Abstract: The invention relates to an electronic component including a leadframe, composed of a platform, and possibly at least one electrical connecting piece, wherein at least one electronic member is located on the platform, and including a housing that encloses the electronic member and the platform, wherein at least one support region is provided to support the platform during the fabrication process for the housing, and wherein at least a section of the at least one support region projects from the housing.

Abstract: A hall effect sensor device implemented on a semiconductor body, having a first Hall effect sensor and a second Hall effect sensor, each of the two Hall effect sensors has at least four individual Hall effect elements and the four Hall effect elements are connected in series, and each Hall effect element has three contact terminals arranged in a row, and the series connection is implemented through a coupling or interconnection of the two outer contact terminals. Semiconductor well regions of the individual Hall effect elements are separated from one another, and the first Hall effect sensor and the second Hall effect sensor are connected in parallel, whereby a middle contact terminal of a Hall effect element of the first Hall effect sensor is connected in each case with a middle contact terminal of a Hall effect element of the second Hall effect sensor.

Abstract: A contact device system having a plate-shaped carrier and at least five accommodating areas are disposed on a bottom side of the pressing unit, at least five accommodating areas and at least five contact area pairs are disposed on a top side of the carrier. The contact area pairs each have a first and second electrically conductive contact area, and in each case the first contact area is spaced apart from the second contact area and insulated electrically therefrom. The first and second contact areas have a functional electrical connection to an evaluation circuit via a trace section. The carrier has a plurality of accommodating areas for a packaged electronic component, that each have one of the at least five contact area pairs. The electronic components have at least two terminal contacts, whereby after accommodation of the packaged electronic components, the terminal contacts of the particular component are pressed down.

Abstract: A climate chamber for measuring electronic circuits, having a housing that includes an interior space and an opening. The interior space is at least thermally insulated from the surroundings by the housing. Two movable jaws each have an end face. An interior space in a region of an opening is distanced from the surroundings according to the thickness of the jaws, and the jaws each comprise a thermal insulation layer, and each jaw has a front side facing the surroundings and a back side facing the interior space. The two jaws are spaced apart by a clear width being formed between the two end faces, so that the circuits disposed on a carrier can be introduced into the climate chamber and in a second state, the opening for the protection of the interior space is sealed against ambient conditions.

Abstract: A magnetic field measuring device having a first semiconductor body having a surface formed in a first x-y plane, the first semiconductor body having on the surface two magnetic field sensors which are spaced apart and arranged along a first connecting line, and wherein the magnetic field sensors respectively measure a z-component of a magnetic field, and the x-direction and the y-direction and the z-direction are each formed orthogonally to each other. A first magnet is provided with a planar main extension surface formed in a second x-y plane and with a symmetry surface formed in an x-z plane, wherein the direction of magnetization extends substantially or exactly parallel to the main extension surface and substantially or exactly parallel to the plane of symmetry. The first semiconductor body and the first magnet are rigidly fixed to each other.

Abstract: The present invention pertains to a fuel cell with a storage unit (4) for storing hydrogen (Hx), with a proton conductive layer, which covers a surface of the storage unit (4), and with a cathode (7) on a side of the proton conductive layer, which side is located opposite, wherein the storage unit (4) is directly coupled with an anode and/or the storage unit (4) is incorporated in a substrate (1) of a semiconductor. The storage unit (4) is preferably connected to the substrate (1) at least via a stress compensation layer (3).

Abstract: A magnetic field measuring device having a first semiconductor body having a surface formed in a first x-y plane, the first semiconductor body having on the surface two magnetic field sensors which are spaced apart and arranged along a first connecting line, and wherein the magnetic field sensors respectively measure a z-component of a magnetic field, and the x-direction and the y-direction and the z-direction are each formed orthogonally to each other. A first magnet is provided with a planar main extension surface formed in a second x-y plane and with a symmetry surface formed in an x-z plane, wherein the direction of magnetization extends substantially or exactly parallel to the main extension surface and substantially or exactly parallel to the plane of symmetry. The first semiconductor body and the first magnet are rigidly fixed to each other.

Abstract: Method for a deterministic selection of a sensor from a plurality of sensors, having a control unit and multiple sensors connected to the control unit by means of a three-wire bus, wherein the sensors are connected parallel to one another at a three-wire bus by at least two lines and a protocol frame according to SENT specification is used between the control unit and the sensors for a data exchange, and within the protocol frame a specified sensor is selected from a plurality of sensors by means of a selection signal sent by the control unit, wherein each sensor is associated with an unambiguous number of pulses for the selection of the sensor, and the selection of the sensor is performed by means of the selection signal having a predetermined number of pulses occurring immediately in succession.

Abstract: A measuring system having a magnetic device for generating a magnetic field and having a magnetic field sensor for detecting a flux density of the magnetic field at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device has at least two main poles for generating a main magnetic field and at least two secondary poles for generating a secondary magnetic field. The magnetic field in the magnetic field sensor is formed by superposition of the main magnetic field and the secondary magnetic field. The magnetic field sensor is designed to measure the flux density of the superposition in the first spatial direction, and, in the magnetic field sensor, the secondary magnetic field compensates at least partially the main magnetic field in the first spatial direction.

Abstract: A layer system having a layer region, whereby the layer region has a single-crystal silicon substrate with a front side and a back side, and whereby a textured surface is formed on the front side and the textured surface has a topography with different heights and a thin film layer of a metal oxide and/or an oxide ceramic is formed on the textured surface, whereby the thin film layer covers the textured surface only partially.

