Abstract: A pattern generator includes: a writing tool and a calibration system. The writing tool is configured to generate a pattern on a workpiece arranged on a stage. The calibration system is configured to determine a correlation between a coordinate system of the writing tool and a coordinate system of a calibration plate on one of the stage and the workpiece. The calibration system is also configured to determine the correlation at least partly based on an optical correlation signal, or pattern, in a form of at least one optical beam being reflected from at least one reflective pattern on the surface of the calibration plate.

Abstract: The technology disclosed relates to patterning of flexible substrate. One implementation can be applied for production of flexible displays and other electronic devices on flexible substrates. The substrate may be plastic film typically 50-150 microns thick and the size of the pattern features may typically be in the range 1-10 microns across. Larger and smaller structures are possible. The patterning is done by means of optical exposure, either by exposure of a photosensitive resist or lacquer, or by other thermal or photochemical interaction between the light and the substrate. The substrate may typically be loaded as a roll and after exposure and other processing it may be rolled up on a second output roll, so called roll-to-roll (R-to-R) processing.

Abstract: A method for patterning a workpiece in a direct write machine in the manufacturing of a multilayer stack, wherein a first circuit pattern comprising patterns for connection points is transformed according to determined fitting tolerances to fit to connection points of a second circuit pattern and to circuit pattern(s) of specific features such as random placed dies, or group of dies, on or in the workpiece. The second layer may be a previously formed layer or a layer to be formed on the same workpiece or on a different workpiece for the stack. Pattern data associated with selected die is transformed into adjusted circuit pattern data using the transformation defined by the transformed positions such that the circuit pattern is fitted to the selected die(s).

Abstract: A method of patterning a plurality of layers of a work piece in a series of write machines, wherein errors due to different transformation capabilities of different machines are compensated by distributing the errors over the plurality of layers.

Abstract: A pattern generator includes: a writing tool and a calibration system. The writing tool is configured to generate a pattern on a workpiece arranged on a stage. The calibration system is configured to determine a correlation between a coordinate system of the writing tool and a coordinate system of a calibration plate on one of the stage and the workpiece. The calibration system is also configured to determine the correlation at least partly based on an optical correlation signal, or pattern, in a form of at least one optical beam being reflected from at least one reflective pattern on the surface of the calibration plate.

Abstract: The technology disclosed relates to scanning of large flat substrates for reading and writing images. Examples are flat panel displays, PCB's and photovoltaic panels. Reading and writing is to be understood in a broad sense: reading may mean microscopy, inspection, metrology, spectroscopy, interferometry, scatterometry, etc. of a large workpiece, and writing may mean exposing a photoresist, annealing by optical heating, ablating, or creating any other change to the surface by an optical beam. In particular, we disclose a technology that uses a rotating or swinging arm that describes an arc across a workpiece as it scans, instead of following a traditional straight-line motion.

Abstract: A method for patterning a second layer of a work piece in a direct write machine in the manufacturing of a multilayer system-in-package stack. The work piece having a first layer with a plurality of electrical components in the form of dies arbitrarily placed. Each component having connection points where some need to be connected between the components. A first pattern wherein different zones comprising connection points of dies distributed in the first layer are associated with different requirements on alignment. The method comprising the steps of: a. Detecting sacred zones in first pattern that have a high requirement on alignment to selected features of the system-in-package stack or to the placed components; b. Detecting stretch zones of the first pattern that are allowed to have a lower requirement on alignment to other features of the system-in-package stack; c.

Abstract: The current invention relates to writing or reading a pattern on a surface, such as in microlithography or inspection of mircrolithographic patterns. In particular, Applicant discloses systems recording or reading images by scanning sparse 2D point arrays or grids across the surface, e.g., multiple optical, electron or particle beams modulated in parallel. The scanning and repeated reading or writing creates a dense pixel or spot grid on the workpiece. The grid may be created by various arrays: arrays of light sources, e.g., laser or LED arrays, by lenslet arrays where each lenslet has its own modulator, by aperture plates for particle beams, or arrays of near-field emitters or mechanical probes. For reading systems, the point grid may be created by a sparse point matrix illumination and/or a detector array where each detector element sees only one spot. The idea behind the use of large arrays is to improve throughput.

Abstract: A lithographic workpiece processing tool includes a loading area for loading a workpiece; and a processing area for processing a workpiece. The workpiece processing tool further includes a multi-table system arranged between the loading area and the processing area. The multi-table system includes at least two tables configured to pass each other while moving between the loading area and the processing area. Each of the at least two tables is configured to hold a workpiece.

