Abstract: A valve assembly is configured to regulate the flow of an isolated fluid therethrough and includes a first valve stage configured to control the flow of a first fluid through a first fluid circuit, and a second valve stage configured to control the flow of a second fluid through a second fluid circuit. The first valve stage is connected to the second valve stage such that the first fluid acts on the second valve stage to move the second valve stage between open and closed positions. The second fluid flowing through the second valve stage is also isolated from the first fluid flowing through the first valve stage.

Abstract: An adjustable shock absorber includes a housing defining an enclosed working space. A wall is formed in the working space and separates the working space into first and second fluid chambers. A compression valve is formed in the wall and a microvalve is attached to the compression valve and is operable to control fluid flow through the compression valve.

Abstract: A plate is adapted for use in a microvalve and includes a displaceable member configured for movement between a closed position, wherein the displaceable member prevents fluid communication through the microvalve, and an opened position, wherein the displaceable member does not prevent fluid communication through the microvalve. The displaceable member includes an elongated arm portion, a plurality of actuator ribs connected through a central spine to the elongated arm portion, and a hinge portion. The actuator ribs have a first portion and a second portion, the first portion having a first end and a second end, the second end of the first portion connected to the central spine, the second portion having a first end and a second end, the second end of the second portion connected to the central spine. A channel is formed in the plate. A plurality of elongated openings are formed in the plate and define the actuator ribs, each elongated opening having longitudinally extending side edges.

Abstract: A microvalve includes a first plate having a surface, a recessed region provided within the surface, a fluid port provided within the recessed region, and a sealing structure extending about the fluid port. A second plate defines a non-movable portion and a movable portion formed within the first opening and having an axis. A surface of the non-movable portion abuts the surface of the first plate, the non-movable portion having first and second openings formed therethrough. The first opening has a notch formed in each of two longitudinally extending side walls thereof. The movable portion defines a displaceable member connected to the non-movable portion by a convoluted spring formed in a second opening. The displaceable member has a tab extending outwardly from each of two longitudinally extending side walls thereof, each tab positioned within one of the notches.

Abstract: A microvalve includes a first plate having an inner surface, a recessed region provided within the inner surface, a normally open fluid port and a normally closed fluid port provided within the recessed region. A first sealing structure extends about the normally open fluid port, and a second sealing structure extends about the normally closed fluid port. A second plate defines a non-movable portion and a movable portion. A surface of the non-movable portion abuts the inner surface of the first plate, the non-movable portion having an opening formed therethrough. The movable portion is formed within the opening, has an axis, and defines a displaceable member connected to the non-movable portion by a convoluted spring formed in the opening.

Abstract: A microvalve includes a first plate having a surface, a recessed region provided within the surface, a fluid port provided within the recessed region, and a sealing structure extending about the fluid port. A second plate defines a non-movable portion and a movable portion, a surface of the non-movable portion abutting the surface of the first plate, the non-movable portion having first and second openings formed therethrough. The movable portion is formed within the first opening and has an axis, the movable portion defining a displaceable member connected to the non-movable portion by a convoluted spring formed in a second opening.

Abstract: A method of cleaning contaminants, including particulate contaminants, from a valve in a fluid system includes moving a valve flow control element of the valve from a first position to a second position in response to a change in a condition in the fluid system other than a change in superheat.

Abstract: A method of controlling a Micro-Electro-Mechanical System (MEMS) valve includes defining a desired pressure output for the MEMS valve. The desired pressure output is related to a control reference value. The control reference value relates an output pressure of the MEMS valve to a measurable characteristic of the MEMS valve. The measurable characteristic may include a resistance, an electrical power, or an electrical current of the MEMS valve. The control reference value is converted to an initial Pulse Width Modulated (PWM) signal that is applied to the MEMS valve. The initial PWM signal may be adjusted to define an adjusted PWM signal based upon a difference between an actual value of the measurable characteristic at the initial PWM signal and the control reference value, until the actual value of the measurable characteristic at the adjusted PWM signal is within a pre-defined range of the control reference value.

Abstract: A method of manufacturing a MEMS package includes initially providing a substrate formed of a first material and defining a bore therein. The bore is substantially completely lined with a second material that is different from the first material. A micromachined component having a fluid passageway formed therein is affixed to the substrate such that the bore and the fluid passageway are in fluid communication.

