Patents Assigned to Micronas GmbH
  • Publication number: 20210063204
    Abstract: An integrated rotation angle determining sensor unit in a measuring system for determining a rotation angle, comprising a shaft, rotatable around a rotation axis, having a transducer, a first semiconductor layer designed as a die being provided, which has an upper side arranged perpendicularly to the rotation axis and an underside and a first Hall sensor system monolithically formed in the first semiconductor layer, and a second semiconductor layer designed as a die being provided, which has an upper side arranged perpendicularly to the rotation axis and an underside and a second Hall sensor system monolithically formed in the second semiconductor layer, each Hall sensor system including at least one first Hall sensor and a second Hall sensor and a third Hall sensor.
    Type: Application
    Filed: August 31, 2020
    Publication date: March 4, 2021
    Applicant: TDK-Micronas GmbH
    Inventors: Yan BONDAR, Marcus Christian MEYER, Hans Christian Paul DITTMANN
  • Publication number: 20210063203
    Abstract: A rotation angle measurement method and a circuit, a rotation angle measuring system including a shaft, a transducer, a first sensor system with at least one magnetic field sensor of a first type for measuring a magnetic field component Bz and a second sensor system with at least one magnetic field sensor of a second type for detecting magnetic field components Bx, By being provided, a first or second measured value being ascertained with the aid of each sensor system at a first point in time, a first or second rotation angle value being determined for each measured value, a first output rotation angle value being determined from the first rotation angle value and a known constant angle offset between the two sensor systems as a reference value for the second sensor system, a deviation of the second rotation angle value from the first output rotation angle value being ascertained.
    Type: Application
    Filed: August 31, 2020
    Publication date: March 4, 2021
    Applicant: TDK-Micronas GmbH
    Inventors: Marcus Christian MEYER, Hans Christian Paul DITTMANN
  • Publication number: 20210055132
    Abstract: An integrated rotation-angle sensor unit in a measuring system for rotation angle determination, with a shaft that is rotatable about an axis of rotation with a transmitter, The sensor unit has a semiconductor layer with a top surface that can be arranged perpendicular to the axis of rotation and has a bottom surface, and two monolithic Hall sensor systems are implemented in the semiconductor layer. Each Hall sensor system has at least a first Hall sensor, a second Hall sensor, and a third Hall sensor, and the three Hall sensors of the first Hall sensor system are arranged on a first circle that is parallel to the top surface of the semiconductor layer and can be arranged concentrically around the axis of rotation.
    Type: Application
    Filed: August 24, 2020
    Publication date: February 25, 2021
    Applicant: TDK-Micronas GmbH
    Inventors: Yan BONDAR, Marcus Christian MEYER, Hans Christian Paul DITTMANN
  • Patent number: 10907989
    Abstract: A device and method for the processing of a measurement signal of a magnetic field B(?) is described. The device comprises a permanent magnet having two or four poles, an odd number of magnetic field sensors that are arranged in a plane below the magnets, and a signal processing unit, which is adapted to detect the values of the odd number of magnetic field sensors, to filter the fundamental frequency of the magnetic field out of the detected values of the lateral magnetic field sensors in order to calculate the value of the rotation angle from the fundamental frequency.
    Type: Grant
    Filed: November 20, 2018
    Date of Patent: February 2, 2021
    Assignee: TDK—Micronas GmbH
    Inventor: David Muthers
  • Publication number: 20210003641
    Abstract: A vertical Hall sensor structure having a substrate layer, a semiconductor area of a first conductivity type, at least a first, a second and a third semiconductor contact area of the first conductivity type extending from an upper surface of the semiconductor area into the semiconductor area, and at least a first semiconductor contact area of a second conductivity type, wherein the semiconductor contact areas of the first conductivity type are spaced apart from each other and a metal connection contact layer is arranged on each semiconductor contact area of the first conductivity type. The first semiconductor contact area of the second conductivity type is adjacent to the first semiconductor contact area of the first conductivity type or is spaced at a distance of at most 0.2 ?m from the first semiconductor contact area of the first conductivity type.
    Type: Application
    Filed: July 2, 2020
    Publication date: January 7, 2021
    Applicant: TDK-Micronas GmbH
    Inventors: Maria-Cristina VECCHI, Reinhard ERWE, Martin CORNILS, Kerwin KHU
  • Publication number: 20200393523
    Abstract: An isolating Hall sensor structure having a support structure made of a substrate layer and an oxide layer, a semiconductor region of a first conductivity type which is integrally connected to a top side of the oxide layer, at least one trench extending from the top side of the semiconductor region to the oxide layer of the support structure, at least three first semiconductor contact regions of the first conductivity type, each extending from a top side of the semiconductor region into the semiconductor region. The at least one trench surrounds a box region of the semiconductor region. The first semiconductor contact regions are each arranged in the box region of the semiconductor region and are each spaced apart from one another. A metallic connection contact layer is arranged on each first semiconductor contact region.
