Abstract: A printed wiring board manufacturing process comprises forming a conductive metal layer on at least one surface of an insulating film with a sputtered metal layer in between, selectively etching the conductive metal layer and the sputtered metal layer to produce a wiring pattern, treating the laminated film with a first treatment liquid capable of dissolving nickel of the sputtered metal layer, and treating with a second treatment liquid capable of dissolving chrome of the sputtered metal layer and also capable of eliminating the sputtered metal layer in the insulating film to remove a superficial surface of the insulating film exposed from the wiring pattern together with the residual sputtered metals in the superficial surface. A printed wiring board comprises an insulating film and a wiring pattern, wherein the insulating film in an area exposed from the wiring pattern has a thickness smaller by 1 to 100 nm than that of an area under the wiring pattern.

Abstract: A flexible polyurethane foam produced by contacting the polyol composition (A) comprising a polyether polyol (an amine value: 400 to 600 mg KOH/g, a hydroxyl value: 350 to 700 mg KOH/g), which is the adduct of an alkylene oxide to a compound selected from following formulas (1) and (2), with an organic polyisocyanate in the presence of water wherein R1 and R2 represent H or (CH)n—NH2 (n: 1-3), R3-R6 and R7 represent H or an alkyl group or alkenyl group having 1 to 4 carbon atoms, and k and m represent 1 to 6. The flexible polyurethane foam exhibits sufficient physical properties and reduced volatile amine components. The flexible polyurethane foam can be used to provide excellent seat pads and sound absorbing materials for automobiles.

Abstract: This slide device comprises a first tension member connected to a distal end of an opening cable, a second tension member connected to a distal end of a closing cable, a lower roller bracket rotatable mounted on a sliding door, a first pin disposed at a front portion of a lower roller bracket, and a second pin disposed at a rear portion of the lower roller bracket. The front of the first tension member is rotatably connected to the first pin and the rear of the second tension member is rotatably connected to the second pin. The first tension member and the second tension member overlap with each other.

Abstract: A first judging unit integrates an increase in a corrected current when the corrected current is in a predetermined increasing state and judges that a first condition is satisfied when an integrated increase exceeds a threshold. A second judging unit integrates a decrease in door moving speed when the door moving speed is in a predetermined decreasing state and judges that a second condition is satisfied when an integrated decrease exceeds a threshold. A third judging unit integrates a decrease in motor rotation speed when the motor rotation speed is in a predetermined decreasing state and judges that a third condition is satisfied when an integrated decrease exceeds a threshold. A pinch judging unit judges whether pinch has occurred based on determination by the first, the second, and the third judging units.

Abstract: There are disclosed, a polyether ketone having a primary particle size of 50 ?m or less; and a method of producing a polyether ketone by a desalting polycondensation, which contains a step of conducting a polymerization reaction under a condition of deposition of the polymer. The polyether ketone obtained by the present invention has small particle size, high molecular weight and sufficiently small content of impurities such as alkali metal components.

Abstract: The object is to provide a method of manufacturing electrodeposited copper foil with a carrier foil for high-temperature heat-resistance in which the peeling of the carrier foil is easy even by press working at temperatures of not less than 200°C.

Abstract: [Solution means] A process for producing a printed wiring board comprises the steps of depositing a base metal on at least one surface of an insulating film to form a base metal layer and further depositing copper or a copper alloy to form a conductive metal layer, then removing a surface metal layer, which is formed through the above step, by etching to form a wiring pattern, and then treating the base metal layer with a treating liquid capable of dissolving and/or passivating the metal that forms the base metal layer. The printed wiring board so provided comprises an insulating film and a wiring pattern formed on at least one surface of the insulating film, the wiring pattern including a base metal layer deposited on the insulating film surface and a conductive metal layer, the base metal layer for forming the wiring pattern protrudes in a widthwise direction more than the conductive metal layer for forming the wiring pattern.

Abstract: An object of the present invention is to provide a multi-layered printed wiring board which does not require roughening such as black oxide treatment and the like on inner layer circuits. For the purpose of achieving this object, there is adopted a multi-layered printed wiring board characterized by comprising a primer resin layer P comprising exclusively a resin between each inner layer circuit Ci formed without roughening and an insulating resin layer 5 of the multi-layered printed wiring board.

Abstract: An object of the invention is to provide a flexible copper clad laminate and the like in use of electro-deposited copper foil having lower profile and higher mechanical strength compared with conventional low profile electro-deposited copper foil having been supplied in the market. For attaining the object, a flexible copper clad laminate manufactured by laminating the electro-deposited copper foil to resin film, which is characterized in that a deposition surface of the electro-deposited copper foil comprises a low profile glossy surface having surface roughness (Rzjis) of not more than 1.5 ?m and brightness (Gs (60°)) of not less than 400 and the deposition surface and the resin film are bonded together is adopted. And, using the flexible copper clad laminate, it may ease manufacture of a flexible printed wiring board as a film carrier tape, such as a COF tape and the like, wherein the formed wiring has a fine pitch wiring with pitch being not more than 35 ?m.

Abstract: The present invention provides a process for improving the moldability in the blow molding and efficiently producing a molded product, without deterioration of the physical properties of the molded product. The process comprises melting a mixture of a thermoplastic resin, and a polyolefin wax which has a number-average molecular weight (Mn) in terms of polyethylene, in the range of 200 to 5,000, and a crystallization temperature, as measured by a differential scanning calorimetry (DSC) in the range of 65 to 120° C., and then subjecting the mixture to blow molding.

