Abstract: The process for preparing spinel-type lithium manganate according to the present invention is constituted by a process to admix the electrolyzed manganese dioxide, which is obtained by neutralizing manganese dioxide precipitated by means of electrolysis with any of potassium hydroxide, potassium carbonate and lithium hydroxide, and a lithium material and a process to subject the resulting mixture to a sintering process.

Abstract: One form of evaluation apparatus comprising a plurality of light sources vertically arranged by one side of a carrier line in width direction Y perpendicular to carrying direction X of the carrier line; and a light-receiving section arranged by an opposite side of the carrier line in the width direction Y perpendicular to the carrying direction X of the carrier line.

Abstract: Nickel powder herein disclosed is characterized in that it has an average particle size as determined through the observation by a scanning electron microscope (SEM) ranges from 0.1 to 1 &mgr;m and that the D5 0 value as determined by laser diffraction-scattering particle size distribution analysis and the average particle size as determined by SEM observation satisfy the following relation represented by Formula (1): 1≦[(D5 0 value)/(average particle size as determined by SEM observation)]≦1.8  (1) The nickel powder is highly dispersible in an organic vehicle during the preparation of a conductive paste because it has low agglomerate properties and it is in an approximately monodispersed condition and the nickel powder is particularly suitable in the preparation of a conductive paste for use in making a thin internal electrode of a multilayer ceramic capacitor, which is free of any projection, because of it sharp particle distribution.

Abstract: The composite nickel fine powder includes surface-oxidized nickel fine particles and at least one member selected from the group consisting of oxides and complex oxides of at least one metal element having an atomic number ranging from 12 to 56 or 82 and belonging to Group 2 to 14 of the Periodic Table on the surface of the surface-oxidized nickel fine particles.

Abstract: Method for producing a sputtering target with a lowered oxygen content by providing an alloy selected from the group consisting of NiFe, CoCrPt, CoCrPtB, CoPt, PtMn, FeAlSi, FeCo, and FeMn; adding an oxygen scavenger element to the molten alloy selected from the group consisting of Group 4A, 3B and 4B elements; melting the alloy and the oxygen scavenger; reacting the oxygen scavenger element with oxygen in the melt to reduce the oxygen content of the alloy to a level of not more than 50 ppm and achieving a residual oxygen scavenger element content of not more than 100 ppm.

Abstract: An aqueous nickel slurry of the present invention comprises water, nickel fine powder provided thereon with an insoluble inorganic oxide adhered to the surface of the individual nickel fine particles constituting the fine powder, polyacrylic acid or an ester or salt thereof and at least one member selected from the group consisting of ammonium hydroxides substituted with organic substituents and hydroxyl group-containing amine compounds. The aqueous nickel slurry comprises nickel fine powder stably dispersed in the slurry in a high concentration without causing any re-agglomeration and can be used as a conductive paste for firing, in particular, a conductive paste for use in making a multilayer ceramic capacitor. The aqueous nickel slurry comprising nickel fine powder stably dispersed in the slurry in a high concentration without causing any re-agglomeration is prepared by the method of the present invention.

Abstract: A method for recovering a valuable metal including the steps of: recovering valuables from scraps containing the valuable metal; and removing at least part of carbon contained in the recovered valuables by heating the valuables in a non-oxidizable atmosphere, and a method for recovering a valuable metal including the steps of: thermally treating a melted mixture including the valuable metal and slag with a flux component to separate the valuable metal in a liquid phase from the slag in another liquid phase. In accordance with the present invention, the valuable metal in the scrap can be easily recovered.

Abstract: The present invention relates to nickel powder characterized in that the rate of the nickel particles whose particle size is not less than 1.2 time the average particle size as determined by the observation with an SEM is not more than 5% of the total number of nickel particles, that the rate of nickel particles whose particle size is not more than 0.8 time the average particle size is not more than 5% of the total number of nickel particles and that the tap density of the nickel powder is not less than 2.5 g/cm3, as well as a conductive paste for use in making a multilayer ceramic capacitor. The nickel powder of the present invention has a narrow particle size distribution and an excellent packing ability in a conductive paste and is particularly suitably used for forming a thin and uniform inner electrode for a multilayer ceramic capacitor, without being accompanied by the formation of any crack and/or the generation of any delamination.