    Type: Application
    Filed: June 10, 2020
    Publication date: December 17, 2020
    Applicant: TDK-Micronas GmbH
    Inventors: Maria-Cristina VECCHI, Reinhard ERWE, Martin CORNILS, Kerwin KHU
  • Patent number: 10854540
    Abstract: A packaged IC component having a semiconductor body and a printed circuit board. The semiconductor body includes a monolithically integrated circuit and at least two metal contact areas. The printed circuit board has a first and second region and a top and a bottom. At least two formed terminal contacts and two conductive traces are connected to the terminal contacts, and the terminal contacts are designed as contact holes passing through the printed circuit board, and are arranged in the first region of the printed circuit board. The two metal contact areas are connected to the conductive traces by bond wires, and the semiconductor body is implemented as a die. The die is arranged in the second region on the top of the printed circuit board, and the semiconductor body and the bond wires are completely covered with a potting compound on the top of the printed circuit board.
    Type: Grant
    Filed: July 9, 2018
    Date of Patent: December 1, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Joerg Franke, Thomas Leneke
  • Patent number: 10845431
    Abstract: A Hall sensor has a Hall sensor element, having multiple connection locations and a current supply source or voltage supply source, which has a first and a second supply connector for output of a supply current or a supply voltage. The first supply connector is connected or can be connected with a first connection location to feed a current into the Hall sensor element, and the second supply connector is connected or can be connected with a second connection location of the Hall sensor element. The Hall sensor has a NAND gate, which is connected with the first connection location of the Hall sensor element using a first input, and with the second connection location of the Hall sensor element using a second input, and has an output for output of a first error signal.
    Type: Grant
    Filed: July 5, 2019
    Date of Patent: November 24, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Marc Baumann, David Muthers, Thomas Desel
  • Publication number: 20200365796
    Abstract: A Hall sensor structure comprising a semiconductor body of a first conductivity type, a well region of a second conductivity type extending from a top side of the semiconductor body into the semiconductor body, at least three first semiconductor contact regions of the second conductivity type, each extending from a top side of the well region into the well region, at least one second semiconductor contact region of a second conductivity type, wherein the first semiconductor contact regions are spaced apart from one another and from an edge of the well region, a metallic connection contact layer is arranged on each first semiconductor contact region, the at least one second semiconductor contact region extends along the top side of the semiconductor body at least partially around the well region.
    Type: Application
    Filed: May 18, 2020
    Publication date: November 19, 2020
    Applicant: TDK-Micronas GmbH
    Inventors: Maria-Cristina VECCHI, Reinhard ERWE, Martin CORNILS, Kerwin KHU
  • Patent number: 10816611
    Abstract: A measuring system having a magnetic device for generating a magnetic field and at least one magnetic field sensor for detecting a flux density of the magnetic field, at least in a first spatial direction. The magnetic device has a top side facing the magnetic field sensor, the magnetic field sensor is spaced apart from the top side of the magnetic device, the magnetic device has a main magnet, having two poles, with a main magnetizing direction for generating a main magnetic field and at least one secondary magnet, having two poles, with a secondary magnetization direction for generating a secondary magnetic field, the main magnet has larger dimensions than the at least one secondary magnet, the magnetic field is formed by superposition of the main magnetic field and the secondary magnetic field, the secondary magnetic field at least partially compensates the main magnetic field in the first spatial direction.
    Type: Grant
    Filed: August 1, 2017
    Date of Patent: October 27, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke
  • Patent number: 10684158
    Abstract: A system for monitoring a state, for example a filling state of a container, with a first sensor which in operation produces a measured value, and a second sensor which in operation produces a second, discrete measured value. The first measured value and the second measured value are forwarded to an evaluation unit via a common line.
    Type: Grant
    Filed: April 27, 2017
    Date of Patent: June 16, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Philip Herbst, Hans-Joerg Fink
  • Patent number: 10627445
    Abstract: A method and interface circuit for testing an electronic device with a single logic pin is disclosed. The comprises forming a data stream having three level bands; inputting the data stream through a single logic pin; and decoding the data stream to identify a scan_in signal, a scan_shift_enable signal and a scan_out signal and returning contemporaneously a scan_out signal as an output through the same logic pin. The interface circuit includes a decoder connected to the single logic pin.
    Type: Grant
    Filed: July 24, 2018
    Date of Patent: April 21, 2020
    Assignee: TDK—Micronas GmbH
    Inventor: Jonathan Bradford
  • Patent number: 10605872
    Abstract: A calibration method for a Hall sensor having a Hall sensitive layer with four electrical contacts and a first field plate, wherein, at a first temperature and at a first magnetic flux density, a resistance value of the Hall sensitive layer is determined for each of at least three different field plate voltages present at the field plate, a calibration curve is produced from the at least three resistance values, a deviation value of the calibration curve is determined from a reference calibration curve, and the field plate voltage that is present at the first field plate or an operating voltage that is present at the sensitive layer is readjusted by a correction value corresponding to the deviation value.