Abstract: A pattern generation system includes an optical system and a rotor. The optical system is configured to project a laser image onto an optical scanner. The rotor has a plurality of optical arms arranged at a first angle relative to one another, and further includes the optical scanner. The laser image is sequentially reflected by the optical scanner into each of the plurality of optical arms of the rotor to generate a pattern on a workpiece.

Abstract: In general, one aspect of the technology described can be embodied in methods that include the action of applying a writing mechanism having non-isotropic writing properties resulting from different degrees of coherence interaction in a sweep direction and a cross-sweep direction, writing an image pattern twice on a work piece using the writing mechanism rotated relative to the image pattern written on the workpiece between first and second writings, whereby writing with the rotated writing mechanism averages the non-isotropic properties. The lesser included angle separating first and second relative directions of movement between a workpiece and writing mechanism may be 20 degrees or greater, or somewhat less, under conditions described herein.

Abstract: In a measurement device for measuring a peripheral position in a Cartesian coordinate system, a rotating laser source is configured to emit a laser beam along a radius of a rotator. A reflector is configured to reflect the laser beam in a direction orthogonal to a path of the laser beam, and a scale having a pattern of transparent and reflective areas is positioned at a peripheral position of the measurement device. A detector is configured to provide a sequence of pulses by detecting a reflex or transmission of the rotating laser beam while the laser scans over the scale. The sequence of pulses correspond to Cartesian coordinates of the system.

Abstract: The technology disclosed relates to improved acousto-optic deflectors (AODs). In particular, it relates to compensation for subtle effects not previously addressed by AOD designers. A shifting center of gravity is described and addressed using advanced power equalisation strategies. Denser writing brushes are provided by using a two-dimensional array of beams with corrections for factors such as angle of incidence at the AOD interface. The compensation and dense brush features can be used separately or in combination.

Abstract: The technology disclosed relates to improved acousto-optic deflectors (AODs). In particular, it relates to compensation for subtle effects not previously addressed by AOD designers. A shifting center of gravity is described and addressed using advanced power equalisation strategies. Denser writing brushes are provided by using a two-dimensional array of beams with corrections for factors such as angle of incidence at the AOD interface.

Abstract: The technology described applies an extended frequency range of over one octave to drive an acousto-optic deflector, thereby defying a design rule of thumb that limited bandwidth to just under one octave. A combination of extended frequency range and well-timed beam blanking reduces the proportion of a so-called chirp signal that is consumed by beam blanking. This increases the working, effective portion of the sweep signal.

Abstract: The invention addresses the lack of comprehensive and quantitative methods for measurements of unwanted visual “mura” effects in displays and image sensors. Mura is generated by errors that are significantly smaller than what is needed for the function of the device, and sometimes smaller than the random variations in the patterns or structures. Capturing essentially all mura defects in a workpiece in a short time requires a daunting combination of sensitivity, statistical data reduction and speed. The invention devices an inspection method, e.g. optical, which maximizes the sensitivity to mura effects and suppresses artifacts from the mura inspection hardware itself and from noise. It does so by scanning the sensor, e.g. a high-resolution camera, creating a region of high internal accuracy across the mura effects. One important example is for mura related to placement errors, where a stage with better than 10 nanometer precision within a 100 mm range is created.

Abstract: An array of phase-shifting micro-mechanical elements are used in a method and device for patterning a workpiece, for exposing a radiation sensitive layer on a workpiece such as a mask or a device substrate. The phase-shifting micro-mechanical elements are individually driven to modulate the electromagnetic radiation such that a high degree of control and precision in patterning is achieved. In some embodiments, the motion of the workpiece is synchronized with the relayed electromagnetic radiation that is modulated by the phase-shifting micro-mechanical elements in order to further control and increase precision in the patterning of the workpiece.

Abstract: A pick-and-place tool configured to pick and place at least one die on a workpiece includes a mounting head. The mounting head includes a die position determining unit configured to one of measure and detect an actual position of at least one die during a time between the placement of the at least one die on the workpiece and the picking up of a subsequent die for placement on the workpiece.

Abstract: Methods and apparatuses for patterning workpieces are provided. The methods and apparatuses described herein improve overlay between subsequently patterned layers on a workpiece by introducing an improved alignment method that compensates for workpiece distortions.

Abstract: In a method for generating a pattern on a workpiece having at least one die placed thereon, positions of the at least one die and at least two global alignment marks on the workpiece are measured, pattern adjustment data is generated, pattern image data associated with the pattern to be written is adjusted based on the generated pattern adjustment data, and the pattern is generated on the workpiece based on the modified pattern adjustment data.