Abstract: The present invention provides a heat-resistant and low-electric-resistance aluminum alloy thin film which, even after heat treatment at 300-400° C., exhibits no hillock generation and has a specific resistance of 7 &mgr;&OHgr;·cm or less and also provides a sputtering target material employed for forming such aluminum alloy thin film. The thin film of aluminum alloy of the present invention contains, as components of the alloy, aluminum, carbon, and magnesium, wherein the carbon content and the magnesium content fall within a region defined by the following formulas: X=0.61; X=8; Y=2; and Y=−0.13X+1.3, wherein Y (at %) represents the carbon content by atomic percent and X (at %) represents the magnesium content by atomic percent, and the balance of (X+Y) contains aluminum and unavoidable impurities.

Abstract: A flow rate sensor for performing a flow rate detection of fluid with high accuracy without suffering adverse effect of the environmental temperature condition even when the fluid is viscous fluid having relatively high viscosity or the flow rate is relatively small is provided. The flow rate sensor includes a flow rate detector having a heating function and a temperature sensing function, and a pipe line for fluid to be detected which is formed so that heat from the flow rate detector is transferred to and absorbed by the fluid. The temperature sensing which is affected by a heat absorption effect of the fluid due to the heat is executed in the flow rate detector, and the flow rate of the fluid in the pipe line is detected on the basis of the temperature sensing result. Unit retaining portions formed on a casing in which the pipe line is formed, the unit retaining portions being disposed adjacent to the pipe line.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss of peel strength in resistance against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in brass-plated anti-corrosive copper foil. The Another object is to impart excellent moisture resistance to the surface-treated copper foil.

Abstract: There is provided a cerium-based abrasive which enables formation of a highly accurate polished surface and has improved grindability. There is also provided a method of evaluating cerium-based abrasives in a relatively easy manner. In order to achieve the above objects, the cerium-based abrasive of this invention is a cerium-based abrasive containing 40% by weight or more of cerium oxide (on the basis of the total weight of rare earth oxides) which is characterized by further containing 0.5 to 10% by weight of fluorine per 100% by weight of the cerium-based abrasive, in terms of atomic weight, and polishing particles consisting of crystals with a lattice constant measured by an X-ray powder diffraction method ranging from 0.544 to 0.560 nm.

Abstract: Herein disclosed is surface-modified nickel fine powder in which a precursor of barium titanate having a perovskite structure and consisting of a reaction product of a soluble titanium-containing compound and a soluble barium-containing compound is adhered to the surface of individual nickel fine particles, wherein the fine powder shows X-ray diffraction peaks of nickel and is free of any peak of barium titanate having a perovskite structure in the X-ray diffraction pattern determined by the X-ray diffraction method, but the fine powder shows X-ray diffraction peaks of both nickel and barium titanate having a perovskite structure in the X-ray diffraction pattern after the fine powder is subjected to a heat-treatment at a temperature of not less than 400° C.

Abstract: This invention provides a copper foil for a printed wiring board, which comprises a copper foil, an alloy layer (A) comprising copper, zinc, tin and nickel which is formed on a surface of the copper foil, said surface to be brought into contact with a substrate for a printed wiring board, and a chromate layer which is formed on a surface of the alloy layer (A). The copper foil for a printed wiring board has the following features: even if a printed wiring board is produced using a long-term stored copper foil, the interface between the copper foil and the substrate is only slightly corroded with chemicals; even if the copper foil contacts a varnish containing an organic acid, e.g., a varnish for an acrylic resin, in the formation of a copper-clad laminate, the bond strength is sufficient.

Abstract: An object of the invention is to provide a surface-treated copper foil capable of consistently attaining a percent loss in peel strength against hydrochloric acid degradation of 10% or less as measured on a copper pattern prepared from the copper foil and having a line width of 0.2 mm, by bringing out the maximum effect of the silane coupling agent employed in zinc-plated or zinc-alloy-plated anti-corrosive copper foil. Another object is to impart excellent moisture resistance, heat resistance, and long-term storage stability to the surface-treated copper foil.

Abstract: The process for preparing spinel-type lithium manganate according to the present invention is constituted by a process to admix the electrolyzed manganese dioxide, which is obtained by neutralizing manganese dioxide precipitated by means of electrolysis with any of potassium hydroxide, potassium carbonate and lithium hydroxide, and a lithium material and a process to subject the resulting mixture to a sintering process.

Abstract: The present invention provides a stock material for cerium-based abrasives which can be sintered at a relatively low roasting temperature without causing abnormal growth of the particles. More concretely, the stock material for cerium-based abrasives is produced by calcinating the carbonate of rare earth at a given temperature level to partly convert it into the oxide of rare earth in such a way to produce the mixed stock material having a loss on ignition of 0.5 to 25% on a dry basis, determined by heating at 1000° C. for 1 hour.

