virtual machines in a memory device are described. A memory apparatus includes a memory device and a controller coupled to the memory device, wherein the controller is configured to provide a plurality of Peripheral Component Interconnect express (PCIe) functions of the memory device and isolate access to each of the plurality of PCIe functions via respective passwords and digital signatures created from host keys.

Abstract: Some embodiments include an integrated assembly with a semiconductor channel material having a boundary region where a more-heavily-doped region interfaces with a less-heavily-doped region. The more-heavily-doped region and the less-heavily-doped region have the same majority carriers. The integrated assembly includes a gating structure adjacent the semiconductor channel material and having a gating region and an interconnecting region of a common and continuous material. The gating region has a length extending along a segment of the more-heavily-doped region, a segment of the less-heavily-doped region, and the boundary region. The interconnecting region extends laterally outward from the gating region on a side opposite the semiconductor channel region, and is narrower than the length of the gating region. Some embodiments include methods of forming integrated assemblies.

Abstract: A system includes a memory device and a processing device, operatively coupled with the memory device, to perform operations including: receiving a request to perform a memory access operation on a set of cells associated with a wordline of the memory device; determining that a temperature associated with the memory device satisfies a threshold criterion; determining a memory access operation type of the memory access operation; and performing the memory access operation on the set of cells associated with the wordline using a first time sense parameter, wherein the first time sense parameter corresponds to the memory access operation type and the temperature associated with the memory device.

Abstract: Some embodiments include an integrated assembly having a first gate operatively adjacent a channel region, a first source/drain region on a first side of the channel region, and a second source/drain region on an opposing second side of the channel region. The first source/drain region is spaced from the channel region by an intervening region. The first and second source/drain regions are gatedly coupled to one another through the channel region. A second gate is adjacent a segment of the intervening region and is spaced from the first gate by an insulative region. A lightly-doped region extends across the intervening region and is under at least a portion of the first source/drain region. Some embodiments include methods of forming integrated assemblies.

Abstract: The present disclosure includes apparatuses, methods, and systems for drift compensation for codewords in memory. An embodiment includes a memory device having an array of memory cells, and circuitry to sense a codeword stored in the array, determine a threshold voltage value of each cell of the codeword, sort the threshold voltage values, determine a second derivative value of a cell metric for a number of the cells of the codeword based on the threshold voltage value of that respective cell, the threshold voltage value immediately preceding the threshold voltage value of that respective cell in the sorted values, and a value proportional to a total quantity of the cells of the codeword, determine the cell metric for which the determined second derivative value has a greatest value, input the determined cell metric to a Pearson detector, and determine originally programmed data of the codeword using the Pearson detector.

Abstract: A determination is made that a memory device of a memory sub-system is to be transitioned to a sleep mode. A command is initiated to cause a standby circuit associated with the memory device to enter into a low power mode while a power supply of the memory sub-system is maintained in a powered state. In the low power mode, a reference voltage is supplied to a voltage regulator of the standby circuit to supply a standby current level to the memory device during the sleep mode.

Abstract: Methods, apparatuses, and non-transitory machine-readable media associated with a memory device training are described. An apparatus for memory device training can include a memory device and a processing device communicatively coupled to the memory device. The processing device can be configured to perform a plurality of training rounds associated with performance of the memory device at different temperatures and different voltages and write results of the plurality of training rounds to a plurality of mode registers of the memory device. The processing device can also be configured to log an initial group identifier into a current GID MR as a reference identifier and in response to a threshold deviation from the reference ID or in response to lack of deviation outside the threshold for a threshold amount of time, retrieve an updated training setting from the results in the plurality of mode registers and enable the updated training setting.

Abstract: An apparatus, such as a stacked artificial neural network, can include a semiconductor at a first level. The semiconductor can include first circuitry. A memory can be at a second level. Second circuitry can be at a third level such that the memory is between the first circuitry and the second circuitry. The first circuitry can be configured propagate a first signal to the memory. The memory can be configured to propagate a second signal, based on data stored in the memory, to the second circuitry in response to the first signal. The second circuitry can be configured to generate a data signal based on the second signal.

Abstract: Methods, systems, and devices for determining offsets for memory read operations are described. In response to a threshold quantity of pages failing initial reads but being successfully read using a same reference adjustment during re-reads, the offset responsible for the adjustment may be used as a first-applied offset for subsequent re-reads or a baseline offset for subsequent initial reads. After the initial reads begin using the reference adjustment, if a threshold quantity of pages fail initial reads, the offset used for the initial read may be adjusted to be the offset used to perform the successful re-reads. If an updated offset to use a baseline is not identified, the baseline offset may be cleared so the original reference may again be used without adjustment for initial reads.

Abstract: Methods, systems, and devices for a sensing scheme that extracts the full or nearly full remnant polarization charge difference between two logic states of a ferroelectric memory cell or cells is described. The scheme employs a charge mirror to extract the full charge difference between the two states of a selected memory cell. The charge mirror may transfer the memory cell polarization charge to an amplification capacitor. The signal on the amplification capacitor may then be compared with a reference voltage to detect the logic state of the memory cell.