Abstract: The object of the present invention is to provide a copper clad laminate with a copper-plated circuit layer, and a method for manufacturing a printed wiring board that excels the conventional ones in the aspect ratio of a circuit pattern when processed to a printed wiring board comprising a fine-pitch circuit. The object of the present invention is achieved by manufacturing a printed wiring board with the use of a copper clad laminate with a copper-plated circuit layer characterized by a copper-plated circuit layer and an outer-layer copper foil layer that satisfied the relationship in a case where a specific etchant is used, the R v value (Vsc/Vsp), which is the ratio of the dissolution rate (Vsp) of deposited copper that constitutes said copper-plated circuit layer to the dissolution rate (Vsc) of copper that constitutes said outer-layer copper foil layer, is 1.0 or more.

Abstract: The present invention provides an electrodeposited copper foil which solves problems of electrodeposited-copper-clad laminates to which the foil has been incorporated, such as bow, twist, and poor dimensional stability, and a method of inspecting an electrodeposited copper foil so as to assure the quality of the foil. In the invention, there is employed an electrodeposited copper foil which recrystallizes by heating at low temperature during production of a copper-clad laminate employing an electrodeposited copper foil and which exhibits an elongation as high as 18% or more in an atmosphere of 180° C., wherein the maximum rate of decrease in maximum tensile strength falls within the aging time ranging from 5 to 10 minutes in a process in which tensile strength decreases as time elapses during aging in an atmosphere at 170° C., and the change in tensile strength in a knick portion shown in a {tensile strength} vs.

Abstract: To provide a copper foil roll, which is a final product form of copper foil, in which wrinkles generating in the vicinity of a core tube of the copper foil roll are restrained to the utmost, and a better winding balance is provided. A method for winding copper foil on a core tube, in which the copper foil is spliced to a core tube with use of a pressure-sensitive double-sided adhesive coated tape with releasing paper and is wound into a roll form.

Abstract: A process for producing an electrodeposited copper foil with its surface prepared, comprising the steps of: subjecting an electrodeposited copper foil having a shiny side and a matte side whose average surface roughness (Rz) is in the range of 2.5 to 10 &mgr;m to at least one mechanical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 1.5 to 3.0 &mgr;m; and subjecting the matte side having undergone the mechanical polishing to a selective chemical polishing so that the average surface roughness (Rz) of the matte side becomes in the range of 0.8 to 2.5 &mgr;m. The invention further provides an electrodeposited copper foil with its surface prepared, produced by the above process, and still further provides PWBs and a multilayer laminate of PWBs, produced with the use of the above electrodeposited copper foil with its surface prepared.

Abstract: The promoter includes (A) particulate aluminum oxide and (B) a double oxide of (i) cerium and (ii) at least one member selected from the group consisting of zirconium, yttrium, strontium, barium and rare earth elements, supported on the particulate aluminum oxide. A solution of (i) a water-soluble salt of cerium and (ii) a water-soluble salt of at least one member selected from the group consisting of zirconium, yttrium, strontium, barium and rare earth elements is formed. Particulate aluminum oxide is added to the solution to form a dispersion. An aqueous solution of ammonium hydrogen carbonate is added to the dispersion to obtain particulate aluminum oxide coated with a reaction product. The particulate aluminum oxide coated with the reaction product is fired. Alternatively, an aqueous solution containing (i) the water-soluble salt of cerium and (ii) the water-soluble salt of the at least one member dissolved therein is adhered onto particulate aluminum oxide.