Abstract: A method to prevent movable structures within a MEMS device, and more specifically, in recesses having one or more dimension in the micrometer range or smaller (i.e., smaller than about 10 microns) from being inadvertently bonded to non-moving structures during a bonding process. The method includes surface preparation of silicon both structurally and chemically to aid in preventing moving structures from bonding to adjacent surfaces during bonding, including during high force, high temperature fusion bonding.

Abstract: A pilot-operated spool valve includes a body defining a bore. A supply port and a load port are in fluid communication with the bore. A spool is disposed in the longitudinal bore, and the spool and the body cooperate to define a command chamber at a first end of the spool, which command chamber is adapted to receive fluid at a command pressure supplied to the body. The spool is movable in the bore to control fluid communication between the supply port and the load port. A pressure space is defined in at least one of the body and the spool between the command chamber and both of the supply port and the load port in all operative positions of the spool. The pressure space is supplied with pressurized fluid such that leakage from the command chamber is minimized or eliminated.

Abstract: A controller device and a method for controlling a system that utilizes an adaptive mechanism to self-learn the system characteristics and incorporates this adaptive self-learning ability to predict a control parameter correctly to provide precise control of a system component.

Abstract: A non-abrading method to facilitate bonding of semiconductor components, such as silicon wafers, that have micro structural defects in a bonding interface surface. In a preferred method, micro structural defects are removed by forming an oxide layer on the bonding interface surface to a depth below the level of the defect, and then removing the oxide layer to expose a satisfactory surface for bonding, thereby increasing line yield and reducing scrap triggers in fabrication facilities.

Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.

Abstract: A system for controlling one or more structural appliances, such heating, cooling, and ventilation sensor systems utilizing cloud computing architecture, includes at least one intelligent controller, a local intelligent gateway in communication with the intelligent controller, and a cloud computing network in communication with the local intelligent gateway. A local device is operative to communicate through the cloud computing network to the intelligent controller.

Abstract: A microvalve device includes a body, a valve element supported for movement relative to the body, and an actuator operatively coupled to the valve element for moving the valve element in a normal range of travel. A travel limiting structure operatively cooperates with at least one of the valve element and the actuator to effectively limit the magnitude of movement of the valve element or the actuator outside the normal range of travel to prevent failure of the body, the valve element, or the actuator due to exceeding failure stress limits. A method of forming a microvalve with such a travel limiting structure is also disclosed.

Abstract: A heat exchanger structure including multiple fluid circuits, through which respective streams of a first fluid pass from a stream inlet to a stream outlet to transfer heat to or from a second medium. The fluid circuits are arranged into at least a first group and a second group, at least the first group consisting essentially of only fluid circuits that perform substantially similarly according to at least one selected performance criterion. A control sensor for at least the first group generates a signal representative of a parameter of the first fluid in the associated group. A valve for at least the first group is in fluid communication with of all the streams of the associated group so as to be able to control the flow of fluid through the streams of the associated group in parallel.

Abstract: A device has been disclosed that may include a spool valve including a body having a first connector and a second connector and a spool movable relative to the body for controlling flow between the first connector and the second connector. The reversible flow control assembly further may include a pilot valve device developing a single pressure command in the form of a fluid at a command pressure. The spool valve may be responsive to the single pressure command developed in said pilot valve device to control flow between the first connector and the second connector without regard to the direction of flow. The majority of axial forces acting on the spool to position the spool relative to the body when fluid is flowing through the valve may be fluid forces.

Abstract: A superheat sensor includes a housing, a pressure sensor mounted within the housing, a temperature sensor that is integrated to the pressure sensor, and/or is external to the pressure sensor, a fluid passageway connecting the pressure sensor to a source of superheat fluid, and a processor.

Abstract: A method of bonding an electrical component to a substrate includes applying solder paste on to a substrate. Solder preform has an aperture is formed therethrough and is then urged into contact with the solder paste, such that solder paste is urged through the aperture. An electrical component is then urged into contact with the solder preform and into contact with the solder paste that has been urged through the aperture, thereby bonding the electrical component, the solder preform, and the substrate together to define a reflow subassembly.