Patents Assigned to Mitsuboshi Diamond Industrial Co., Ltd.
  • Patent number: 8359756
    Abstract: An object is to scribe a small-sized substrate made of a brittle material with high workability. A plurality of brittle material-made substrates 107a to 107i are arranged on the table 106 while being positioned by their respective positioning pins 109. A recipe data table is prepared in advance for each of the brittle material-made substrates on an individual basis. On the basis of the recipe data table, the brittle material-made substrate and the scribing head are moved relatively to each other to perform inside scribing or outside scribing on each of the substrates. This makes it possible to subject a plurality of substrates to scribing operation at one time under automatic control.
    Type: Grant
    Filed: February 22, 2010
    Date of Patent: January 29, 2013
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventor: Masanobu Soyama
  • Patent number: 8348115
    Abstract: A vertical crack is generated at a desired position on a brittle material substrate S by making a wheel tip 5a of a glass cutter 5 move while being in contact with the substrate surface by a load which does not allow the wheel tip 5a to damage the surface, using an armature 6 applying an abrupt impact force for generating the vertical crack having a predetermined depth, to the glass cutter 5 moving on the substrate. A scribe line is formed as the vertical crack is urged to extend along a planned scribe line, due to a stress gradient exerted onto the vertical crack and occurring between a compressive stress in an irradiation area on the substrate at which a laser beam is irradiated from a laser beam oscillator 8 and a tensile stress in a cooling area made by a cooling medium released from a cooling nozzle 7.
    Type: Grant
    Filed: November 4, 2003
    Date of Patent: January 8, 2013
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventor: Haruo Wakayama
  • Patent number: 8324528
    Abstract: The present invention provides a manufacturing method for accurate, fine and efficient processing of a work piece to be processed and prevention of graphitization of the work piece to be processed, when sintered diamond is processed by a laser beam. The method provides process comprising steps of (a) irradiating outer circumference of a scribing wheel 2 with a laser beam from the side of the wheel, (b) moving the laser beam relative to the wheel 2, (c) forming continuously along the circumferential direction in the required space fine grooves with openings directed radially on a ridge site, (d) irradiating the laser beam onto the site to be processed at a speed of the laser beam relative to the work piece, and (e) forming the work piece into a minute shape within a depth of less than 200 ?m.
    Type: Grant
    Filed: February 2, 2006
    Date of Patent: December 4, 2012
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd
    Inventors: Mikio Kondo, Kazuhisa Kuriyama, Hiroshi Tomimori
  • Patent number: 8292142
    Abstract: A manual breaker for cutting sheet glass. The manual breaker includes a rotational shaft (6) that rotatably holds first and second arms (2) and (4). A sheet glass having a scribe line formed thereon in advance is pinched among rollers (24) and (45). When handles (20) and (40) are actuated to narrow a distance between rollers (24) and (45), the roller (45) moves in a Y-axis direction and an impact shaft (51) impacts the sheet glass, accordingly. The sheet glass can be thereby easily cut into pieces along the scribe line and a sectional quality having a smooth cut surface can be ensured for the sheet glass.
    Type: Grant
    Filed: June 16, 2008
    Date of Patent: October 23, 2012
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Hirotake Haraguchi, Kazuya Maekawa
  • Patent number: 8276796
    Abstract: A brittle material substrate cutting method and cutting apparatus are provided, which prevent cut faces of a brittle material substrate from contacting each other after the cutting in a break step of continuously cutting the brittle material substrate, so that a damage or contamination on the brittle material substrate due to the contact can be prevented.
    Type: Grant
    Filed: May 26, 2006
    Date of Patent: October 2, 2012
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Yuki Nishisaka, Kenji Otoda, Shuichi Inoue, Toru Kumagai
  • Publication number: 20120012632
    Abstract: A cutter with which a diagonal crack can be created without fail deeply within a brittle material substrate is provided. The cutter has such a form that two cones or truncated cones are joined through the same bottom so as to share the same rotational axis, and the circumference of the above described bottom is used as the blade edge ridge line. In addition, grooves that incline at a predetermined angle relative to the direction of the rotational axis are created around this blade edge ridge line at predetermined intervals. Furthermore, the angles between the sides of the above described two cones or truncated cones and the above described bottom are different from each other.