Abstract: A method for die-casting a magnesium alloy comprises the step of casting a die cast product free of any hot tearing, shrinkage tearing and shrinkage cavity starting from a magnesium alloy comprising i) 1 to 10% by weight of aluminum; ii) at least one member selected from the group consisting of 0.2 to 5% by weight of a rare earth metal, 0.02 to 5% by weight of calcium and 0.2 to 10% by weight of silicon; and iii) not more than 1.5% by weight of manganese, and the balance of magnesium and inevitable impurities, using a cold chamber type die-casting machine, wherein a) the temperature of the molten magnesium alloy is maintained at 650 to 750°C.; b) the charging velocity of the molten metal is set at {fraction (1/100)} to {fraction (10/100)} second; and c) the intensified pressure after the charging is set at a level of not less than 200 kgf/cm2.

Abstract: A metallic mold-casting method excellent in the resistance to penetration is herein disclosed and the method comprises the steps of forming a coating layer by applying a mixture comprising at least one member selected from the group consisting of high melting metals, ceramic materials and graphite, and an aqueous surfactant solution or low boiling liquid oils and fats to at least part of the surface of a metallic mold on its cavity side, then applying heat to the coated portion to thus adhere the mixture to the inner surface of the mold, and thereafter repeatedly casting a magnesium alloy in the metallic mold provided with the coating layer. The metallic mold-casting method permits the metallic mold casting of magnesium alloys with good resistance to penetration and this accordingly leads to the production of a cheap and high quality cast magnesium alloy product.

Abstract: A process comprises a separating process to mechanically separate refuse secondary batteries and to separate them into a separated cathode material and a separated anode material, and a process to recover valent metals from the separated anode and the separated cathode material separated in the separating process is disclosed.

Abstract: A process for producing an electrodeposited copper foil, comprising electrodepositing a copper foil from an electrolyte containing copper sulfate dissolved therein, in which said electrolyte contains a small amount of lead (Pb) ions, which comprises adding a salt of a metal of Group IIA of the periodic table to the electrolyte in an amount of 10 to 150 mols per mol of lead (Pb) ions contained in the electrolyte so that the lead (Pb) ions contained in the electrolyte react with the metal of Group IIA of the periodic table to thereby form an insoluble composite substance to precipitate, the insoluble composite substance followed by removing it from the electrolyte and forming an electrodeposited copper foil in the electrolyte having the lead (Pb) ions removed therefrom.

Abstract: The present invention provides a resin applied-copper foil, which is free of halogen elements, having high flame retardancy, excellent water resistance, heat resistance, and good peeling strength between a base material and copper foil. To provide the a resin compound used for fabricating an interlayer dielectric of a printed wiring board, the resin compound comprises an epoxy-based resin which includes: an epoxy resin curing agent having 5 to 25% by weight of nitrogen; and maleimide compounds having thermosetting properties, and the resin compound furthrt has composition which is free of halogen elements.

Abstract: It is an object to provide a manufacturing process for a printed wiring board in which a copper foil and resin as a substrate material of a copper clad laminate are irradiated with carbon dioxide gas laser light to drill in both of them simultaneously. In forming a through hole or a hole such as IVH, BVH or the like in the copper clad laminate using carbon dioxide gas laser light, one of a nickel layer of 0.08 to 2 &mgr;m in thickness, a cobalt layer of 0.05 to 3 &mgr;m in thickness and a zinc layer of 0.03 to 2 &mgr;m in thickness is formed as an additional metal layer on a surface of the copper foil residing in an external layer of the copper clad laminate and thereafter, by performing laser drilling, the copper foil layer and the resin layer as a substrate material of the copper clad laminate are enabled to drill simultaneously.

Abstract: This invention aims at providing metal foil and an etching process which can overcome the problem exists on the conventional semi-additive process for producing printed wiring boards, the problem being such that not only the copper foil layer but also the plating copper layer formed on a metal clad laminate is etched and thereby the edge portion of the circuit is attacked during the flash etching carried out in the final step of the production process. In light of the above problem, the metal foil and the metal foil with carrier foil of this invention are characterized in that a nickel or tin layer 0.5 to 3 &mgr;m thick can be formed on the external surface of the metal clad laminate.