Abstract: The invention provides a polishing machine and a three-chambered polishing head structure and method that improves the polishing uniformity of a substrate across the entire surface of the substrate, particularly near the edge of the substrate that is particularly beneficial to improve the uniformity of semiconductor wafers during Chemical Mechanical Polishing (CMP). In one aspect, the invention provides a method of controlling the polishing pressure over annular regions of the substrate, such as a wafer, in a semiconductor wafer polishing machine.

Abstract: In a mounting mechanism for a pin mirror cutter 22, the cutter body 22 is mounted with its outer periphery inserted into the inner periphery of a cutter mounting portion. an inclined surface of a tapered portion 22 formed on the cutter body and an inclined surface of a tapered portion formed on the cutter mounting portion are in surface-contact with each other, and the diameters of the contact surfaces gradually decrease in the direction of insertion of the cutter body into the cutter mounting portion. Furthermore, these inclined surfaces and are formed by a plurality of flat surfaces so as to form regular octagonal pyramid surfaces.

Abstract: A method for producing cutting tools incorporated in the present invention is carried out as follows: a shank portion and a drill portion are formed separately such that the inner diameter of a hole made in the shank portion is slightly smaller than the outer diameter of the drill portion. The rear of the drill portion is forcibly inserted into the hole of the shank portion at normal temperature which is room temperature. The diameter of the inner wall of the hole is thereby enlarged, resulting in a tight fitting. After the insertion of the drill portion in the shank portion, the drill portion may be ground to form a drill edge. Before the insertion of the drill portion in the shank portion, the shank portion may be quenched under vacuum or the like, or the surface of the shank portion may be hardened by nitriding.

Abstract: A transistor on a silicon substrate is covered by an insulating layer. A conducting plug passes through the insulating layer to the transistor drain. The bottom electrode of a ferroelectric capacitor that directly overlies the plug and drain contacts the plug. The ferroelectric layer is self-patterned and completely overlies the memory cell. A self-patterned sacrificial layer completely overlies the ferroelectric layer. The bottom electrode of the capacitor is completely enclosed by the ferroelectric layer, the insulating layer, and the conducting plug.

Abstract: A stepping motor having high-precision torque formation and stepping angle is able to be produced at a low cost. Cylindrical elastic magnetic members, which cover a first and second set of yokes and have an inner diameter smaller than the outer diameter of the yokes, readily come in tight contact with the yokes and form strong magnetic circuits. The first and second sets of yokes are integrally formed into a bobbin through a nonmagnetic member. Pole teeth of the first set of yokes and pole teeth of the second set of yokes are arranged by shifting at a given angle to each other in the peripheral direction.

Abstract: An Ni-base heat resistant alloy, has a composition which contains, by weight, Cr: from 12.0 to 14.3%, Co: from 8.5 to 11.0%, Mo: from 1.0 to 3.5%, W: from 3.5 to 6.2%, Ta: from 3.0 to 5.5%, Al: from 3.5 to 4.5%, Ti: from 2.0 to 3.2%, C: from 0.04 to 0.12%, B: from 0.005 to 0.05%, and the balance substantially Ni and inevitable impurities. A large-size casting, as well as a large-size turbine blade, having a columnar crystalline Ni-base heat-resistant alloy formed from the Ni-base heat-resistant alloy, have sound cast surfaces and a sound internal structure.

Abstract: A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.

Abstract: A first photosensitive liquid solution is applied to a substrate, patterned through exposure to radiation and development, and annealed to form a desired solid material, such as SrBi.sub.2 Ta.sub.2 O.sub.9, that is incorporated into a component of an integrated circuit Fabrication processes are designed protect the self-patterned solid material from conventional IC processing and to protect the conventional materials, such as silicon, from elements in the self-patterned solid material. In one embodiment, a layer of bismuth oxide is formed on the SrBi.sub.2 Ta.sub.2 O.sub.9 and a silicon oxide hole is etched to the bismuth oxide. The bismuth oxide protects the SrBi.sub.2 Ta.sub.2 O.sub.9 from the etchant, and is reduced by the etchant to bismuth. Any remaining bismuth oxide and much of the bismuth are vaporized in the anneal, and the remaining bismuth is incorporated into the SrBi.sub.2 Ta.sub.2 O.sub.9.

Abstract: A motor drive control method and an apparatus therefor in a motor used in an adjusting device for adjusting a physical amount such as a temperature of a heat-generating member, wherein a load on a bearing of the motor caused by frequently repeating drive/stop of the motor can be reduced; thereby, prolonging the service life of the motor. The temperature of the heat-generating member is detected by a temperature detection sensor. A comparison calculating unit calculates a temperature change rate K.sub.n or the like in order to recognize the temperature of the heat-generating member and a change state (such as, a temperature change rate), and selects a rotating speed change characteristic appropriate for the change state at such time. An indication signal for changing the rotating speed of the motor on the basis of the selected characteristic is outputted to a motor control driver in order to perform drive control for the motor.

Abstract: An anti-theft tag for attachment to a theft-monitored article including a resonance circuit which resonates radio waves of a predetermined frequency transmitted from an antenna, and a shielding coil having at least two terminals. The shielding coil is disposed between the resonance circuit and the article when the anti-theft tag is attached to the article, and the at least two terminals are short-circuited.

Abstract: A fuel rod for a light water reactor comprises a cladding tube which comprises a zirconium alloy having a composition including 0.6 to 2.0% by weight of Nb, 0.5 to 1.5% by weight of Sn, 0.05 to 0.3% by weight of Fe, and the balance being Zr and incidental impurities; uranium oxide fuel pellets packed in the cladding tube; and end plugs comprising a zirconium alloy and closing both ends of the cladding tube. The cladding tube is sealed by TIG welding with the end plugs. Grain boundaries in each heat affected zone of the cladding tube, which are adjacent to a bead formed by TIG welding, have structural compositions including 4 to 30% by weight of Nb, and 0.9 to 20% by weight of Fe.