Abstract: A one component resin composition curable with a combination of light and heat, which comprises (1) an epoxy resin, (2) an acrylic ester monomer and/or methacrylic ester monomer, or an oligomer thereof, (3) a latent epoxy curing agent, (4) a photo radical initiator, and (5) a compound having two or more thiol groups per molecule, wherein the ingredient (5) is contained in an amount of 0.001 to 5.0 parts by weight per 100 parts by weight of this resin composition. According to the present invention, a one component resin composition curable with a combination of light and heat, which has excellent curability especially in a light-shielded area can be provided. Also, a liquid crystal sealant composition curable with a combination of light and heat, which is applicable to the one-drop-fill method and has excellent curability in light-shielded areas and adhesion reliability, especially high-temperature and high-humidity adhesion reliability, can be provided.

Abstract: The present invention provides a process for producing a thermoplastic resin composition comprising a polyolefin wax having good dispersibility for a thermoplastic resin, a molded product, which is excellent in physical properties such as blocking property and mechanical properties, from the thermoplastic resin composition and a process for producing the molded product. Specifically, a process for producing a thermoplastic resin composition comprises melt-kneading a mixture of a polyolefin wax (A) which has a passing ratio through a mesh having a sieve opening of 5.66 mm? of 95% by weight or more, and a non-passing ratio through a mesh having a sieve opening of 2.00 mm? of 95% by weight or more, and is in the particle form, and a thermoplastic resin (B), a molded product, which is excellent in physical properties such as blocking property and mechanical properties, obtained from the thermoplastic resin composition and a process for producing the molded product are provided.

Abstract: The present invention provides a process for producing a thermoplastic resin composition having good dispersibility of a polyolefin wax for a thermoplastic resin under a stable production condition, a process for producing a molded product using the thermoplastic resin composition, and a molded product obtained from the thermoplastic resin composition. According to the present invention, a mixture of a wax masterbatch (A) containing a polyolefin wax and a thermoplastic resin, and a thermoplastic resin (B) is melt-kneaded to prepare the thermoplastic resin composition and the molded product.

Abstract: An ionic compound comprising a cationic portion having a hydroxyl group and/or a carboxylic acid group and an anionic portion of the formula (1): [BR4]???(1) wherein R may be the same or different and represents a phenyl group substituted with F or CF3. Preferably, the anionic portion is [B(C6F5)4]?, [B(C6H4CF3)4]? or [B(C6H3F2)4]?. In other aspects, a radiation polymerization initiator and a resin composition comprising the ionic compound are provided. A resin composition prepared by using the radiation polymerization initiator generates a small amount of outgas during reaction and has excellent reactivity and transparency.

Abstract: A door apparatus includes a door having a hole and configured to be slidable with respect to a vehicle body, a member configured to open and close the hole, a first detector configured to detect a position of the member relative to the hole to determine an openness of the hole, a second detector configured to detect a position of the door relative to the body, and a unit configured to be activated to project from one to another of the body and the door, so as to abut on the another such that the door is stopped from sliding in an opening direction, when the openness is greater than a threshold, and the position is between a full-closed position and a midway position.

Abstract: An object of the present invention is to provide a flexible printed wiring board, excellent in folding ability, obtained from a flexible copper-clad laminate using an electro-deposited copper foil. In order to achieve the object, there is provided a two-layer flexible printed wiring board having a wiring, formed by etching an electro-deposited copper foil, on a surface of a resin film layer, the wiring including only a steady-deposition crystal layer 2 formed by removing an initial-deposition crystal layer 1 formed at the time of the electro-deposited copper foil preparation. When the two-layer flexible printed wiring board has a cover film layer, preferably the deviation between the neutral line of the sectional thickness of the two-layer flexible printed wiring board and the central line of the wiring thickness of the two-layer flexible printed wiring board falls within 5% of the total thickness of the two-layer flexible printed wiring board.

Abstract: The crosslinkable rubber composition of the invention is crosslinkable by hot air, and a hot-air crosslinked rubber sheet thereof has no scratch on the surface in a hardness test using a pencil of HB and has a compression set of not more than 70% after a heat treatment at 150° C. for 22 hours. The rubber composition comprises an ethylene/?-olefin/non-conjugated polyene random copolymer rubber comprising a specific vinyl end group-containing norbornene compound, a SiH group-containing compound having at least two SiH groups in one molecule, and if necessary, an addition reaction catalyst comprising a platinum group element and a reaction inhibitor.

Abstract: An ethylene-based polymer which is an ethylene/C4 to C10 ?-olefin copolymer and satisfies the following requirements [k1] to [k3]: [k1] melt flow rate (MFR) under a loading of 2.16 kg at 190° C. is in the range of 1.0 to 50 g/10 minutes; [k2] LNR defined as a scale of neck-in upon film molding is in the range of 0.6 to 1.4; and [k3] take-up speed at break [DS (m/min)] at 160° C. and melt flow rate (MFR) satisfy the following relationship (Eq-1): 12×MFR0.577?DS?165×MFR0.577 (Eq-1), and a thermoplastic resin composition containing the ethylene-based polymer, provide a molded product, preferably a film, excellent in moldability and mechanical strength.

Abstract: An object of the present invention is to provide a silver powder which is an unprecedentedly fine particulate silver powder, has a dispersibility more approximate to monodispersibility resulting less aggregation, and has a low impurity content. To achieve the above object, a fine particulate silver powder having unprecedented powder properties in which: a. the average particle diameter DIA of the primary particles obtained by image analysis of a scanning electron micrograph is 0.6 ?m or less; b. the crystallite diameter is 10 nm or less; c. the sintering starting temperature is 240° C. or less; and d. the carbon content is 0.

Abstract: The present invention provides an injection molding process of a thermoplastic resin which is capable of preventing the burning of the resin and reducing the cooling time after injection. The process for producing an injection molded product comprises injection molding a mixture containing a thermoplastic resin and a polyolefin wax at a molding temperature lower than that of the mixture excluding the polyolefin wax by at least 5° C.