    Type: Application
    Filed: January 29, 2010
    Publication date: January 19, 2012
    Applicant: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Keisuke Tominaga, Kazuya Maekawa
  • Publication number: 20110232422
    Abstract: A scribing wheel for a brittle material includes a circumferential ridgeline in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridgeline. The protrusion are portions of the ridgeline remaining after the ridgeline is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability.
    Type: Application
    Filed: May 31, 2011
    Publication date: September 29, 2011
    Applicant: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Kazuya Maekawa, Haruo Wakayama
  • Patent number: 8011546
    Abstract: A separation apparatus comprising a first and a second scribing portions for scribing front and rear surfaces of a first mother substrate made of a brittle material along first predetermined scribing lines previously provided on the front and rear surfaces of the first mother substrate, the first and second scribing portions being opposed to each other on an upper side and a lower side, and a holding and transferring portions for holding and transferring the first mother substrate so that the first predetermined scribing lines of the first mother substrate are located between the first and second scribing portions.
    Type: Grant
    Filed: October 3, 2006
    Date of Patent: September 6, 2011
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Hiroki Ueyama, Akira Ejimatani
  • Patent number: 8006599
    Abstract: A scribing line forming mechanism according to the present invention includes: a scribing line forming means (207) being structured so as to form a scribing line on a substrate by contacting the substrate; and a supporting means for supporting the scribing line forming means such that the scribing line forming means is turnable about a first turning axis (204), the supporting means being structured so as to be turnable about a second turning axis (202), the second turning axis being different from the first turning axis, wherein the axial center of the first turning axis and the axial center of the second turning axis are approximately in parallel, and the axial center of the second turning axis is distant by a predetermined interval from a portion where the substrate and the scribing line forming means contact each other.
    Type: Grant
    Filed: December 28, 2004
    Date of Patent: August 30, 2011
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventor: Yoshitaka Nishio
  • Publication number: 20110167978
    Abstract: To be able to accurately adjust an angle using a simple operation when mounting a groove machining tool into a holder, there is provided a groove machining tool for use with a thin-film solar cell. The groove machining tool is retained by a holder, is caused to move together with the holder over a thin film of an integrated thin-film solar cell in one direction, and forms a groove on the thin film extending in one direction and has a tool body. The blade tip part is formed on a tip end of the tool body and has blade tips for machining grooves disposed at a tip end. An angle regulation unit is disposed on the tool body so that the blade tip part is fixed in a predetermined orientation with regard to the direction of formation of the groove when being retained by the holder.
    Type: Application
    Filed: December 29, 2010
    Publication date: July 14, 2011
    Applicant: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
    Inventor: Masanobu SOYAMA
  • Publication number: 20110167979
    Abstract: There is provided a groove machining tool supported in a holder and caused to move together with the holder in relative fashion along a scheduled scribe line over an integrated thin-film solar cell substrate to form a groove. The groove machining tool includes a tool body supported in the holder, and a blade tip part formed in a distal part of the tool body. The blade tip part includes a blade extending along a direction intersecting a direction of movement of the tool, at a first end along the direction of movement of the tool. The blade is tilted backward from the direction of movement of the tool in relation to a direction orthogonal to the direction of movement of the groove tool, as viewed from a bottom face of the blade tip part.
    Type: Application
    Filed: December 29, 2010
    Publication date: July 14, 2011
    Applicant: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Toshio AKAI, Keitaro OKAMOTO, Masanobu SOYAMA
  • Patent number: 7975589
    Abstract: A scribing wheel for a brittle material includes a circumferential ridgeline in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridgeline. The protrusion are portions of the ridgeline remaining after the ridgeline is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability.
    Type: Grant
    Filed: July 6, 2006
    Date of Patent: July 12, 2011
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Kazuya Maekawa, Haruo Wakayama
  • Patent number: 7975588
    Abstract: In a glass cutter wheel where a blade edge is formed on a disk-shaped wheel, grooves having a predetermined shape are formed at a predetermined pitch in a 1/4 or smaller or 3/4 or smaller blade edge line portion of the entire perimeter of the blade edge. The ratio of the groove portion to the entire perimeter, which largely contributes to a scribing characteristic, is changed such that a desired scribing characteristic can be obtained.