Abstract: A casting furnace for forming a large size turbine blade at a high casting rate using a casting alloy which has a single crystal structure or a columnar crystal structure, includes a main tank 2 in which a mold M is placed. A heater 6 heats the periphery of a mold M to a predetermined temperature. The heater is then vertically raised relative to the mold M while a cooling liquid metal immerses and cools the periphery of the heated mold M below the heater. The surface height of the cooling liquid metal is raised according to the rising of the heater.

Abstract: The present invention provides sputtering targets which are useful for depositing ferroelectric films and are resistant to crack generation during sputtering. The sputtering targets comprise a disk target which is formed using a sintered material including a compound oxide of Ba and Ti, Sr and Ti, or Ba, Sr and Ti, and which has a surface which has been subjected to grinding, wherein the scratches 4 formed on the surface of the disk target due to grinding have a pattern radiating from an arbitrary point on the plane of the surface of said disk target.

Abstract: An R--T--M alloy material, wherein R is at least one rare earth metal including Y, T is Fe or an Fe component partially replaced by Co or Ni, M is B or a B component partially replaced by C as primary components is prepared by heating the alloy at a temperature from room temperature to a specific temperature of less than 500.degree. C. in a non-oxidizing atmosphere and holding it at the given temperature, if necessary; performing hydrogenation by holding the alloy in a hydrogen atmosphere or a mixed gas atmosphere of hydrogen and an inert gas at a specific temperature in the range of 500-1,000.degree. C.; medial annealing the alloy by holding the R--T--M alloy after the hydrogenation step in an inert gas atmosphere at a specific temperature in the range of 500-1,000.degree. C.; and dehydrogenating the alloy by holding the alloy in a vacuum of less than 1 Torr for dehydrogenation, and then cooling the alloy.

Abstract: A semiconductor wafer chamfer polishing method for polishing chamfers formed on the edges of semiconductor wafers includes rotating a semiconductor wafer; pressing a polishing cloth against a chamfer of the semiconductor wafer with sufficient pressure to elastically deform the polishing cloth, while supplying polishing fluid to the chamfer; sliding the polishing cloth along an incline of the chamfer from an outer edge toward a center of the semiconductor wafer so as to form a bulge portion of the polishing cloth which contacts an outer surface of the semiconductor wafer, thereby polishing the outer surface along with the chamfer of the semiconductor wafer.

Abstract: To enable a rotary cutter to correspond to an automatic tool exchange apparatus by adjusting, in a peripheral direction, the position of a positioning member in response to an outlet of a chip container and a key and a key seat for receiving the key of a rotary cutter and a machine tool. A chip container having an outlet is mounted on the peripheral area of a cutter body with a bearing therebetween. An arbor of the cutter body is connected to a machine tool such that a key fits into a key seat, and at the same time a positioning pin of the chip container is inserted into a fitting recess of a spindle head. A movable block ring having the positioning pin is mounted on the chip container after adjusting in a peripheral direction, and is fastened with a bolt. Even when a key of the machine tool and a fitting recess differ in a peripheral direction, they can be adjusted. The relative position in a peripheral direction between the outlet of the chip container and the positioning pin can be adjusted.

Abstract: A coated carbide alloy cutting member is provided exhibiting excellent resistance against chipping, wherein the cutting member has a cemented carbide substrate and one or more hard coating layers including an aluminum oxide-based layer primarily of aluminum oxide, the hard coating layers having an average thickness of 3 to 20 .mu.m and being formed on the cemented carbide substrate by chemical and/or physical vapor deposition; and wherein the aluminum oxide-based layer contains 0.005 to 0.5 percent by weight of chlorine.

Abstract: The invention relates to a method and apparatus for removing nitrogen oxide from gas (exhaust gas) discharged, for example, in the steps of plating, washing with acids, dissolution, etc. The removing method comprises making a liquid capable of absorbing and removing nitrogen oxide adhered onto the surfaces of glass fibers followed by making a gas containing nitrogen oxide brought into contact with said glass fibers while making said nitrogen oxide absorbed by the liquid adhered onto the surfaces of said glass fibers to thereby remove said nitrogen oxide from said gas. According to this method, since a gas containing nitrogen oxide is brought into contact with a liquid capable of absorbing and removing nitrogen oxide from the gas, that has adhered on the surfaces of glass fibers, the nitrogen oxide is efficiently absorbed by said liquid and is therefore efficiently removed from said gas.

Abstract: The present invention relates to a method of cleaning wafers bonded on a fixing member in the form of an ingot, and then sliced by a wire saw from a direction perpendicular to the longitudinal dimension to form a row of wafers. The method includes: a cleaning process for cleaning the wafers bonded on the fixing member in the form of the row of wafers (workpiece W) by a cleaning mechanism; and a separating process includes: a softening step for softening an adhesive in a softening vessel; a first moving step for turning and moving a wafer in a planar direction using an end point of the glued portion of the wafer and the fixing member as the fulcrum; and a second moving step for further moving the wafer in a planar direction by a suction-cup rotary actuator to thereby bring the wafer out of the region of the row of wafers.

Abstract: An LC filter including a substrate having a magnetic and dielectric material. The LC filter includes inductors having two spiral structures arranged so that magnetic fluxes generated at the insides of the spiral structures are parallel and in mutually reverse directions. Also included are plane plate capacitors between the two spiral structures.