Abstract: A three-dimensional Hall sensor can be used for detecting a spatial magnetic field. A method for measuring a spatial magnetic field can be performed using this Hall sensor. The Hall sensor comprises an electrically conducting base body and at least three electrode pairs, wherein each electrode pair has a first terminal and a second terminal, which are arranged such on the base body, that a current can flow from the first terminal to the second terminal through the base body. At least three first terminals are arranged on a first surface of the base body and at least three second terminals are arranged on the second surface, different from the first surface of the base body, wherein the first and the second surfaces oppose each other.

Abstract: A measuring system, having a magnetic device for generating a magnetic field and having a magnetic field sensor with a sensor surface for detecting a flux density of the magnetic field penetrating the sensor surface at least in a first spatial direction, whereby the magnetic field sensor is fixedly positioned relative to the magnetic device. The magnetic device can have at least one permanent magnet and a flux concentrator made of a ferromagnetic material. The permanent magnet has at least two pole surfaces and an outer surface. The flux concentrator can have a smaller dimensions than the outer surface of the permanent magnet. The flux concentrator can be positioned within the outer surface of the permanent magnet and the flux concentrator and the permanent magnet can have a magnetic force closure.

Abstract: A layer system having a layer region whereby the layer region has a single-crystal silicon substrate with a front side and a back side, and whereby a textured surface is formed on the front side and the textured surface has a topography with different heights and a thin film layer of a metal oxide and/or an oxide ceramic is formed on the textured surface, whereby the thin film layer covers the textured surface.

Abstract: Method for a deterministic selection of a sensor from a plurality of sensors, having a control unit and multiple sensors connected to the control unit by means of a three-wire bus, wherein the sensors are connected parallel to one another at a three-wire bus by at least two lines and a protocol frame according to SENT specification is used between the control unit and the sensors for a data exchange, and within the protocol frame a specified sensor is selected from a plurality of sensors by means of a selection signal sent by the control unit, wherein each sensor is associated with an unambiguous number of pulses for the selection of the sensor, and the selection of the sensor is performed by means of the selection signal having a predetermined number of pulses occurring immediately in succession.

Abstract: A bridge circuit with improved fail-safety, having a first electrical load with a first contact terminal and a second contact terminal, and a first series circuit connected to a first node and to a second node. A second series circuit is connected to a third node and to a fourth node. A third series circuit is connected to the second node and to a fifth node. A fourth series circuit is connected to the fourth node and to a sixth node. The first node and the third node are connected to a supply voltage, and the fifth node and the sixth node are connected to a reference voltage, and the first contact terminal is connected to the second node and the second contact terminal is connected to the fourth node.

Abstract: A method for determining an angle of rotation between a sensor array and a magnetic field of a magnet, whereby the magnetic field is formed substantially parallel and perpendicular to the rotation axis, and the magnet is arranged rotationally symmetric relative to the rotation axis. A first measurement signal and a second measurement signal are generated by the two subsensors of the first magnetic field sensor unit, and the first measurement signal is assigned a first relation and the second measurement signal is assigned a second relation. A third measurement signal and a fourth measurement signal are generated by the two subsensors of the second magnetic field sensor unit, whereby the third measurement signal is assigned a third relation and the fourth measurement signal is assigned a fourth relation. The angle of rotation is then determined.

Abstract: A method for testing a CMOS transistor with an electrical testing unit, the CMOS transistor being formed in a semiconductor substrate of a semiconductor wafer. A plurality of CMOS transistors are formed on the semiconductor wafer and the electrical testing unit has a support plate and a metal layer formed on the support plate. The CMOS transistor having a first terminal contact, a second terminal contact and a third terminal contact, the second terminal contact configured as an electrically open control contact and in a process step the metal layer is positioned above the semiconductor wafer over the control contact and a potential difference between the first terminal contact and a third terminal contact is generated. The control contact is capacitively coupled by applying a drive potential to the metal layer, and the function of the CMOS transistor is tested by measuring an electrical variable dependent on the capacitive coupling.

Abstract: An IC package having a semiconductor body that includes a monolithically integrated circuit and at least two metallic contact surfaces. The integrated circuit being connected to the two electrical contact surfaces via printed conductors, and being disposed on a carrier substrate and connected to the carrier substrate in a force-fitting manner. The carrier substrate including at least two terminal contacts that are connected to the two contact surfaces. The semiconductor body and the carrier substrate being covered by a casting compound forming one part of the IC package. A section of each of the two terminal contacts penetrating the IC package. The two terminal contacts being disposed on the carrier substrate, and each terminal contact and the carrier substrate disposed beneath the particular terminal contacts having a hole-like formation. The particular hole-like formation being designed as a through-connection for providing an electrical connection to another electrical component.

Abstract: A method for increasing a reliability of transducers having a first IC and a second IC, each has a sensor and a signal output and a signal input and a comparator, and a sensor signal generated as a function of the physical quantity sensed by the relevant sensor is applied to the respective signal outputs. The signal outputs are each connected to a first input of the comparator, and the signal inputs are each connected to a second input of the comparator. The two ICs can be integrated into a common IC package, and the signal output of the first IC is connected to the first input of the comparator on the first IC and to the signal input of the second IC and to a first contact area passing through the IC package.

Abstract: A measuring system having a first magnetic field sensor, a second magnetic field sensor, a third magnetic field sensor, an encoder, and an evaluation circuit to which the first magnetic field sensor, the second magnetic field sensor, and the third magnetic field sensor are connected. The evaluation circuit is configured to determine the position of the encoder based on a first measurement signal of the first magnetic field sensor and a second measurement signal of the second magnetic field sensor and a third measurement signal of the third magnetic field sensor.