Abstract: A method for manufacturing a laminated iron core by press punching a thin strip material to manufacture a motor core, comprising, before punching out a scrap 10 of an iron core piece 11 for the motor core, forming a plurality of partition holes 15 in the scrap 10 to divide the scrap 10 into areas 20, each of the partition holes 15 being connected at one end thereof with a peripheral portion 14 of the scrap 10 through a first connecting portion 17. The method further comprises forming a central hole 12, which is connected with the partition holes 15 through second connecting portions 18, at a central portion of the scrap 10. Accordingly, provided are the method for manufacturing a laminated iron core without causing scrap pulling when punching out and laminating the thin iron core pieces 11 and the shape of the scraps formed thereby.

Abstract: A rotor core of a rotating electrical machine formed by stacking a plurality of blanks blanked from a steel sheet, the blank having a yoke, a magnetic pole portion confronting the yoke, and a magnet insertion hole positioned between the yoke and the magnetic pole portion, the magnetic pole portion having a projection projecting circumferentially at two circumferential sides thereof.

Abstract: A method of manufacturing semiconductor devices. The method includes the steps of: providing a lead frame assembly having oppositely facing first and second sides; mounting a first semiconductor chip on the first side of the lead frame assembly; mounting a second semiconductor chip on the second side of the lead frame assembly; electrically connecting the first semiconductor chip to a first lead on the lead frame assembly; electrically connecting the second semiconductor chip to a second lead on the lead frame assembly; applying sealing resin to the first and second sides of the lead frame assembly with the first and second semiconductor chips mounted thereon; and after applying sealing resin, separating the lead frame assembly into first and second semiconductor devices. The first semiconductor device consists of a first portion of the lead frame assembly, the first semiconductor chip thereon, and the first lead electrically connected to the first semiconductor chip.

Abstract: A method of manufacturing a semiconductor device. The method includes the steps of: providing a lead frame assembly with joined first and second unit lead frames, with the first unit lead frame having a first support and a plurality of leads and the second unit lead frame having a second support and a plurality of leads; mounting operating components on the first and second unit lead frames; applying a sealing composition over the lead frame assembly and the operating components to define a semiconductor preassembly; cutting the semiconductor preassembly so as to define first and second semiconductor devices, with the first and second semiconductor devices having first and second exposed edges respectively defined by cutting of the semiconductor preassembly; and moving at least the first semiconductor device against another element to break loose flash on the first exposed edge.

Abstract: A semiconductor device having a unit lead frame defining a support with a peripheral edge and a first lead spaced from the peripheral edge. The first lead has a recess formed therein. A semiconductor chip is provided on the support. A conductive element electrically connects between the semiconductor chip and the first lead. The resin layer on the semiconductor chip and the first lead extends into the recess. The invention is also directed to a unit lead frame that is part of the semiconductor device, a lead frame incorporating a plurality of unit lead frames, and a method of manufacturing semiconductor devices.

Abstract: A semiconductor device having oppositely facing first and second sides. The semiconductor device has a support exposed at the first side of the semiconductor device, a semiconductor device mounted on the support, and a plurality of leads connected to the semiconductor device. A lead identifier on the support is visible at the first side of the semiconductor device, and assists identification of a specific lead in the plurality of leads.

Abstract: A particulate object conveying apparatus for conveying particulate objects of indefinite shape, e.g., particulate polycrystalline silicon, one by one, comprises: a stagnating portion for stagnating particulate objects; a rotor having a plural number of grooves formed in and equidistantly arrayed on its outer circumference surface, when ascending, the grooves passing the stagnating portion; and object driving-out means for driving the particulate object out of each groove of the rotor.

Abstract: A particulate object conveying device is provided, and the conveying device includes a stagnating portion. A rotor has an outer circumference having a plurality of grooves formed equidistantly about the outer circumference, the grooves being of a size and shape to hold a single one of the particles of predetermined size. The rotor rotates within the stagnating portion. A discharge path is provided for discharging the particles from the rotor.

Abstract: A spherical object transport apparatus of the invention brings a spiral stream into contact with a first atmosphere containing a spherical object, selectively sucks the first atmosphere outward so as to engulf in the spiral stream for diffusing the first atmosphere outward, guides the spherical object so that the spherical object passes through the center of the transport apparatus, supplies a second atmosphere to the spherical object, and sends the spherical object together with the second atmosphere to the following step.

