Abstract: A polycarbonate resin having a high refractive index, a low Abbe number and a high moisture and heat resistance is provided. In an embodiment, a polycarbonate resin including a structural unit represented by general formula (1) below is provided.
Abstract: A resin composition containing a bismaleimide compound (A) containing a constituent unit represented by the following formula (1) and maleimide groups at both ends of the molecular chain, a radical polymerizable resin or compound (B) other than the bismaleimide compound (A), and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) contains at least one selected from the group consisting of a citraconimide group, a vinyl group, a maleimide group, a (meth)acryloyl group and an allyl group.
Abstract: An object of the present invention is to provide a method for producing m-dialkylbenzaldehyde by using a reaction starting material containing 1,4-dialkylbenzene. The method for producing m-dialkylbenzaldehyde represented by formula (3), comprising a step of allowing carbon monoxide to react on a reaction starting material containing 1,4-dialkylbenzene represented by formula (1) in the presence of a Bronsted acid and a Lewis acid, wherein the reaction starting material is 1,4-dialkylbenzene represented by formula (1), or a mixture of 1,4-dialkylbenzene represented by formula (1) and 1,3-dialkylbenzene represented by formula (2), containing 10 mol % or more of the 1,4-dialkylbenzene represented by formula (1), wherein in formulae (1) to (3), R1 represents a methyl group or an ethyl group, and R2 represents a chain or cyclic alkyl group having 3 or more and 6 or less carbon atoms that has a tertiary carbon at the benzyl position.
Abstract: A sheet formed from a carbon fiber reinforced thermoplastic resin with a simplified production process and excellent mechanical characteristics, and a production method of said sheet is provided. This sheet is formed from a carbon fiber reinforced thermoplastic resin that contains carbon fibers, dichloromethane, and a thermoplastic resin containing at least one of a polycarbonate resin and a polyarylate resin, and the content of the dichloromethane contained in the sheet is 10-10,000 ppm by mass.
Abstract: To provide a novel material that maintains suppleness which is the advantage of a material using fibers and has a low thermal shrinkage ratio, and a method for producing the material, a partially welded material using the material, a composite material, and a method for producing a molded product.
Abstract: A curable composition containing an alkenyl phenol A, an epoxy-modified silicone B, and an epoxy compound C other than the epoxy-modified silicone B.
Abstract: The present application provides: a polycarbonate resin which has heat resistance and is able to be produced using a starting material that is derived from natural products; and a monomer compound which enables the achievement of this resin. A polycarbonate resin which includes a constituent unit represented by general formula (1); a monomer compound which enables the achievement of this resin; and a polycarbonate resin which includes a constituent unit represented by general formula (1) and a constituent unit represented by general formula (2).
Abstract: The present invention provides a method for producing an oxymethylene copolymer resin composition, comprising: adding to an oxymethylene copolymer (A), an Mn micromole of an amine-substituted triazine compound (B) per gram of the oxymethylene copolymer (A), an Mc micromole of a choline hydroxide (C) per gram of the oxymethylene copolymer (A), and 0.05 to 1.1 parts by weight of an antioxidant (D) with respect to 100 parts by weight of the oxymethylene copolymer (A), and melt kneading a mixture of the oxymethylene copolymer (A), amine-substituted triazine compound (B), the choline hydroxide (C), and the antioxidant (D), wherein Mn (?mol/g-POM) and Mc (?mol/g-POM) satisfy: 6.5<(Mn+Mc×8)<25, 0.5<Mn<7.0, and 0.0<Mc.
Abstract: A method for producing an LGPS-type solid electrolyte can be provided, the method includes preparing a homogeneous solution by mixing and reacting Li2S and P2S5 in an organic solution such that the molar ratio of Li2S/P2S5 is 1.0-1.85; forming a precipitate by adding, to the homogeneous solution, at least one MS2 (M is selected from the group consisting of Ge, Si, and Sn) and Li2S and then mixing; obtaining a precursor by removing the organic solution from the precipitate; and obtaining the LGPS-type solid electrolyte by heating the precursor at 200-700° C.
Type:
Grant
Filed:
August 16, 2018
Date of Patent:
November 1, 2022
Assignee:
MITSUBISHI GAS CHEMICAL COMPANY, INC.
Inventors:
Aki Katori, Tomohiro Ito, Masahiro Shimada, Kotaro Kawakami
Abstract: A fragrance composition comprising a compound represented by Formula (1) as an active ingredient: wherein, in Formula (1), R1 represents a linear, branched, or cyclic alkyl group having 1 to 6 carbon atoms.
Abstract: A fragrance composition comprising a compound represented by Formula (1) as an active ingredient: wherein, in Formula (1), R1 represents a linear, branched, or cyclic alkyl group having 1 to 5 carbon atoms.
Abstract: The present application provides a film containing: a compound (A) containing at least one selected from the group consisting of a maleimide compound and a citraconimide compound; an organic peroxide (B) containing at least one selected from the group consisting of organic peroxides represented by specific formulae; and a hydroperoxide (C).
Abstract: A fragrance composition comprising a compound represented by Formula (1): wherein, in Formula (1), R represents a linear or branched alkyl group having from 2 to 3 carbon atoms or a cyclic alkyl group having from 3 to 6 carbon atoms.
Abstract: The present invention pertains to: a composition capable of removing dry etching residue present on the surface of a semiconductor integrated circuit, while suppressing alumina damage in a production process for the semiconductor integrated circuit; a cleaning method for semiconductor substrates that use alumina; and a production method for a semiconductor substrate having an alumina layer. This composition is characterized by containing 0.00005%-1% by mass of a barium compound (A) and 0.01%-20% by mass of a fluorine compound (B) and having a pH of 2.5-8.0.
Abstract: A flame-retardant polyimide molding material containing a semi-aromatic polyimide resin (A) and further containing 15 to 80 mass % of either of the following component (B1) or component (B2): (B1) graphite (B2) a combination of two or more selected from the group consisting of graphite, a fluorine resin, and carbon fiber; and a molded article including the same.
Abstract: Provided is a gas barrier packaging material including a base and a cured resin layer, the base having a surface constituted of an inorganic substance. The cured resin layer is a cured product of an epoxy resin composition including an epoxy resin, an epoxy resin curing agent containing an amine-based curing agent, and an acidic compound, and a ratio (basic nitrogen/acid groups) of a molar equivalent of basic nitrogen in the epoxy resin composition to a molar equivalent of acid groups derived from the acidic compound is from 0.60 to 20.
Abstract: A film containing: a propenyl group-containing resin (A) including, at an end of a molecule, a constituent unit represented by the following formula (1); a radical polymerizable resin or compound (B) other than the propenyl group-containing resin (A); and a curing accelerator (C), wherein the radical polymerizable resin or compound (B) includes at least one selected from the group consisting of a maleimide group and a citraconimide group. In the formula (1), —* represents a bonding hand.
Abstract: A production method for producing a 1,4-cyclohexanedicarboxylic acid derivative, involves subjecting an aqueous ammonia solution of 1,4-cyclohexanedicarboxylic acid to heat concentration, thereby precipitating a 1,4-cyclohexanedicarboxylic acid derivative as a crystal.