    Type: Grant
    Filed: March 17, 2009
    Date of Patent: July 12, 2011
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Kiyoshi Takamatsu, Kazuya Maekawa, Noriyuki Ogasawara
  • Publication number: 20110113945
    Abstract: A scribing wheel for a brittle material includes a circumferential ridge line in which two truncated cones have connected bottoms so as to share a rotational axis. Alternating notches and protrusions are formed along the circumference ridge line. The protrusion are portions of the ridge line remaining after the ridge line is notched. The length of the notches is less than that of the protrusions so that a catch on the surface is improved while lowering the high penetrability.
    Type: Application
    Filed: January 19, 2011
    Publication date: May 19, 2011
    Applicant: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventors: Kazuya Maekawa, Haruo Wakayama
  • Publication number: 20110107894
    Abstract: [Issue] A chamfering method is provided that can be conducted even in small worksite space without using grinding members and without requiring a cleaning process after a chamfering process. [Resolution Means] A brittle material substrate chamfering method according to the present invention includes steps of drawing a scribing line, and heating and/or cooling a part in proximity to the scribing line. The scribing line is drawn on a part of a surface of a brittle material substrate that extends along the edge of the brittle material substrate and has a width not more than 50% of the thickness of the brittle material substrate starting from the edge of the brittle material substrate whereby forming a crack inclined from the surface of the substrate toward a side end surface of the substrate. A part in proximity to the scribing line is heated and/or cooled so that a corner part of the edge of said brittle material substrate is cut out whereby chamfering said brittle material substrate.
    Type: Application
    Filed: April 27, 2009
    Publication date: May 12, 2011
    Applicant: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD
    Inventors: Kazuya Maekawa, Ryota Sakaguchi, Tomoki Nakagaki
  • Patent number: 7931755
    Abstract: In a method for removing deposit that has attached to a main surface of a substrate from the main surface of the substrate using air knife units where a slit portion is formed so that a fluid can be discharged in band form, a fluid introduction path having an approximately uniform form in the direction perpendicular to the direction in which a number of air knife units move relative to the substrate is formed between the air knife units and the main surface of the substrate while the air knife units move relative to the substrate, a fluid is discharged toward the fluid introduction path from a slit that is formed in the rear portion of the above described air knife units, and then, passes through the fluid introduction path so as to be led to a wall surface that is formed so as to face the front portion of the air knife units or the fluid which has the appearance of a wall surface, and furthermore, deposit on the substrate that has attached to the substrate is led away from the main surface of the substrate,
    Type: Grant
    Filed: December 16, 2004
    Date of Patent: April 26, 2011
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd
    Inventors: Yoshitaka Nishio, Yukio Oshima
  • Publication number: 20100326138
    Abstract: A processing device is configured to irradiate a laser beam onto a glass substrate for processing. The processing device has a work table, a laser beam output section, a multi-spot focus section, a rotation drive mechanism, an optical system, and a laser beam scan section. The multi-spot focus section receives a laser beam, and splits and focuses the laser beam inputted therein into a plurality of beam focus spots. The rotation drive mechanism rotates the plurality of beam focus spots about a single center axis that is arranged in a center of the plurality of beam focus spots. The optical system guides the laser beam to the multi-spot focus section. The laser beam scan section moves all the plurality of beam focus spots rotating about the single center axis in a desired direction within a predetermined range of a plane arranged along a surface of the glass substrate.
    Type: Application
    Filed: June 30, 2010
    Publication date: December 30, 2010
    Applicant: MITSUBOSHI DIAMOND INDUSTRIAL CO., LTD.
    Inventors: Issei KUMATANI, Seiji SHIMIZU
  • Patent number: D675652
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: February 5, 2013
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventor: Masanobu Soyama
  • Patent number: D675653
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: February 5, 2013
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventor: Masanobu Soyama
  • Patent number: D678924
    Type: Grant
    Filed: October 28, 2010
    Date of Patent: March 26, 2013
    Assignee: Mitsuboshi Diamond Industrial Co., Ltd.
    Inventor: Masanobu Soyama