Abstract: The present invention relates to a device for conveying spherical articles at high speed between sequential processes having different protective atmospheres, where the leakage of the atmospheres, which must be converted between the sequential processes, is prevented. The device includes a structure incorporating a rotary relay having a plurality of spherical-article accommodating chambers formed at predetermined intervals, a support container closely mounted on the rotary relay, and having a spherical-article receiving passage and a discharge passage. An atmosphere discharge pipe communicates with the spherical-article accommodating chambers of the rotary relay, and an atmosphere supply pipe is disposed adjacent to the spherical-article discharge portion of the rotary relay and communicates with the accommodating chambers.

Abstract: A spherical body grinding and polishing apparatus comprises: a rotary shaft having a spiral path groove in the outer cylindrical surface along which spherical bodies to be processed are moved, the rotary shaft being vertically movable and rotatable; and a housing having grinding and polishing surfaces on which the spherical surfaces of the spherical bodies moving along the path groove are slid. When spherical bodies such as silicon spherical bodies are supplied to the apparatus, the spherical bodies are rolled and moved along the spiral path groove formed in the outer cylindrical surface of the rotary shaft while sliding on the inner surface of the housing, so that the outer surfaces of the spherical bodies are ground and polished until the spherical bodies become high in sphericity.

Abstract: It is an object of the present invention to provide a novel carrying apparatus for carrying spherical objects such as spherical semiconductors of silicon in which the spherical objects are not contacted with an inner surface of a pipe-shaped body while they are being carried in the pipe-shaped body. The carrying apparatus for carrying spherical objects is provided with a spiral current generating means for generating a spiral current of fluid, and the spiral current generated by the spiral current generating means is introduced into a passage of the spherical objects. The spiral current generating means includes a rotary shaft 3 in which a carrying passage 2 is formed in a direction of the central axis and a spiral groove 3b is formed at a predetermined position on the outer circumferential surface. Further, in the rotary shaft 3, a jet pipe 3a connecting the carrying passage 2 with the spiral groove 3b is formed.

Abstract: A apparatus for carrying spherical objects is adopted, which comprises: a housing 1; a cylindrical rotor 6 arranged in the housing, including a plurality of recess grooves 11 which are open to the outer circumferential surface, the plurality of recess grooves being arranged radially from the center of the rotor 6; a guide ring arranged in the housing, the guide ring 3 including an inner hole 5, the section of which is elliptical, in which the cylindrical rotor 6 is accommodated; a vane 12 slidably arranged in each recess groove 11; a first carrier atmosphere feeding pipe 16 connected with a converting section of the guide ring 3 in which the inner hole 5 is changed from a small diameter section to a large diameter section; a first carrier atmosphere discharging pipe 17 connected with a converting section of the guide ring 3 in which the inner hole 5 is changed from a large diameter section to a small diameter section; a second carrier atmosphere feeding pipe 18 connected with a converting section of the guide

Abstract: A spherical article conveying atmosphere replacing device includes a recovering chamber which a recovering pipe penetrates; a pressure reducing device (or recovering pump) for making the inside of the recovering chamber negative in pressure; a sending chamber which a sending pipe penetrates which is coupled to the recovering pipe; and a pressurizing device (or sending pump) for making the inside of the sending chamber positive in pressure, so that the atmosphere for the spherical single crystal silicon conveyed in the recovering pipe is recovered in the recovering chamber with high efficiency which is negative in pressure, and in the sending chamber the spherical single crystal silicon in the sending pipe are accelerated.

Abstract: A lead frame and a method of forming the same for a semiconductor device includes a pad section (20a) and a lead section (20b) which are formed separately. The former comprises a die pad (21) upon which a semiconductor element is to be mounted, and a pair of support bars (26) extending outwardly from opposite side edges thereof. The lead section (20b) includes frame members (25), outer leads (24), inner leads (22), and tie bars (23) interconnecting the outer and inner leads together in an integral manner.

Abstract: In a lead frame for a semiconductor device, inner leads are formed by etching and outer leads are formed by pressing.