Abstract: The present invention relates to an internal quality measuring apparatus for measuring an internal quality of an object, and the apparatus has a conveying device, a detecting device, a light projecting device, a light receiving device, an analyzing device and a pseudo-object member interposing device, and the analyzing device compares light received with a pseudo-object member, with reference data preliminarily stored, and correct a result of the analysis, based thereon.

Abstract: An object of the invention is to prevent dent faults generated during bonding of an outer copper foil layer onto an inner layer substrate having a through hole or a cavity serving as an interlayer electrical connection means such as an interstitial via hole (IVH) or a blind via hole (BVH).

Abstract: A composite material for use in making printed wiring boards comprising a carrier having releasable conductive fine particles on its surface. The composite is laminated to a substrate with the conductive fine particles facing the substrate and the carrier removed, leaving the surface of the conductive fine particles exposed. Printed wiring is formed using the conductive fine particles as its base, thus providing improved peel strength and permitting formation of fine wiring lines and spaces.

Abstract: A copper foil for use in making a printed wiring board and a copper clad laminate comprising the copper foil are herein disclosed and the copper foil is characterized in that a metal chromium layer is formed on at least one side of the copper foil by vapor deposition or characterized in that one side of the copper foil is supported by a carrier through a releasing layer and a metal chromium layer is formed on the other side of the foil by vapor deposition. The copper foil is excellent in the adhesion to various substrates (the peel strength between the substrate and the copper foil), moisture resistance, chemical resistance and heat resistance and therefore, the copper foil can suitably be used in the production of printed wiring boards.

Abstract: An object of the present invention is to provide a copper foil having excellent adhesion to an etching resist layer, without performing physical polishing such as buffing in pre-treatment of an etching process to form a circuit from the copper foil. To attain the object, in electroforming, a titanium material having a grain size number of 6.0 or more is employed as a copper deposition surface of the rotating drum cathode, and glue and/or gelatin is added in an amount of 0.2-20 mg/l to a copper sulfate solution, thereby producing a drum foil. An electrodeposited copper foil obtained from the drum foil, wherein 20% or more of the crystals present in a shiny side surface of the electrodeposited copper foil have a twin-crystal structure, is used for producing copper-clad laminates.

Abstract: To provide an electrodeposited copper foil with carrier, in which electrical connection holes such as through holes (PTH), interstitial via holes (IVH), and blind via holes (BVH) can be readily formed. The invention provides an electrodeposited copper foil with carrier comprising a carrier foil, an organic release interface layer formed on a surface of the carrier foil, and an electrodeposited copper foil layer deposited on the release interface layer, wherein copper microparticles are deposited on the surface of the carrier foil onto which the organic release interface layer and the electrodeposited copper layer are formed.

Abstract: The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has,,been subjected to nodular treatment and anti-corrosion treatment, wherein the anti-corrosion treatment includes forming a-zinc-copper-tin ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-adsorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

Abstract: A method for the production of a glass substrate for magnetic recording mediums comprises the steps of sandwiching an abrasion board for correction between upper and lower surface tables of a both side-polishing device for polishing the glass substrate, while these upper and lower surface tables are fitted to the polishing device, rotating the upper and lower surface tables in the opposite directions while supplying cooling water to thus polish the surface of these tables to a flatness of the table surface on the order of not more than 30 &mgr;m; then adhering abrasion cloths to the upper and lower surface tables, respectively; thereafter repeatedly polishing the surface of the glass substrate for magnetic recording mediums. The production method permits the efficient production of an excellent glass substrate for magnetic recording mediums.

Abstract: A valve seat (2) is formed by build-up cladding by irradiating a laser beam on a copper alloy powder (4) provided in the rim of a port (3) formed in an engine cylinder head (1). The copper alloy powder (4) consists of copper (Cu), 6-9 wt % nickel (Ni), 1-5 wt % silicon (Si), and 1-5 wt % of one of molybdenum (Mo), tungsten (W), tantalum (Ta), niobium (Nb) and vanadium (V). Due to this composition, the valve seat (2) has few microcracks and excellent abrasion resistance.

Abstract: The invention provides a surface-treated copper foil for producing printed wiring boards whose surface has been subjected to nodular treatment and anti-corrosion treatments, wherein the anti-corrosion treatment includes forming a zinc-copper-nickel ternary alloy anti-corrosive plating layer on a surface of the copper foil; forming an electrolytic chromate layer on the anti-corrosive plating layer; forming a silane-coupling-agent-absorbed layer on the electrolytic chromate layer; and drying the copper foil for 2-6 seconds such that the copper foil reaches 105° C.-200° C.

Abstract: A laminate film for mounting electronic devices includes a conductive layer and an insulating film which are bonded through thermocompression bonding. The coefficient of thermal expansion of the insulating film along the width direction thereof is substantially equal to or higher than that of the conductive layer along the width direction thereof.