    Type: Grant
    Filed: December 15, 2017
    Date of Patent: March 31, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Timo Kaufmann, Joerg Franke
  • Patent number: 10605625
    Abstract: A measuring system for determining the position of a transducer along a z-direction, having a semiconductor body having a surface, a back surface, at least one connection contact and at least one magnetic field sensor which is sensitive in the z-direction, a carrier having a front side, rear side and electrically conductive regions, a magnet for producing a magnetic field, having a first magnetic pole formed along a first surface and an axis of symmetry extending perpendicular to the first surface, wherein between at least one connection contact of the semiconductor body and at least one conductor track of the carrier, there is an electrical operative connection, the first surface of the magnet being arranged parallel to the z-direction and the axis of symmetry of the magnet being arranged perpendicular to the z-direction, the transducer having an end face facing the magnetic field sensor.
    Type: Grant
    Filed: July 31, 2017
    Date of Patent: March 31, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Joerg Franke, Timo Kaufmann
  • Patent number: 10598513
    Abstract: A method and system for computing the phase shift or the amplitude of an electromagnetic three-phase system. The method comprises the following steps of: detecting vector values corresponding to an electromagnetic quantity by three sensors, the three sensors delivering signals that are offset from each other substantially by 0°, 120° and 240°; computing changed vector values by logically adjusting one of the detected vector values to a phase of 0°; and iteratively computing the phase shift of the three-phase system using the changed vector values.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: March 24, 2020
    Assignee: TDK—Micronas GmbH
    Inventor: Juergen Huppertz
  • Patent number: 10571347
    Abstract: A pressure sensor (10) has a carrier chip (20) in and/or on which at least one sensor element (30) is integrated, the measuring signal of which depends on the mechanical stress in the carrier chip (20). The carrier chip (20) is connected on its back side in a flat and material-locking fashion to a solid body (50), the modulus of elasticity of which differs from the modulus of elasticity of the carrier chip (20). The carrier chip (20) has at least two independent and longitudinal grooves (80a, 80b) between which the sensor element (30a, 30b) is arranged. The pressure sensor has a bias voltage circuit (40) and is used in a common rail injection system.
    Type: Grant
    Filed: March 23, 2016
    Date of Patent: February 25, 2020
    Assignee: Micronas GmbH
    Inventor: Marc Baumann
  • Patent number: 10564003
    Abstract: A measuring system for determining an angle of rotation of a shaft, which is rotatable about an axis of rotation, having a magnetically conductive encoder, which is spaced from the axis of rotation and fixedly connected to the shaft, a magnet unit with a permanent magnet, and an intermediate sensor unit having two magnetic field sensors. The permanent magnet has a magnetization extending parallel to the axis of rotation, and a circular-cylindrical recess having a bottom, an axis of symmetry extending perpendicular to the bottom, and a diameter, the sensor unit being completely arranged within the recess and stationary with respect to the permanent magnet. The first distance of the encoder from the axis of rotation being less than half the diameter of the recess, the encoder being arranged in a direction parallel to the axis of rotation at a second distance from the sensor unit.
    Type: Grant
    Filed: March 30, 2018
    Date of Patent: February 18, 2020
    Assignee: TDK-Micronas GmbH
    Inventor: Yan Bondar
  • Patent number: 10564005
    Abstract: A position determining sensor unit having a number of sensors arranged at predetermined positions along a path, and a transducer. The transducer has a first end which is moveable at least along the entire path, and a length running parallel to the path. Each sensor has a first supply voltage connection, a second supply voltage connection and a switching output, and wherein the switching output is switched into an On-state or an Off-state as a function of the threshold value of a sensor signal being exceeded or undershot. The supply voltage connection of each sensor is connected to a supply voltage, and a first sensor is arranged at a beginning of the path and a last sensor is arranged at an end of the path so that the second supply voltage connection of the first sensor is connected to a reference potential and the first sensor has a power consumption.
    Type: Grant
    Filed: March 3, 2017
    Date of Patent: February 18, 2020
    Assignee: TDK-Micronas GmbH
    Inventors: Joerg Franke, Klaus Heberle
  • Patent number: 10496778
    Abstract: A method for increasing the decoupling capacitance in a microelectronic circuit. The method comprises producing a circuit design of the microelectronic circuit, analyzing the produced circuit design, and subsequently filling gaps in the circuit design by cells with decoupling capacitor.
    Type: Grant
    Filed: June 20, 2017
    Date of Patent: December 3, 2019
    Assignee: TDK—Micronas GmbH
    Inventors: Nathalie Schwarz, Jens Mayer
  • Patent number: 10473733
    Abstract: Magnetic field compensation device having a first bar-shaped flux concentrator and a second bar-shaped flux concentrator, wherein the first flux concentrator and the second flux concentrator are separated from one another in a y-direction, and the longitudinal axis of the first flux concentrator and the longitudinal axis of the second flux concentrator are arranged to be substantially parallel to one another. A control unit is in an operative electrical connection with the magnetic field sensor and the compensating coil, and the control unit is equipped to control the compensating current through the compensating coil using a measured signal from the magnetic field sensor in such a manner that, for an external magnetic field formed in the x-direction at the location of the magnetic field sensor, the magnetic field is substantially compensated.
    Type: Grant
    Filed: July 11, 2017
    Date of Patent: November 12, 2019
    Assignee: TDK-Micronas GmbH
    Inventor: Joerg Franke